Datasheet

±6%
100
90
80
70
60
50
40
30
20
10
0
70605040302010
±4%
±4%
±3%
±3%
±2%
Temperature (°C)
RH Offset (%)
±5%
HDC1080
www.ti.com SNAS672A –NOVEMBER 2015–REVISED JANUARY 2016
Table 10. Induced RH Offset Due to Extended Exposure to High Humidity and High Temperature
(85°C/85% RH)
85°C/85% RH Duration (hours) 12 24 168 500
RH Offset (%) 3 6 12 15
When the sensor is exposed to less severe conditions, Figure 17 shows the typical RH offset at other
combinations of temperature and RH.
Figure 17. Relative Humidity Accuracy vs Temperature
10 Power Supply Recommendations
The HDC1080 requires a voltage supply within 2.7V and 5.5V. A multilayer ceramic bypass X7R capacitor of
0.1µF between the VDD and GND pins is recommended.
11 Layout
11.1 Layout Guidelines
The Relative Humidity sensor element is located on the top side of the package.
It is recommended to isolate the sensor from the rest of the PCB by eliminating copper layers below the device
(GND, V
DD
) and creating a slot into the PCB around the sensor to enhance thermal isolation.
11.2 Layout Example
The only component next to the device is the supply bypass capacitor. Since the relative humidity is dependent
on the temperature, the HDC1080 should be positioned away from hot spots present on the board, such as a
battery, display or micro-controller. Slots around the device can be used to reduce the thermal mass, for a
quicker response to environmental changes. The DAP may be soldered to a floating pad on the board, but the
board pad should NOT be connected to GND.
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