Manual

MMBZ15VDL, MMBZ27VCL
Document number: DS30352 Rev. 15 - 2
2 of 5
www.diodes.com
October 2013
© Diodes Incorporated
MMBZ15VDL
,
MMBZ27VCL
Maximum Ratings (@T
A
= +25°C, unless otherwise specified.)
Characteristic Symbol Value Unit
Peak Power Dissipation (Note 7)
P
PK
40 W
Thermal Characteristics
Characteristic Symbol Value Unit
Power Dissipation (Note 8)
P
D
225 mW
Thermal Resistance, Junction to Ambient Air (Note 8)
R

JA
556 °C/W
Operating and Storage Temperature Range
T
J
, T
STG
-65 to +150 °C
Electrical Characteristics (@T
A
= +25°C, unless otherwise specified.)
V
F
= 0.9V max @ I
F
= 10mA
Type
Number
Marking
Code
V
RWM
Max
Reverse
Leakage I
R
@ V
RWM
(Note 9)
Breakdown Voltage
Max. Clamping
Voltage V
C
@ I
PP
(Note 7)
Typical
Temperature
Coefficient
V
BR
(Note 9) (V) @ I
T
V
C
I
PP
Volts nA Min Nom Max mA V A T
C
(%/°C)
MMBZ15VDL KVJ 12.8 100 14.3 15 15.8 1.0 21.2 1.9 +0.080
V
F
= 1.1V max @ I
F
= 200mA
Type
Number
Marking
Code
V
RWM
Max
Reverse
Leakage I
R
@ V
RWM
(Note 9)
Breakdown Voltage
Max. Clamping
Voltage V
C
@ I
PP
(Note 7)
Typical
Temperature
Coefficient
V
BR
(Note 9) (V) @ I
T
V
C
I
PP
Volts nA Min Nom Max mA V A T
C
(%/°C)
MMBZ27VCL KVP 22 50 25.65 27 28.35 1.0 38 1.0 +0.090
Notes: 7. Non-repetitive current pulse per Figure 2 and derate above T
A
= +25°C per Figure 1.
8. Device mounted on FR-5 PCB 1.0 x 0.75 x 0.062 inch pad layout as shown on Diodes Inc. suggested pad layout AP02001, which can be found on our
website at http://www.diodes.com. 200mW per element must not be exceeded.
9. Short duration pulse test used to minimize self-heating effect.
10 X 1000 Waveform
as defined by REA
0 25 50 75 100 125 150 175 200
100
75
50
25
0
T , AMBIENT TEMPERATURE ( C)
Figure 1 Pulse Derating Curve
A
°
P
EAK
P
U
LSE DE
R
A
T
I
N
G
I
N
%
O
F
PEAK POWER OR CURRENT
I , PEAK PULSE CURRENT (%I )
PP pp
t, TIME (ms)
Figure 2 Pulse Waveform