User Manual
Table Of Contents
- About the ConnectCore® 6UL
- Module specifications
- Assembly instructions
- Moisture sensitivity and shelf life
- Mounting
- Solder paste print
- Stencil
- Coplanarity
- SMT pick and place
- SMT process parameter reference - for both castellation and LGA applications
- Reflow profiles using a ten-zone oven, SAC 305 lead-free solder paste (Alpha ...
- Vapor Phase Profile Recommendation Using IBL 309 Batch Soldering Machine, SAC...
- Vapor Phase IBL 309 batch soldering machine settings
- Conformal coating
- Certifications
ConnectCore® 6UL Hardware Reference Manual 63
LGA
pad
ConnectCore
6UL pad
ConnectCore 6UL
signal name
i.MX6UL
pad name Multiplexing Power group Comments
B5 LGA_B5 MCA_IO2/EXT_
VREF
-
MCA GPIO
B6 LGA_B6 MCA_IO5
-
MCA GPIO/ADC
B7 LGA_B7 -
-
- - Reserved
B8 LGA_B8 NAND_CLE
NAND_CLE
ALT0: NAND_CLE
ALT1: USDHC1_
DATA7
ALT2: QSPI_A_
DATA03
ALT3: ECSPI3_MISO
ALT4: EIM_ADDR16
ALT5: GPIO4_IO15
ALT6:
ALT7:
ALT8: UART3_RTS_B
NVCC_NAND Leave this line floating if you want to
use the on-module NAND
B9 LGA_B9 NAND_ALE
NAND_ALE
ALT0: NAND_ALE
ALT1: USDHC2_
RESET_B
ALT2: QSPI_A_DQS
ALT3: PWM3_OUT
ALT4: EIM_ADDR17
ALT5: GPIO4_IO10
ALT6:
ALT7:
ALT8: ECSPI3_SS1
NVCC_NAND Leave this line floating if you want to
use the on-module NAND