User Manual

ZXTN25100BFH
Document number: DS33703 Rev. 2 - 2
2 of 7
www.diodes.com
December 2012
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Diodes Incorporated
ZXTN25100BFH
Maximum Ratings (@T
A
= +25°C, unless otherwise specified.)
Characteristic Symbol Value Unit
Collector-Base Voltage
V
CBO
170 V
Collector-Emitter Voltage (Forward Blocking)
V
CEX
170 V
Collector-Emitter Voltage
V
CEO
100 V
Emitter-Base Voltage (Reverse Blocking)
V
ECO
6 V
Emitter-Base Voltage
V
EBO
7 V
Continuous Collector Current
I
C
3 A
Peak Pulse Current (Note 5)
I
CM
9 A
Thermal Characteristics (@T
A
= +25°C, unless otherwise specified.)
Characteristic Symbol Value Unit
Power Dissipation
Linear Derating Factor
(Note 5)
P
D
0.73
5.84
mW
Power Dissipation
Linear Derating Factor
(Note 6)
P
D
1.05
8.4
mW
Power Dissipation
Linear Derating Factor
(Note 7)
P
D
1.25
9.6
mW
Power Dissipation
Linear Derating Factor
(Note 8)
P
D
1.81
14.5
mW
Thermal Resistance, Junction to Ambient (Note 5)
R
θJA
171
°C/W
Thermal Resistance, Junction to Ambient (Note 6)
R
θJA
119
°C/W
Thermal Resistance, Junction to Ambient (Note 7)
R
θJA
100
°C/W
Thermal Resistance, Junction to Ambient (Note 8)
R
θJA
69
°C/W
Thermal Resistance, Junction to Leads (Note 9)
R
θJL
74.96
°C/W
Operating and Storage Temperature Range
T
J,
T
STG
-55 to +150
°C
ESD Ratings (Note 10)
Characteristic Symbol Value Unit JEDEC Class
Electrostatic Discharge - Human Body Model ESD HBM ≥ 8,000 V 3B
Electrostatic Discharge - Machine Model ESD MM ≥ 400 V C
Notes: 5. For a device surface mounted on 15mm x 15mm x 1.6mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions; the device is
measured when operating in a steady-state condition.
6. Same as note (5), except mounted on 25mm x 25mm x 1.6mm FR4 PCB with 2 oz copper.
7. Same as note (5), except mounted on 50mm x 50mm x 1.6mm FR4 PCB with 2 oz copper.
8. Same as note (7), except measured at t < 5secs.
9. Thermal resistance from junction to solder-point (at the end of collector lead).
10.Refer to JEDEC specification JESD22-A114 and JESD22-A115.