Datasheet

MP3V5010
Sensors
Freescale Semiconductor 11
Pressure
PACKAGE DIMENSIONS
CASE 1369-01
ISSUE O
SMALL OUTLINE PACKAGE
NOTES:
1.
2.
3.
4.
CONTROLLING DIMENSION: INCH.
INTERPRET DIMENSIONS AND TOLERANCES PER
ASME Y14.5M, 1994.
DIMENSIONS "D" AND "E1" DO NOT INCLUDE
MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.006 (0.152)
PER SIDE.
DIMENSION "b" DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.008 (0.203) MAXIMUM.
N
A
C
0.004 (0.1)
DETAIL G
SEATING
PLANE
8X
P
T
∅
D
E
e/2
e
A
M
0.004 (0.1) BC
E1
A
B
A0.008 (0.20) B
C
8X b
2 PLACES 4 TIPS
1
4
8
5
F
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A 0.300 0.330 7.11 7.62
A1 0.002 0.010 0.05 0.25
b 0.038 0.042 0.96 1.07
D 0.465 0.485 11.81 12.32
E
E1 0.465 0.485 11.81 12.32
e
M 0.270 0.290 6.86 7.36
N 0.080 0.090 2.03 2.28
P 0.009 0.011 0.23 0.28
T 0.115 0.125 2.92 3.17
0.100 BSC 2.54 BSC
F 0.245 0.255 6.22 6.47
K 0.120 0.130 3.05 3.30
L 0.061 0.071 1.55 1.80
0˚ 7˚ 0˚ 7˚
θ
0.717 BSC 18.21 BSC
K
M
GAGE
PLANE
DETAIL G
L
A1
θ
.014 (0.35)