Reference Manual

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The maximum component case temperature must remain below the maximum,
measured at the devices shown in the figure below.
When attaching thermocouples, please follow the guidelines listed below:
 Carefully remove any labels or other foreign material from the component.
 Ensure an adhesive with high thermal conductivity is used. Use as little
adhesive as possible.
 Make sure the thermocouple is touching the case of the component and not
"floating" in the adhesive.
 The use of precision, fine-wire K-type thermocouples is strongly
recommended.
– Omega Engineering P/N 5TC-TT-K-36-72, or similar
recommendations management in applications with operating temperatures at the high end or beyond
the specified standard ambient temperature range.
 Providing air movement will improve heat dissipation.
 The host PCB plays a large part in dissipating the heat generated by the
module. A large copper plane located on the host ground PCB will improve the
heat dissipation capabilities of the PCB.
Measure Tcase of U22
Measure Tcase of U3