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MMDT3906

DUAL PNP SMALL SIGNAL SURFACE MOUNT TRANSISTOR

Features

• Epitaxial Planar Die Construction

• Ideal for Low Power Amplification and Switching

• Ultra-Small Surface Mount Package

• Lead Free/RoHS Compliant (Note 2)

• "Green" Device (Note 3 and 4)

Mechanical Data

• Case: SOT-363

• Case Material: Molded Plastic. UL Flammability

Classification Rating 94V-0

• Moisture Sensitivity: Level 1 per J-STD-020C

• Terminals: Solderable per MIL-STD-202, Method 208

• Lead Free Plating (Matte Tin Finish annealed over Alloy 42

leadframe).

• Terminal Connections: See Diagram

• Ordering and Date Code Information: See Page 4

• Marking Information: K3N, See Page 4

• Weight: 0.006 grams (approximate)

SOT-363

Dim Min Max

A 0.10 0.30

B 1.15 1.35

C 2.00 2.20

D 0.65 Nominal

F 0.30 0.40

H 1.80 2.20

J — 0.10

K 0.90 1.00

L 0.25 0.40

M 0.10 0.25

0° 8°

All Dimens mm ions in

Maximum Ratings @T

= 25°C unless otherwise specified

Characteristic Symbol Value Unit

Collector-Base Voltage

CBO

-40 V

Collector-Emitter Voltage

CEO

-40 V

Emitter-Base Voltage

EBO

-5.0 V

Collector Current - Continuous

-200 mA

Power Dissipation (Note 1)

200 mW

Thermal Resistance, Junction to Ambient

625

°C/W

Operating and Storage Temperature Range

, T

STG

-55 to +150

°C

Notes: 1. Device mounted on FR-4 PCB; pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which can be found on our website at

http://www.diodes.com/datasheets/ap02001.pdf.

2. No purposefully added lead.

3. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.

4. Product manufactured with Date Code UO (week 40, 2007) and newer are built with Green Molding Compound. Product manufactured prior to Date

Code UO are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.

DS30124 Rev. 11 - 2

1 of 4

www.diodes.com

MMDT3906

Summary of content (4 pages)

PAGE 1
MMDT3906 DUAL PNP SMALL SIGNAL SURFACE MOUNT TRANSISTOR Features • • • • • Epitaxial Planar Die Construction Ideal for Low Power Amplification and Switching Ultra-Small Surface Mount Package Lead Free/RoHS Compliant (Note 2) "Green" Device (Note 3 and 4) A C2 • • • • • • • E2 B2 C1 H Case: SOT-363 Case Material: Molded Plastic.
PAGE 2
Electrical Characteristics @TA = 25°C unless otherwise specified Characteristic OFF CHARACTERISTICS (Note 5) Symbol Min Max Unit Collector-Base Breakdown Voltage V(BR)CBO -40 ⎯ V IC = -10μA, IE = 0 Collector-Emitter Breakdown Voltage V(BR)CEO -40 ⎯ V IC = -1.0mA, IB = 0 Emitter-Base Breakdown Voltage V(BR)EBO -5.0 ⎯ V IE = -10μA, IC = 0 ICEX ⎯ -50 nA VCE = -30V, VEB(OFF) = -3.0V IBL ⎯ -50 nA VCE = -30V, VEB(OFF) = -3.
PAGE 3
100 CIBO, INPUT CAPACITANCE (pF) COBO, OUTPUT CAPACITANCE (pF) PD, POWER DISSIPATION (mW) 200 150 100 50 0 0 25 50 75 100 125 150 175 TA, AMBIENT TEMPERATURE (°C) Fig. 1, Max Power Dissipation vs. Ambient Temperature 1 0.1 200 1 100 10 VCB, COLLECTOR-BASE VOLTAGE (V) Fig. 2, Input and Output Capacitance vs. Collector-Base Voltage 10 VCE(SAT), COLLECTOR-EMITTER (V) SATURATION VOLTAGE 1,000 hFE, DC CURRENT GAIN 10 100 10 1 0.1 100 10 1 IC, COLLECTOR CURRENT (mA) Fig.
PAGE 4
Ordering Information Notes: 6. (Note 6) Device Packaging Shipping MMDT3906-7-F SOT-363 3000/Tape & Reel For packaging details, go to our website at http://www.diodes.com/datasheets/ap02007.pdf.