Datasheet

PIC32MX5XX/6XX/7XX
DS60001156J-page 352  2009-2016 Microchip Technology Inc.
32.1 DC Characteristics
TABLE 32-1: OPERATING MIPS VS. VOLTAGE
Characteristic
V
DD Range
(in Volts)
(1)
Temp. Range
(in °C)
Max. Frequency
PIC32MX5XX/6XX/7XX
DC5 2.3-3.6V -40°C to +85°C 80 MHz
DC5b 2.3-3.6V -40°C to +105°C 80 MHz
Note 1: Overall functional device operation at V
BORMIN < V DD < V DDMIN is tested, but not characterized. All device
Analog modules, such as ADC, etc., will function, but with degraded performance below V
DDMIN . Refer to
parameter BO10 in Table 32-10 for BOR values.
TABLE 32-2: THERMAL OPERATING CONDITIONS
Rating Symbol Min. Typical Max. Unit
Industrial Temperature Devices
Operating Junction Temperature Range T J -40 — +125 °C
Operating Ambient Temperature Range T A -40 — +85 °C
V-Temp Temperature Devices
Operating Junction Temperature Range T
J -40 — +140 °C
Operating Ambient Temperature Range T
A -40 — +105 °C
Power Dissipation:
Internal Chip Power Dissipation:
P INT = V DD x (I DD – S I OH )
P
D P INT + P I / O W
I/O Pin Power Dissipation:
I/O = S (({V
DD – V OH } x I OH ) + S (V OL x I OL ))
Maximum Allowed Power Dissipation P
DMAX (T J – T A )/ JA W
TABLE 32-3: THERMAL PACKAGING CHARACTERISTICS
Characteristics Symbol Typical Max. Unit
See
Note
Package Thermal Resistance, 121-Pin TFBGA (10x10x1.1 mm) 
JA 40 — °C/W 1
Package Thermal Resistance, 100-Pin TQFP (14x14x1 mm) 
JA 43 — °C/W 1
Package Thermal Resistance, 100-Pin TQFP (12x12x1 mm) 
JA 43 — °C/W 1
Package Thermal Resistance, 64-Pin TQFP (10x10x1 mm) 
JA 47 — °C/W 1
Package Thermal Resistance, 64-Pin QFN (9x9x0.9 mm)  JA 28 — °C/W 1
Package Thermal Resistance, 124-Pin VTLA (9x9x0.9 mm)  JA 21 — °C/W 1
Note 1: Junction to ambient thermal resistance, Theta-
JA ( JA ) numbers are achieved by package simulations.