User guide

ZXMN4A06K
Issue 1 - March 2006 2 www.zetex.com
© Zetex Semiconductors plc 2005
Absolute maximum ratings
NOTES:
(a) For a device surface mounted on 50mm x 50mm x 1.6mm FR4 PCB with high coverage of single sided 2oz copper, in
still air conditions.
(b) For a device surface mounted on FR4 PCB measured at t 10 sec.
(c) Repetitive rating 50mm x 50mm x 1.6mm FR4 PCB, D=0.02 pulse width=300 s - pulse width limited by maximum
junction temperature.
(d) For a device surface mounted on 25mm x 25mm x 1.6mm FR4 PCB with high coverage of single sided 1oz copper, in
still air conditions.
Parameter Symbol Limit Unit
Drain-source voltage V
DSS
40 V
Gate-source voltage V
GS
20 V
Continuous drain current:
I
D
V
GS
=10V; T
A
=25°C
(b)
10.9 A
V
GS
=10V; T
A
=70°C
(b)
8.7 A
V
GS
=10V; T
A
=25°C
(a)
7.2 A
Pulsed drain current
(c)
I
DM
35.3 A
Continuous source current (body diode)
(b)
I
S
10.8 A
Pulsed source current (body diode)
(c)
I
SM
35.3 A
Power dissipation at T
A
=25°C
(a)
Linear derating factor
P
D
4.2
33.6
W
mW/°C
Power dissipation at T
A
=25°C
(b)
Linear derating factor
P
D
9.5
76
W
mW/°C
Power dissipation at T
A
=25°C
(d)
Linear derating factor
P
D
2.15
17.2
W
mW/°C
Operating and storage temperature range T
j
:T
stg
-55 to +150 °C
Thermal resistance
Parameter Symbol Value Unit
Junction to ambient
(a)
R
JA
30 °C/W
Junction to ambient
(b)
R
JA
13.2 °C/W
Junction to ambient
(d)
R
JA
58 °C/W