User Manual
Table Of Contents
- About the ConnectCore® 6UL
- Module specifications
- Assembly instructions
- Moisture sensitivity and shelf life
- Mounting
- Solder paste print
- Stencil
- Coplanarity
- SMT pick and place
- SMT process parameter reference - for both castellation and LGA applications
- Reflow profiles using a ten-zone oven, SAC 305 lead-free solder paste (Alpha ...
- Vapor Phase Profile Recommendation Using IBL 309 Batch Soldering Machine, SAC...
- Vapor Phase IBL 309 batch soldering machine settings
- Conformal coating
- Certifications
ConnectCore® 6UL Hardware Reference Manual 67
LGA
pad
ConnectCore
6UL pad
ConnectCore 6UL
signal name
i.MX6UL
pad name Multiplexing Power group Comments
C8 LGA_C8 NAND_DATA2
NAND_
DATA02
ALT0: NAND_DATA02
ALT1: USDHC2_
DATA2
ALT2: QSPI_B_
DATA00
ALT3: KPP_ROW02
ALT4: EIM_AD10
ALT5: GPIO4_IO04
ALT6:
ALT7:
ALT8: ECSPI4_SS2
NVCC_NAND Leave this line floating if you want to
use the on-module NAND
C9 LGA_C9 NAND_RE#
NAND_RE_
B
ALT0: NAND_RE_B
ALT1: USDHC2_CLK
ALT2: QSPI_B_SCLK
ALT3: KPP_ROW00
ALT4: EIM_EB0_B
ALT5: GPIO4_IO00
ALT6:
ALT7:
ALT8: ECSPI3_SS2
NVCC_NAND Leave this line floating if you want to
use the on-module NAND
C10 LGA_C10 NAND_WP#
NAND_WP_
B
ALT0: NAND_WP_B
ALT1: USDHC1_
RESET_B
ALT2: QSPI_A_SCLK
ALT3: PWM4_OUT
ALT4: EIM_BCLK
ALT5: GPIO4_IO11
ALT6:
ALT7:
ALT8: ECSPI3_RDY
NVCC_NAND Leave this line floating if you want to
use the on-module NAND