User Manual

MMBD4448V
Document number: DS30451 Rev. 7 - 2
1 of 2
www.diodes.com
March 2008
© Diodes Incorporated
MMBD4448
V
SURFACE MOUNT FAST SWITCHING DIODE
Features
• Ultra-Small Surface Mount Package
• Fast Switching Speed
• For General Purpose Switching Applications
• High Conductance
• Lead Free By Design/RoHS Compliant (Note 4)
• "Green" Device (Note 5 and 6)
Mechanical Data
• Case: SOT-563
• Case Material: Molded Plastic. UL Flammability Classification
Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020D
• Terminals: Finish - Matte Tin annealed over Alloy 42
leadframe. Solderable per MIL-STD-202, Method 208
• Marking Information: See Page 2
• Ordering Information: See Page 2
• Weight: 0.003 grams (approximate)
SOT-563
Internal Schematic
C
1
A
1
NC
NC
A
2
C
2
TOP VIEW
BOTTOM VIEW
TOP VIEW
Maximum Ratings @T
A
= 25°C unless otherwise specified
Characteristic Symbol Value Unit
Non-Repetitive Peak Reverse Voltage
V
RM
100 V
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
V
RRM
V
RWM
V
R
80 V
RMS Reverse Voltage
V
R(RMS)
57 V
Forward Continuous Current (Note 2)
I
FM
500 mA
Average Rectified Output Current (Note 2)
I
O
250 mA
Non-Repetitive Peak Forward Surge Current @ t = 1.0μs
@ t = 1.0s
I
FSM
4.0
2.0
A
Thermal Characteristics
Characteristic Symbol Value Unit
Power Dissipation (Note 2)
P
D
150 mW
Thermal Resistance Junction to Ambient (Note 2)
R
θ
JA
833
°C/W
Operating and Storage Temperature Range
T
J
, T
STG
-65 to +150
°C
Electrical Characteristics @T
A
= 25°C unless otherwise specified
Characteristic Symbol Min Max Unit Test Condition
Reverse Breakdown Voltage (Note 3)
V
(BR)R
80
⎯
V
I
R
= 2.5μA
Forward Voltage
V
F
0.62
⎯
⎯
⎯
0.72
0.855
1.0
1.25
V
I
F
= 5.0mA
I
F
= 10mA
I
F
= 100mA
I
F
= 150mA
Leakage Current (Note 3)
I
R
⎯
100
50
30
25
nA
μA
μA
nA
V
R
= 70V
V
R
= 75V, T
J
= 150°C
V
R
= 25V, T
J
= 150°C
V
R
= 20V
Total Capacitance
C
T
⎯
3.5 pF
V
R
= 6V, f = 1.0MHz
Reverse Recovery Time
t
rr
⎯
4.0 ns
V
R
= 6V, I
F
= 5mA
Notes: 1. Package is non-polarized. Parts may be on reel in orientation illustrated, 180° rotated, or mixed (both ways).
2. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout
document AP02001, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
3. Short duration pulse test used to minimize self-heating effect.
4. No purposefully added lead.
5. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
6. Product manufactured with Date Code UO (week 40, 2007) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code UO are built with Non-Green Molding Compound and may contain Halogens or Sb
2
O
3
Fire Retardants.
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