User manual
Table Of Contents
- Zynq-7000 All Programmable SoC
- Table of Contents
- Ch. 1: Introduction
- Ch. 2: Signals, Interfaces, and Pins
- Ch. 3: Application Processing Unit
- Ch. 4: System Addresses
- Ch. 5: Interconnect
- Ch. 6: Boot and Configuration
- Ch. 7: Interrupts
- Ch. 8: Timers
- Ch. 9: DMA Controller
- Introduction
- Functional Description
- DMA Transfers on the AXI Interconnect
- AXI Transaction Considerations
- DMA Manager
- Multi-channel Data FIFO (MFIFO)
- Memory-to-Memory Transfers
- PL Peripheral AXI Transactions
- PL Peripheral Request Interface
- PL Peripheral - Length Managed by PL Peripheral
- PL Peripheral - Length Managed by DMAC
- Events and Interrupts
- Aborts
- Security
- IP Configuration Options
- Programming Guide for DMA Controller
- Programming Guide for DMA Engine
- Programming Restrictions
- System Functions
- I/O Interface
- Ch. 10: DDR Memory Controller
- Introduction
- AXI Memory Port Interface (DDRI)
- DDR Core and Transaction Scheduler (DDRC)
- DDRC Arbitration
- Controller PHY (DDRP)
- Initialization and Calibration
- DDR Clock Initialization
- DDR IOB Impedance Calibration
- DDR IOB Configuration
- DDR Controller Register Programming
- DRAM Reset and Initialization
- DRAM Input Impedance (ODT) Calibration
- DRAM Output Impedance (RON) Calibration
- DRAM Training
- Write Data Eye Adjustment
- Alternatives to Automatic DRAM Training
- DRAM Write Latency Restriction
- Register Overview
- Error Correction Code (ECC)
- Programming Model
- Ch. 11: Static Memory Controller
- Ch. 12: Quad-SPI Flash Controller
- Ch. 13: SD/SDIO Controller
- Ch. 14: General Purpose I/O (GPIO)
- Ch. 15: USB Host, Device, and OTG Controller
- Introduction
- Functional Description
- Programming Overview and Reference
- Device Mode Control
- Device Endpoint Data Structures
- Device Endpoint Packet Operational Model
- Device Endpoint Descriptor Reference
- Programming Guide for Device Controller
- Programming Guide for Device Endpoint Data Structures
- Host Mode Data Structures
- EHCI Implementation
- Host Data Structures Reference
- Programming Guide for Host Controller
- OTG Description and Reference
- System Functions
- I/O Interfaces
- Ch. 16: Gigabit Ethernet Controller
- Ch. 17: SPI Controller
- Ch. 18: CAN Controller
- Ch. 19: UART Controller
- Ch. 20: I2C Controller
- Ch. 21: Programmable Logic Description
- Ch. 22: Programmable Logic Design Guide
- Ch. 23: Programmable Logic Test and Debug
- Ch. 24: Power Management
- Ch. 25: Clocks
- Ch. 26: Reset System
- Ch. 27: JTAG and DAP Subsystem
- Ch. 28: System Test and Debug
- Ch. 29: On-Chip Memory (OCM)
- Ch. 30: XADC Interface
- Ch. 31: PCI Express
- Ch. 32: Device Secure Boot
- Appx. A: Additional Resources
- Appx. B: Register Details
- Overview
- Acronyms
- Module Summary
- AXI_HP Interface (AFI) (axi_hp)
- CAN Controller (can)
- DDR Memory Controller (ddrc)
- CoreSight Cross Trigger Interface (cti)
- Performance Monitor Unit (cortexa9_pmu)
- CoreSight Program Trace Macrocell (ptm)
- Debug Access Port (dap)
- CoreSight Embedded Trace Buffer (etb)
- PL Fabric Trace Monitor (ftm)
- CoreSight Trace Funnel (funnel)
- CoreSight Intstrumentation Trace Macrocell (itm)
- CoreSight Trace Packet Output (tpiu)
- Device Configuration Interface (devcfg)
- DMA Controller (dmac)
- Gigabit Ethernet Controller (GEM)
- General Purpose I/O (gpio)
- Interconnect QoS (qos301)
- NIC301 Address Region Control (nic301_addr_region_ctrl_registers)
- I2C Controller (IIC)
- L2 Cache (L2Cpl310)
- Application Processing Unit (mpcore)
- On-Chip Memory (ocm)
- Quad-SPI Flash Controller (qspi)
- SD Controller (sdio)
- System Level Control Registers (slcr)
- Static Memory Controller (pl353)
- SPI Controller (SPI)
- System Watchdog Timer (swdt)
- Triple Timer Counter (ttc)
- UART Controller (UART)
- USB Controller (usb)
Zynq-7000 AP SoC Technical Reference Manual www.xilinx.com 316
UG585 (v1.11) September 27, 2016
Chapter 10: DDR Memory Controller
across PVT is slightly less than 90 degrees, and will be automatically provided by Vivado Design Suite
for inclusion into the FSBL or other user code.
10.6.10 Alternatives to Automatic DRAM Training
If for some reason the automatic training is not successful, alternative calibration schemes can also
be used.
TIP: Training failures can be detected by performing a simple memory write-read-compare test. Since
training is done independently for each byte lane, the memory test should check each data byte
independently. In the event of training failure, two possible solutions are proposed here: a
semi-automatic and a manual training method. As the method gets more manual, the training time
increases. It is therefore recommended to follow this sequence:
1. Try automatic training, verify board measurement-driven initial values
2. If failed, try semi-automatic training
3. If failed, use manual training
Automatic Training
The standard training procedure is described above.
The estimated time for initialization and training is 1-2 ms.
Semi-Automatic Training
This method is useful when system/board delays are known, but PVT timing uncertainty causes the
automatic training to fail. Note that only two initial timing parameters are needed to enable
successful automatic training:
•Write DQS to CLK skew
• The one-way board delay from Zynq to DRAM
These values are known in this case, but the PHY PVT variations modify these values in an additive
fashion. Therefore, given a nominal delay value T, the actual value might be in the range (T-delta,
T+delta), where delta is the maximum PVT variation.
The semi-automatic training method is performed as follows:
1. Divide the range (T-delta, T+delta) into n parts, and thus create (n+1) possible values for each of
the two delay parameters.
2. Perform (n+1)
2
automatic training procedures and follow each one with a memory test.
For example, for n=2, the three data points for each parameter are T-delta, T, and T+delta. Perform
nine automatic training procedures and observe the results. For n=4, perform 25 tests, etc.