Datasheet

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EXAMPLE BOARD LAYOUT
0.07 MIN
ALL AROUND
0.07 MAX
ALL AROUND
(1.5)
4X (1)
(2.8)
6X (0.4)
6X (0.6)
(2.4)
(R0.05) TYP
( 0.2)
TYP
(0.95) TYP
(1) TYP
WSON - 0.8 mm max heightDMB0006A
PLASTIC SMALL OUTLINE - NO LEAD
4221225/B 08/2016
SYMM
1
3
4
6
SYMM
LAND PATTERN EXAMPLE
SCALE:20X
7
NOTES: (continued)
5. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
6. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown
on this view. It is recommended that vias under paste be filled, plugged or tented.
SOLDER MASK
OPENING
SOLDER MASK
METAL UNDER
SOLDER MASK
DEFINED
METAL
SOLDER MASK
OPENING
SOLDER MASK DETAILS
NON SOLDER MASK
DEFINED
(PREFERRED)