Owner's manual
DMP3056LSD
Document number: DS31420 Rev. 7 - 2
2 of 5
www.diodes.com
January 2014
© Diodes Incorporated
DMP3056LSD
NEW PRODUCT
Maximum Ratings (@T
A
= +25°C, unless otherwise specified.)
Characteristic Symbol Value Units
Drain-Source Voltage
V
DSS
-30 V
Gate-Source Voltage
V
GSS
±20
V
Drain Current (Note 5) Steady
State
T
A
= +25°C
T
A
= +70°C
I
D
-6.9
-5.8
A
Pulsed Drain Current (Note 6)
I
DM
-24 A
Thermal Characteristics
Characteristic Symbol Value Unit
Total Power Dissipation (Note 5)
P
D
2.5 W
Thermal Resistance, Junction to Ambient (Note 5)
R
θ
JA
50 °C/W
Operating and Storage Temperature Range
T
J,
T
STG
-55 to +150 °C
Electrical Characteristics (@T
A
= +25°C, unless otherwise specified.)
Characteristic Symbol Min Typ Max Unit Test Condition
OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage
BV
DSS
-30
⎯ ⎯
V
V
GS
= 0V, I
D
= -250µA
Zero Gate Voltage Drain Current
I
DSS
⎯ ⎯
-1 µA
V
DS
= -30V, V
GS
= 0V
Gate-Source Leakage
I
GSS
⎯ ⎯
±100
±800
nA
V
GS
= ±20V, V
DS
= 0V
V
GS
= ±25V, V
DS
= 0V
ON CHARACTERISTICS (Note 7)
Gate Threshold Voltage
V
GS
(
th
)
-1 -1.7 -2.1 V
V
DS
= V
GS
, I
D
= -250μA
Static Drain-Source On-Resistance
R
DS (ON)
⎯
⎯
⎯
⎯
45
65
mΩ
V
GS
= -10V, I
D
= -6.0A
V
GS
= -4.5V, I
D
= -5.0A
Forward Transconductance
g
fs
⎯
8
⎯
S
V
DS
= -10V, I
D
= -5.3A
Diode Forward Voltage (Note 7)
V
SD
-0.5
⎯
-1.2 V
V
GS
= 0V, I
S
= -1.7A
DYNAMIC CHARACTERISTICS
Input Capacitance
C
iss
⎯
722
⎯
pF
V
DS
= -25V, V
GS
= 0V
f = 1.0MHz
Output Capacitance
C
oss
⎯
114
⎯
pF
Reverse Transfer Capacitance
C
rss
⎯
92
⎯
pF
Gate Resistance
R
G
⎯
3.3
⎯ Ω
V
DS
= 0V, V
GS
= 0V
f = 1.0MHz
SWITCHING CHARACTERISTICS
Total Gate Charge
Q
G
⎯
6.8
⎯
nC
V
DS
= -15V, V
GS
= -4.5V,
I
D
= -6A
Q
G
⎯
13.7
⎯
nC
V
DS
= -15V, V
GS
= -10V,
I
D
= -6A
Gate-Source Charge
Q
GS
⎯
1.6
⎯
Gate-Drain Charge
Q
GD
⎯
4.2
⎯
Turn-On Delay Time
t
d
(
on
)
⎯
6.4
⎯
ns
V
DS
= -15V, V
GS
= -10V,
I
D
= -1A, R
G
= 6.0Ω
Rise Time
t
r
⎯
5.3
⎯
Turn-Off Delay Time
t
d
(
off
)
⎯
26.5
⎯
Fall Time
t
f
⎯
14.7
⎯
Notes: 5. Device mounted on 2 oz. 1” x 1” Copper pads on 2” x 2” FR-4 PCB.
6. Pulse width ≤10μS, Duty Cycle ≤1%.
7. Short duration pulse test used to minimize self-heating effect.