Datasheet

2009-2016 Microchip Technology Inc. DS60001156J-page 21
PIC32MX5XX/6XX/7XX
B8
V
SS
B33 TDO/RA5
B9
TMS/RA0 B34 OSC1/CLKI/RC12
B10
AERXD1/INT2/RE9
B35 No Connect (NC)
B11
AN4/C1IN-/CN6/RB4
B36 AETXCLK/SCL1/INT3/RA14
B12
V
SS
B37 RTCC/EMDIO/AEMDIO/IC1/RD8
B13
AN2/C2IN-/CN4/RB2
B38 SCK1/IC3/PMCS2/PMA15/RD10
B14
PGED1/AN0/CN2/RB0
B39 SDO1/OC1/INT0/RD0
B15
No Connect (NC) B40 SOSCO/T1CK/CN0/RC14
B16
PGED2/AN7/RB7 B41 V
SS
B17
V
REF
+/CV
REF
+/AERXD3/PMA6/RA10 B42 OC3/RD2
B18
AV
SS
B43 ETXD2/IC5/PMD12/RD12
B19
AN9/C2OUT/RB9
B44 OC5/PMWR/CN13/RD4
B20
AN11/ERXERR/AETXERR/PMA12/RB11
B45 ETXEN/PMD14/CN15/RD6
B21
V
DD
B46 V
SS
B22
AC1TX/SCK4/U5TX/U2RTS
/RF13 B47 No Connect (NC)
B23
AN12/ERXD0/AECRS/PMA11/RB12 B48 V
CAP
B24
AN14/ERXD2/AETXD3/PMALH/PMA1/RB14
B49 C1RX
(1)
/ETXD1/PMD11/RF0
B25
V
SS
B50 C2TX
(1)
/ETXERR/PMD9/RG1
B26
AETXD0/SS3
/U4RX/U1CTS/CN20/RD14 B51 TRCLK/RA6
B27
SDA5/SDI4/U2RX/PMA9/CN17/RF4
B52 PMD0/RE0
B28
No Connect (NC) B53 V
DD
B29
SCL3/SDO3/U1TX/RF8
B54 TRD2/RG14
B30
V
USB
3
V
3
B55 TRD0/RG13
B31
D+/RG2
B56 PMD3/RE3
TABLE 13: PIN NAMES FOR 124-PIN USB, ETHERNET, AND CAN DEVICES (CONTINUED)
Package
Bump #
Full Pin Name
Package
Bump #
Full Pin Name
Note 1:
This pin is only available on PIC32MX795F512L devices.
2:
Shaded package bumps are 5V tolerant.
3:
It is recommended that the user connect the printed circuit board (PCB) ground to the conductive thermal pad on the bottom of the
package. And to not run non-Vss PCB traces under the conductive thermal pad on the same side of the PCB layout.
A1
A68
A17
B29
B13
B41
B1
A34
A51
B56
124-PIN VTLA (BOTTOM VIEW)
(2,3)
Polarity Indicator
PIC32MX675F512L
PIC32MX695F512L
PIC32MX795F512L
Conductive
Thermal Pad