Datasheet

4
ADCS7476 , ADCS7477 , ADCS7478
SNAS192G –APRIL 2003–REVISED MAY 2016 www.ti.com
Product Folder Links: ADCS7476 ADCS7477 ADCS7478
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(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)(2)
MIN MAX UNIT
Supply voltage, V
DD
–0.3 6.5 V
Voltage on any analog pin to GND –0.3 V
DD
+ 0.3 V
Voltage on any digital pin to GND –0.3 6.5 V
Input current at any pin (except power supply pins) ±10 mA
Soldering temperature, infrared (10 sec) 215 °C
Operating temperature, T
A
150 °C
Storage temperature, T
stg
–65 150 °C
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.2 ESD Ratings
VALUE UNIT
V
(ESD)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001
(1)
±3500
V
Charged-device model (CDM), per JEDEC specification JESD22-C101
(2)
±200
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
V
DD
Supply voltage 2.7 5.25 V
Digital input pins voltage (independent of supply voltage) 2.7 5.25 V
T
A
Operating temperature –40 125 °C
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
6.4 Thermal Information
THERMAL METRIC
(1)
ADCS7476,
ADCS7477,
ADCS7478
UNIT
DBV (SOT-23)
6 PINS
R
θJA
Junction-to-ambient thermal resistance 184.5 °C/W
R
θJC(top)
Junction-to-case (top) thermal resistance 151.2 °C/W
R
θJB
Junction-to-board thermal resistance 29.7 °C/W
ψ
JT
Junction-to-top characterization parameter 29.8 °C/W
ψ
JB
Junction-to-board characterization parameter 29.1 °C/W