Owner manual

DESDALC5LP
Document number: DS36761 Rev. 2 - 2
2 of 6
www.diodes.com
May 2014
© Diodes Incorporated
DESDALC5LP
ADVANCE INFORMATION
ADVANCED INFORMATION
Maximum Ratings (@T
A
= +25°C, unless otherwise specified.)
Characteristic Symbol Value Unit Conditions
Peak Pulse Power Dissipation
P
PP
150 W 8/20µs
Peak Pulse Current
I
PP
9 A 8/20µs
ESD Protection – Contact Discharge
V
ESD_Contact
±30 kV IEC 61000-4-2 Standard
ESD Protection – Air Discharge
V
ESD_Air
±30 kV IEC 61000-4-2 Standard
Thermal Characteristics
Characteristic Symbol Value Unit
Package Power Dissipation (Note 5)
P
D
250 mW
Thermal Resistance, Junction to Ambient (Note 5)
R
θ
JA
500
°C/W
Operating and Storage Temperature Range
T
J
, T
STG
-65 to +150
°C
Electrical Characteristics (@T
A
= +25°C unless otherwise specified)
Characteristic Symbol Min Typ Max Unit Test Conditions
Reverse Breakdown Voltage
V
BR
11 13 17
V
I
R
= 1mA, pin1 to pin2
5.8 8 11
I
R
= 1mA, pin2 to pin1
Reverse Current (Note 6)
I
R
— — 25 nA
V
R
= 5V
Dynamic Resistance, from Pin 1 to Pin 2
R
DYN
— 0.19 — 
I
TLP
= 1A to 20A, t
P
= 100ns
Dynamic Resistance, from Pin 2 to Pin 1
R
DYN
— 0.19 — 
I
TLP
= 1A to 20A, t
P
= 100ns
Capacitance
C
T
— 26 30 pF
V
R
= 0V, f = 1MHz
Clamping Voltage, from Pin 1 to Pin 2
V
CL
— 21 — V
8kV contact discharge after 30ns
IEC61000-4-2
Clamping Voltage, from Pin 2 to Pin 1
V
CL
— 12 — V
8kV contact discharge after 30ns
IEC61000-4-2
Notes: 5. Device mounted on FR-4 PCB pad layout (2oz copper) as shown on Diodes, Inc. suggested pad layout AP02001, which can be found on our website at
http://www.diodes.com.
6. Short duration pulse test used to minimize self-heating effect.
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
0
25 50 75 100 125
0.0
0.1
150
1.1
T (°C)
J
Figure 1 Normalized Peak Pulse Power vs.
Initial Junction Temperature
P
(
T
Initial
)
/
=
+
2
5
)
PK J
P
(
T
Initial
°
C
PK J
8/20µs
T (°C)
J
Figure 2 Leakage Current vs. Junction Temperature
(Typical Values)
I (nA)
R
1
10
100
25 50 75 100 125 150
V = V = 5V
From Pin 1 to Pin 2
RRM