Datasheet

MP3V5010
Sensors
6 Freescale Semiconductor
Pressure
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Freescale designates the two sides of the pressure sensor
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing fluoro silicone gel
which protects the die from harsh media. The pressure
sensor is designed to operate with positive differential
pressure applied, P1 > P2.
The Pressure (P1) side may be identified by using the
following table:
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total
design. The footprint for the surface mount packages must be
the correct size to ensure proper solder connection interface
between the board and the package. With the correct
footprint, the packages will self align when subjected to a
solder reflow process. It is always recommended to design
boards with a solder mask layer to avoid bridging and
shorting between solder pads.
Figure 5. Small Outline Package Footprint
Pressure Error Band
Pressure Error (Max)
0 to 10 (kPa) ±0.5 (kPa)
Pressure (kPa)
0.5
0.4
0.2
–0.3
–0.4
–0.5
0
100
0.3
0.1
–0.2
–0.1
Pressure
Error
(kPa)
Part Number Case Type
Pressure (P1)
Side Identifier
MP3V5010GC6U/C6T1 482A Side with Port Attached
MP3V5010GP 1369 Side with Port Attached
MP3V5010DP 1351 Side with Part Marking
MP3V5010GVP 1368 Side with Part Marking
0.660
16.76
0.060 TYP 8X
1.52
0.100 TYP 8X
2.54
0.100 TYP 8X
2.54
0.300
7.62
inch
mm
SCALE 2:1