Manual
ZXMP10A16K
Issue 1 - October 2006 2 www.zetex.com
© Zetex Semiconductors plc 2006
Absolute maximum ratings
NOTES:
(a) For a device surface mounted on 50mm x 50mm x 1.6mm FR4 PCB with high coverage of single sided 2oz copper, in
still air conditions.
(b) For a device surface mounted on FR4 PCB measured at t ⱕ10 sec.
(c) Repetitive rating 50mm x 50mm x 1.6mm FR4 PCB, D=0.02 pulse width=300s - pulse width limited by maximum
junction temperature.
(d) For a device surface mounted on 25mm x 25mm x 1.6mm FR4 PCB with high coverage of single sided 1oz copper, in
still air conditions.
Parameter Symbol Limit Unit
Drain-source voltage V
DSS
-100 V
Gate-source voltage V
GS
±20 V
Continuous drain current @ V
GS
= 10V; T
amb
=25°C
(b)
I
D
4.6 A
@ V
GS
= 10V; T
amb
=70°C
(b)
3.7
@ V
GS
= 10V; T
amb
=25°C
(a)
3
Pulsed drain current
(c)
I
DM
15.4 A
Continuous source current (body diode)
(b)
I
S
10.6 A
Pulsed source current (body diode)
(c)
I
SM
15.4 A
Power dissipation at T
amb
=25°C
(a)
P
D
4.24 W
Linear derating factor 34 mW/°C
Power dissipation at T
amb
=25°C
(b)
P
D
9.76 W
Linear derating factor 78 mW/°C
Power dissipation at T
amb
=25°C
(d)
P
D
2.15 W
Linear derating factor 16.8 mW/°C
Operating and storage temperature range T
j
, T
stg
-55 to +150 °C
Thermal resistance
Parameter Symbol Limit Unit
Junction to ambient
(a)
R
⍜JA
29.45 °C/W
Junction to ambient
(b)
R
⍜JA
12.8 °C/W
Junction to ambient
(d)
R
⍜JA
58.1 °C/W