User Manual
Table Of Contents
- About the ConnectCore® 6UL
- Module specifications
- Assembly instructions
- Moisture sensitivity and shelf life
- Mounting
- Solder paste print
- Stencil
- Coplanarity
- SMT pick and place
- SMT process parameter reference - for both castellation and LGA applications
- Reflow profiles using a ten-zone oven, SAC 305 lead-free solder paste (Alpha ...
- Vapor Phase Profile Recommendation Using IBL 309 Batch Soldering Machine, SAC...
- Vapor Phase IBL 309 batch soldering machine settings
- Conformal coating
- Certifications
ConnectCore® 6UL Hardware Reference Manual 83
LGA
pad
ConnectCore
6UL pad
ConnectCore 6UL
signal name
i.MX6UL
pad name Multiplexing Power group Comments
N2 LGA_N2 NAND_DATA5
NAND_
DATA05
ALT0: NAND_DATA05
ALT1: USDHC2_
DATA5
ALT2: QSPI_B_
DATA03
ALT3: ECSPI4_MOSI
ALT4: EIM_AD13
ALT5: GPIO4_IO07
ALT6:
ALT7:
ALT8: UART2_RX
NVCC_NAND Leave this line floating if you want to
use the on-module NAND
N3 LGA_N3 GND
-
-
N19 LGA_N19 LCD_DATA22
LCD_
DATA22
ALT0: LCDIF_DATA22
ALT1: MQS_RIGHT
ALT2: ECSPI1_MOSI
ALT3: CSI_DATA14
ALT4: EIM_DATA14
ALT5: GPIO3_IO27
ALT6: SRC_BT_
CFG30
ALT7:
ALT8: USDHC2_
DATA2
NVCC_LCD