User Manual
Table Of Contents
- About the ConnectCore® 6UL
- Module specifications
- Assembly instructions
- Moisture sensitivity and shelf life
- Mounting
- Solder paste print
- Stencil
- Coplanarity
- SMT pick and place
- SMT process parameter reference - for both castellation and LGA applications
- Reflow profiles using a ten-zone oven, SAC 305 lead-free solder paste (Alpha ...
- Vapor Phase Profile Recommendation Using IBL 309 Batch Soldering Machine, SAC...
- Vapor Phase IBL 309 batch soldering machine settings
- Conformal coating
- Certifications
ConnectCore® 6UL Hardware Reference Manual 86
LGA
pad
ConnectCore
6UL pad
ConnectCore 6UL
signal name
i.MX6UL
pad name Multiplexing Power group Comments
R1
LGA_ R1
CSI_MCLK
CSI_MCLK
ALT0: CSI_MCLK
ALT1: USDHC2_CD_
B
ALT2: NAND_CE2_B
ALT3: I2C1_SDA
ALT4: EIM_CS0_B
ALT5: GPIO4_IO17
ALT6: SNVS_HP_
VIO_5_CTL
ALT7:
ALT8: UART6_TX
NVCC_CSI
R2 LGA_R2 NAND_DATA6
NAND_
DATA06
ALT0: NAND_DATA06
ALT1: USDHC2_
DATA6
ALT2: SAI2_RX_BCLK
ALT3: ECSPI4_MISO
ALT4: EIM_AD14
ALT5: GPIO4_IO08
ALT6:
ALT7:
ALT8: UART2_CTS_B
NVCC_NAND Leave this line floating if you want to
use the on-module NAND
R3 LGA_R3 GND
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