Datasheet

Data Sheet SSM2518
Rev. A | Page 47 of 48
PACKAGING AND ORDERING INFORMATION
OUTLINE DIMENSIONS
05-19-2011-A
A
B
C
D
0.660
0.600
0.540
SIDE VIEW
0.270
0.240
0.210
0.360
0.320
0.280
COPLANARITY
0.05
SEATING
PLANE
1
2
3
4
BOTTOM VIEW
(BALL SIDE UP)
TOP VIEW
(BALL SIDE DOWN)
BALL 1
IDENTIFIER
0.50
REF
1.50
REF
2.250
2.210 SQ
2.170
Figure 37.16-Ball Wafer Level Chip Scale Package [WLCSP]
(CB-16-13)
Dimensions shown in millimeters
0.50
BSC
0.50
0.40
0.30
0.30
0.25
0.20
COMPLIANT TO JEDEC STANDARDS MO-220-WGGD.
061609-B
BOTTOM VIEWTOP VIEW
EXPOSED
PAD
P
I
N
1
I
N
D
I
C
A
T
O
R
4.10
4.00 SQ
3.90
SEATING
PLANE
0.80
0.75
0.70
0.05 MAX
0.02 NOM
0.20 REF
0.25 MIN
COPLANARITY
0.08
PIN 1
INDICATOR
2.65
2.50 SQ
2.35
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
1
20
6
10
11
15
16
5
Figure 38. 20-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
4 mm × 4 mm Body, Very Very Thin Quad (CP-20-10)
Dimensions shown in millimeters