User manual
Table Of Contents
- Zynq-7000 All Programmable SoC
- Table of Contents
- Ch. 1: Introduction
- Ch. 2: Signals, Interfaces, and Pins
- Ch. 3: Application Processing Unit
- Ch. 4: System Addresses
- Ch. 5: Interconnect
- Ch. 6: Boot and Configuration
- Ch. 7: Interrupts
- Ch. 8: Timers
- Ch. 9: DMA Controller
- Introduction
- Functional Description
- DMA Transfers on the AXI Interconnect
- AXI Transaction Considerations
- DMA Manager
- Multi-channel Data FIFO (MFIFO)
- Memory-to-Memory Transfers
- PL Peripheral AXI Transactions
- PL Peripheral Request Interface
- PL Peripheral - Length Managed by PL Peripheral
- PL Peripheral - Length Managed by DMAC
- Events and Interrupts
- Aborts
- Security
- IP Configuration Options
- Programming Guide for DMA Controller
- Programming Guide for DMA Engine
- Programming Restrictions
- System Functions
- I/O Interface
- Ch. 10: DDR Memory Controller
- Introduction
- AXI Memory Port Interface (DDRI)
- DDR Core and Transaction Scheduler (DDRC)
- DDRC Arbitration
- Controller PHY (DDRP)
- Initialization and Calibration
- DDR Clock Initialization
- DDR IOB Impedance Calibration
- DDR IOB Configuration
- DDR Controller Register Programming
- DRAM Reset and Initialization
- DRAM Input Impedance (ODT) Calibration
- DRAM Output Impedance (RON) Calibration
- DRAM Training
- Write Data Eye Adjustment
- Alternatives to Automatic DRAM Training
- DRAM Write Latency Restriction
- Register Overview
- Error Correction Code (ECC)
- Programming Model
- Ch. 11: Static Memory Controller
- Ch. 12: Quad-SPI Flash Controller
- Ch. 13: SD/SDIO Controller
- Ch. 14: General Purpose I/O (GPIO)
- Ch. 15: USB Host, Device, and OTG Controller
- Introduction
- Functional Description
- Programming Overview and Reference
- Device Mode Control
- Device Endpoint Data Structures
- Device Endpoint Packet Operational Model
- Device Endpoint Descriptor Reference
- Programming Guide for Device Controller
- Programming Guide for Device Endpoint Data Structures
- Host Mode Data Structures
- EHCI Implementation
- Host Data Structures Reference
- Programming Guide for Host Controller
- OTG Description and Reference
- System Functions
- I/O Interfaces
- Ch. 16: Gigabit Ethernet Controller
- Ch. 17: SPI Controller
- Ch. 18: CAN Controller
- Ch. 19: UART Controller
- Ch. 20: I2C Controller
- Ch. 21: Programmable Logic Description
- Ch. 22: Programmable Logic Design Guide
- Ch. 23: Programmable Logic Test and Debug
- Ch. 24: Power Management
- Ch. 25: Clocks
- Ch. 26: Reset System
- Ch. 27: JTAG and DAP Subsystem
- Ch. 28: System Test and Debug
- Ch. 29: On-Chip Memory (OCM)
- Ch. 30: XADC Interface
- Ch. 31: PCI Express
- Ch. 32: Device Secure Boot
- Appx. A: Additional Resources
- Appx. B: Register Details
- Overview
- Acronyms
- Module Summary
- AXI_HP Interface (AFI) (axi_hp)
- CAN Controller (can)
- DDR Memory Controller (ddrc)
- CoreSight Cross Trigger Interface (cti)
- Performance Monitor Unit (cortexa9_pmu)
- CoreSight Program Trace Macrocell (ptm)
- Debug Access Port (dap)
- CoreSight Embedded Trace Buffer (etb)
- PL Fabric Trace Monitor (ftm)
- CoreSight Trace Funnel (funnel)
- CoreSight Intstrumentation Trace Macrocell (itm)
- CoreSight Trace Packet Output (tpiu)
- Device Configuration Interface (devcfg)
- DMA Controller (dmac)
- Gigabit Ethernet Controller (GEM)
- General Purpose I/O (gpio)
- Interconnect QoS (qos301)
- NIC301 Address Region Control (nic301_addr_region_ctrl_registers)
- I2C Controller (IIC)
- L2 Cache (L2Cpl310)
- Application Processing Unit (mpcore)
- On-Chip Memory (ocm)
- Quad-SPI Flash Controller (qspi)
- SD Controller (sdio)
- System Level Control Registers (slcr)
- Static Memory Controller (pl353)
- SPI Controller (SPI)
- System Watchdog Timer (swdt)
- Triple Timer Counter (ttc)
- UART Controller (UART)
- USB Controller (usb)

Zynq-7000 AP SoC Technical Reference Manual www.xilinx.com 307
UG585 (v1.11) September 27, 2016
Chapter 10: DDR Memory Controller
10.4.10 Credit Mechanism
The DRAM controller employs a credit mechanism to ensure that buffers do not overflow (pending
DDR transactions). The interface making the request to the controller can only request commands
for which it has been granted credits or open slots in the queues to issue.
Credits are tracked separately for the following three command types:
• High priority reads
• Low priority reads
•Writes
Credits are counted for each command type independently according to the following rules:
• Initially the interface has zero credits.
• Following the de-assertion of reset to the DRAM controller, credits are issued to the interface
for each command type. A given credit count increments every time a credit is issued by the
DRAM controller, indicated by the assertion of the appropriate *_credit signal on the rising edge
of the clock.
• When the credit count is greater than zero, the interface can issue requests of that type to the
controller. Each time a request is issued to the controller, the associated credit count is
decremented.
10.5 Controller PHY (DDRP)
The DDRP processes read and write requests from the DDRC and translates them into specific signals
within the timing constraints of the target DDR memory. The DDRP is composed of functional units
including PHY control, master DLL, and read/write leveling logic. The PHY data slice block handles
the DQ, DM, DQS, DQ_OE and DQS_OE signals. The PHY control block synchronizes all of the control
signals with the DDR_x3 clock.
There are two kinds of DLLs, the master DLL, and the slave DLL. The DLLs are responsible for creating
the precise timing windows required by the DDR memories to read and write data. The master DLL
measures the cycle period in terms of a number of taps and passes this number through the ratio
logic to the slave DLLs. The slave DLLs can be separated on the target die to minimize skew and delay
and to account for process, temperature and voltage variations.
Write leveling and read leveling are new functions required for DDR3, DDR3L operation. These
functions help automatically determine delay timings required to align data to the optimal window
for reliable data capture:
• Read leveling and write leveling for DDR3, DDR3L
• Support for 16- and 32-bit data bus width with one rank
• Optional ECC with a 16-bit data width
• Individual bytes with read data mask bits










