Datasheet

Absolute Ratings and Operating Conditions
Stresses greater than those listed may cause permanent damage to the device. This is a
stress rating only. Exposure to absolute maximum rating for extended periods may ad-
versely affect reliability. Stressing the device beyond the absolute maximum ratings may
cause permanent damage.
Table 36: Absolute Ratings
Symbol Parameter Min Max Units Notes
T
STG
Storage temperature –65 150 °C
T
LEAD
Lead temperature during soldering – See note 1 °C
V
CC
Supply voltage –0.6 4.0 V
V
PP
Fast program/erase voltage –0.2 10 V
V
IO
Input/output voltage with respect to ground –0.6 V
CC
+ 0.6 V 3, 4
V
ESD
Electrostatic discharge voltage
(human body model)
–2000 2000 V 2
Notes:
1. Compliant with JEDEC Standard J-STD-020C (for small-body, Sn-Pb or Pb assembly),
RoHS, and the European directive on Restrictions on Hazardous Substances (RoHS)
2002/95/EU.
2. JEDEC Standard JESD22-A114A (C1 = 100pF, R1 = 1500Ω, R2 = 500Ω).
3. During signal transitions, minimum voltage may undershoot to –1V for periods less than
10ns.
4. During signal transitions, maximum voltage may overshoot to V
CC
+ 1V for periods less
than 10ns.
Table 37: Operating Conditions
Symbol Parameter Min Max Units
V
CC
Supply voltage 2.7 3.6 V
V
PPH
Supply voltage on V
PP
8.5 9.5 V
T
A
Ambient operating temperature –40 85 °C
Table 38: Input/Output Capacitance
Note 1 applies to entire table
Symbol Description Test Condition Min Max Units
C
IN/OUT
Input/output capacitance
(DQ0/DQ1/DQ2/DQ3)
V
OUT
= 0V – 8 pF
C
IN
Input capacitance (other pins) V
IN
= 0V – 6 pF
Note:
1. These parameters are sampled only, not 100% tested. T
A
= 25°C at 54 MHz.
3V, 256Mb: Multiple I/O Serial Flash Memory
Absolute Ratings and Operating Conditions
09005aef84566603
n25q_256mb_65nm.pdf - Rev. W 11/16 EN
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