Instruction Manual

DMP210DUDJ
Document number: DS31494 Rev. 9 - 2
2 of 6
www.diodes.com
November 2013
© Diodes Incorporated
DMP210DUDJ
Maximum Ratings (@T
A
= +25°C, unless otherwise specified.)
Characteristic Symbol Value Units
Drain-Source Voltage
V
DSS
-20 V
Gate-Source Voltage
V
GSS
±8 V
Continuous Drain Current (Note 6) V
GS
= -4.5V
T
A
= +25°C
T
A
= +70°C
I
D
-200
-150
mA
Continuous Drain Current (Note 6) V
GS
= -2.5V
T
A
= +25°C
T
A
= +70°C
I
D
-170
-130
mA
Pulsed Drain Current
T
P
= 10μs I
DM
-600 mA
Thermal Characteristics (@T
A
= +25°C, unless otherwise specified.)
Characteristic Symbol Value Units
Total Power Dissipation (Note 6)
P
D
330 mW
Thermal Resistance, Junction to Ambient (Note 6)
R
θJA
377.16 °C/W
Operating and Storage Temperature Range
T
J,
T
STG
-55 to +150 °C
Electrical Characteristics (@T
A
= +25°C, unless otherwise specified.)
Characteristic Symbol Min Typ Max Unit Test Condition
OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage
BV
DSS
-20
 
V
V
GS
= 0V, I
D
= -250µA
Zero Gate Voltage Drain Current
I
DSS




-100
-50
nA
nA
V
DS
= -16V, V
GS
= 0V
V
DS
= -5.0V, V
GS
= 0V
Gate-Source Leakage
I
GSS
 
100
1
nA
µA
V
GS
= 5.0V, V
DS
= 0V
V
GS
= 8.0V, V
DS
= 0V
ON CHARACTERISTICS (Note 7)
Gate Threshold Voltage
V
GS
(
th
)
-0.45

-1.15 V
V
DS
= V
GS
, I
D
= -250µA
Static Drain-Source On-Resistance
R
DS(ON)
 
5.5
Ω
V
GS
= -4.5V, I
D
= -100mA
 
7.5
V
GS
= -2.5V, I
D
= -50mA
 
11.5
V
GS
= -1.8V, I
D
= -20mA
 
17.5
V
GS
= -1.5V, I
D
= -10mA

20
 V
GS
= -1.2V, I
D
= -1mA
Forward Transfer Admittance
|Y
fs
|
150 200

mS
V
DS
= -10V, I
D
= -0.2A
Diode Forward Voltage (Note 7)
V
SD
-0.5

-1.2 V
V
GS
= 0V, I
S
= -115mA
DYNAMIC CHARACTERISTICS (Note 8)
Input Capacitance
C
iss

13.72 27.44 pF
V
DS
= -15V, V
GS
= 0V
f = 1.0MHz
Output Capacitance
C
oss

4.01 8.02 pF
Reverse Transfer Capacitance
C
rss

2.34 4.68 pF
SWITCHING CHARACTERISTICS (Note 8)
Turn-On Delay Time
t
d
(
on
)

7.7

ns
V
GS
= -4.5V, V
DD
= -15V
I
D
= -180mA, R
G
= 2.0Ω
Rise Time
t
r

19.3

Turn-Off Delay Time
t
d
(
off
)

25.9

Fall Time
t
f

31.5

Notes: 6. Device mounted on 1”x1” FR-4 substrate PC board, with minimum recommended pad layout, single sided.
7. Short duration pulse test used to minimize self-heating effect.
8. Guaranteed by design. Not subject to production testing.