Owner manual

MMDT5451
COMPLEMENTARY NPN / PNP SMALL SIGNAL SURFACE MOUNT TRANSISTOR
Features
Complementary Pair One 5551-Type NPN
One 5401-Type PNP
DS30171 Rev. 9 - 2
1 of 5
www.diodes.com
MMDT5451
© Diodes Incorporated
Epitaxial Planar Die Construction
Ideal for Medium Power Amplification and Switching
Ultra-Small Surface Mount Package
Lead Free/RoHS Compliant (Note 3)
"Green" Device (Note 4 and 5)
Mechanical Data
Case: SOT-363
Case Material: Molded Plastic. UL Flammability
Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020C
Terminals: Solderable per MIL-STD-202, Method 208
Lead Free Plating (Matte Tin Finish annealed over Alloy 42
leadframe).
Terminal Connections: See Diagram
Marking Information: KNM, See Page 5
Ordering & Date Code Information: See Page 5
Weight: 0.006 grams (approximate)
SOT-363
Dim Min Max
A 0.10 0.30
B 1.15 1.35
C 2.00 2.20
D 0.65 Nominal
F 0.30 0.40
H 1.80 2.20
J 0.10
K 0.90 1.00
L 0.25 0.40
M 0.10 0.25
α
All Dimens mm ions in
A
M
J
L
D
B
C
H
K
G
F
C
1
B
2
E
2
E
1
B
1
C
2
E1, B1, C1 = PNP5401 Section
E2, B2, C2 = NPN5551 Section
Maximum Ratings, NPN 5551 Section @T
A
= 25°C unless otherwise specified
Characteristic Symbol NPN5551 Unit
Collector-Base Voltage
V
CBO
180 V
Collector-Emitter Voltage
V
CEO
160 V
Emitter-Base Voltage
V
EBO
6.0 V
Collector Current - Continuous (Note 1)
I
C
200 mA
Power Dissipation (Note 1, 2)
P
d
200 mW
Thermal Resistance, Junction to Ambient (Note 1)
R
θ
JA
625
°C/W
Operating and Storage Temperature Range
T
j
, T
STG
-55 to +150
°C
Maximum Ratings, PNP 5401 Section @T
A
= 25°C unless otherwise specified
Characteristic Symbol PNP5401 Unit
Collector-Base Voltage
V
CBO
-160 V
Collector-Emitter Voltage
V
CEO
-150 V
Emitter-Base Voltage
V
EBO
-5.0 V
Collector Current – Continuous (Note 1)
I
C
-200 mA
Power Dissipation (Note 1, 2)
P
d
200 mW
Thermal Resistance, Junction to Ambient (Note 1)
R
θ
JA
625 K/W
Operating and Storage Temperature Range
T
j
, T
STG
-55 to +150
°C
Notes: 1. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which
can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
2. Maximum combined dissipation.
3. No purposefully added lead.
4. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
5. Product manufactured with Date Code UO (week 40, 2007) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code UO are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.

Summary of content (5 pages)