Information

High Accuracy, Galvanically Isolated Current Sensor IC
With Small Footprint SOIC8 Package
ACS722
21
Allegro MicroSystems, LLC
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
Figure 6: Package LC, 8-pin SOICN
C
1.27 BSC
A
B
B
C
21
8
Branding scale and appearance at supplier discretion
C
SEATING
PLANE
C0.10
8X
0.25 BSC
1.04 REF
1.75 MAX
1.75
4.90 ±0.10
3.90 ±0.10
6.00 ±0.20
0.51
0.31
0.25
0.10
0.25
0.17
1.27
0.40
8°
0°
A
Standard Branding Reference V
iew
21
1
8
C
0.65
1.27
5.60
Branded Face
For Reference Only – Not for Tooling Use
(Reference MS-012AA)
Dimensions in millimeters – NOT TO SCALE
Dimensions exclusive of mold flash, gate burrs, and dambar protrusions
Exact case and lead configuration at supplier discretion within limits shown
SEATING PLANE
GAUGE PLANE
PCB Layout Reference View
NNNNNNN
TPP-AAA
LLLLL
N = Device part number
T= Device temperature range
P= Package Designator
A=Amperage
L= Lot number
Belly Brand = Country of Origin
Terminal #1 mark area
Reference land pattern layout (reference IPC7351 SOIC127P600X175-8M);
all pads a minimum of 0.20 mm from all adjacent pads; adjust as necessary
to meet application process requirements and PCB layout tolerances
Package Outline Drawing