Datasheet

SN74LVC1T45
www.ti.com SCES515K –DECEMBER 2003–REVISED DECEMBER 2014
Recommended Operating Conditions (continued)
See
(1)(2)(3)
V
CCI
V
CCO
MIN MAX UNIT
1.65 to 1.95 V V
CCA
× 0.65
2.3 to 2.7 V 1.7
High-level DIR
V
IH
V
input voltage (referenced to V
CCA
)
(5)
3 to 3.6 V 2
4.5 to 5.5 V V
CCA
× 0.7
1.65 to 1.95 V V
CCA
× 0.35
2.3 to 2.7 V 0.7
Low-level DIR
V
IL
V
input voltage (referenced to V
CCA
)
(5)
3 to 3.6 V 0.8
4.5 to 5.5 V V
CCA
× 0.3
V
I
Input voltage 0 5.5 V
V
O
Output voltage 0 V
CCO
V
1.65 to 1.95 V –4
2.3 to 2.7 V –8
I
OH
High-level output current mA
3 to 3.6 V –24
4.5 to 5.5 V –32
1.65 to 1.95 V 4
2.3 to 2.7 V 8
I
OL
Low-level output current mA
3 to 3.6 V 24
4.5 to 5.5 V 32
1.65 to 1.95 V 20
2.3 to 2.7 V 20
Data inputs
Input transition
Δt/Δv 3 to 3.6 V 10 ns/V
rise or fall rate
4.5 to 5.5 V 5
Control inputs 1.65 to 5.5 V 5
T
A
Operating free-air temperature –40 85 °C
(5) For V
CCI
values not specified in the data sheet, V
IH
min = V
CCA
× 0.7 V, V
IL
max = V
CCA
× 0.3 V.
7.4 Thermal Information
SN74LVC1T45
THERMAL METRIC
(1)
DBV DCK DRL YZP UNIT
6 PINS
R
θJA
Junction-to-ambient thermal resistance 200.1 286.8 223.7 131.0
R
θJC(top)
Junction-to-case (top) thermal resistance 144.5 93.9 88.7 1.3
R
θJB
Junction-to-board thermal resistance 45.7 95.5 58.4 22.6
°C/W
ψ
JT
Junction-to-top characterization parameter 36.2 1.9 5.9 5.2
ψ
JB
Junction-to-board characterization parameter 25.3 94.7 58.1 22.6
R
θJC(bot)
Junction-to-case (bottom) thermal resistance N/A N/A N/A N/A
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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