User Manual
Table Of Contents
- About the ConnectCore® 6UL
- Module specifications
- Assembly instructions
- Moisture sensitivity and shelf life
- Mounting
- Solder paste print
- Stencil
- Coplanarity
- SMT pick and place
- SMT process parameter reference - for both castellation and LGA applications
- Reflow profiles using a ten-zone oven, SAC 305 lead-free solder paste (Alpha ...
- Vapor Phase Profile Recommendation Using IBL 309 Batch Soldering Machine, SAC...
- Vapor Phase IBL 309 batch soldering machine settings
- Conformal coating
- Certifications
ConnectCore® 6UL Hardware Reference Manual 75
LGA
pad
ConnectCore
6UL pad
ConnectCore 6UL
signal name
i.MX6UL
pad name Multiplexing Power group Comments
H2 LGA_H2 VSYS2
-
VSYS2 Power line
H3 LGA_H3 VSYS2
-
VSYS2 Power line
H19 LGA_H19 WLAN_SD1_
D7/GPIO1
-
VDDIO_GPIO0
H20 LGA_H20 BT_WAKEUP_HOST
-
VDDIO_GPIO2
H21
LGA_ H21
ENET1_TX_DATA1
ENET1_TX_
DATA1
ALT0: ENET1_
TDATA01
ALT1: UART6_CTS_B
ALT2: PWM5_OUT
ALT3: CSI_DATA20
ALT4: ENET2_MDIO
ALT5: GPIO2_IO04
ALT6: KPP_ROW02
ALT7:
ALT8: WDOG1_
WDOG_RST_B_DEB
NVCC_ENET
J1
LGA_ J1
GND
-
-
J2 LGA_J2 GND
-
-
J3 LGA_J3 VSYS2
-
VSYS2 Power line
J19 LGA_J19 WLAN_SD1_
D6/GPIO2
-
VDDIO_GPIO0
J20 LGA_J20 WLAN_SD1_
D5/GPIO3
-
VDDIO_GPIO0