Datasheet

Table 44: Package Details

Micron SPI and

JEDEC Package

Name

Shortened

Package

Name

Package

Description

M25P

M45PE

Symbol

N25Q

Symbol

M25P

M45PE Package

Names

Alternate

Package Name

V-PDFN-8/8mm x

6mm RP

DFN-8/8mm Very thin, plastic small-out-

line, 8 terminal pads (no

leads), 8mm x 6mm

ME F8 MLP8, VDFPN8 V-PSON1-8/8mm x

6mm, VSON

SOP2-16/300 mil SO16W Small-outline integrated cir-

cuit, 16-pin, wide (300 mil)

MF SF SO16W, SO16

wide 300 mil body

width

SOIC-16/300 mil,

SOP 16L 300 mil

T-PBGA-24b05/

6mm x 8mm

TBGA 24 Thin, plastic-ball grid array,

24-ball, 6mm x 8mm

ZM 12 TBGA24 6mm x

8mm

T-PBGA-24b05/6x8

3V, 256Mb: Multiple I/O Serial Flash Memory

Part Number Ordering Information

09005aef84566603

n25q_256mb_65nm.pdf - Rev. W 11/16 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.