Specifications

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UNLESS OTHER SPECIFIED TOLERANCES ON：

X＝± X.X＝± X.XX＝

A N G L E S ＝

H O L E D I A ＝

SCALE：N/A

UNIT：mm

THESE DRAWINGS AND SPECIFICATIONS ARE THE PROPERTY OF PBXY

TECHNOLOGY Limited AND SHALL NOT BE REPRODUCED OR USED AS

THE BASIS FOR THE MANUFACTURE OR SALE OF APPARATUS OR

DEVICES WITHOUT PERMISSION

DRAWN BY : Sera

CHECKED BY: XD

APPROVED BY: XD

TITLE：CHIP2450-3216 Specification

DOCUMENT

NO.

3216

SPEC REV.

PBX3216MC02 Specification

Operating Temp. : -40℃~+85℃

FEATURES

● Light weight, compact

● Wide bandwidth, low cost

● Built-in antenna with high gain

APPLICATIONS

● Bluetooth, Wireless LAN, Mobile TV

● Home RF System, etc

3. PRODUCT IDENTIFICATION

(1) (2) (3)

(1) Product type: Multilayer chip Antenna

(2) Center Frequency: 2450MHz

(3) External Dimensions (L×W) (mm): 3.2*1.6

4. SHAPE AND DIMENSIONS:

3.2±0.2

1.6±0.2

0.52±0.1

0.4±0.1

Summary of content (9 pages)

PAGE 1
PBX3216MC02 Specification Operating Temp. : -40℃~+85℃ 1. FEATURES: ● Light weight, compact ● Wide bandwidth, low cost ● Built-in antenna with high gain 2. APPLICATIONS: ● Bluetooth, Wireless LAN, Mobile TV ● Home RF System, etc 3. PRODUCT IDENTIFICATION C H I P 2 4 (1) 0 5 3 2 (2) 1 6 (3) (1) Product type: Multilayer chip Antenna (2) Center Frequency: 2450MHz (3) External Dimensions (L×W) (mm): 3.2*1.6 4. SHAPE AND DIMENSIONS: L W 3.2±0.2 1.6±0.
PAGE 2
unit：mm UNLESS OTHER SPECIFIED TOLERANCES ON： X＝± X.X＝± X.XX＝ ANGLES ＝± HOLEDIA＝± SCALE：N/A UNIT：mm DRAWN BY : Sera CHECKED BY: XD DESIGNED BY: Sera APPROVED BY: XD TITLE：CHIP2450-3216 Specification THESE DRAWINGS AND SPECIFICATIONS ARE THE PROPERTY OF PBXY TECHNOLOGY Limited AND SHALL NOT BE REPRODUCED OR USED AS THE BASIS FOR THE MANUFACTURE OR SALE OF APPARATUS OR DEVICES WITHOUT PERMISSION DOCUMENT NO. 3216 SPEC REV.
PAGE 3
APPLICATION GUIDE 5. SPECIFICATIONS: * Test condition: Test board size 90*40 mm Matching circuit: Pi matching circuit will be required UNLESS OTHER SPECIFIED TOLERANCES ON： X＝± X.X＝± X.
PAGE 4
6. Electrical Characteristics : Return loss Standing wave ratio Mark Frequency VSWR 1 2400 MHz 1.513 2 2440 MHz 1.068 3 2480 MHz 1.464 UNLESS OTHER SPECIFIED TOLERANCES ON： X＝± X.X＝± X.
PAGE 5
Radiation Pattern The Gain pattern is measured in FAR-field chamber. DUT is placed on the table of rotator,a standard horn antenna and Vector Network Analyzer is used to collect data. ◎ efficiency maximum gain UNLESS OTHER SPECIFIED TOLERANCES ON： X＝± X.X＝± X.
PAGE 6
◎ 3D Gain Pattern (2400 MHz) ◎ 3D Gain Pattern (2440 MHz) ◎ 3D Gain Pattern (2480 MHz) UNLESS OTHER SPECIFIED TOLERANCES ON： X＝± X.X＝± X.XX＝ ANGLES ＝± HOLEDIA＝± SCALE：N/A UNIT：mm DRAWN BY : Sera CHECKED BY: XD DESIGNED BY: Sera APPROVED BY: XD TITLE：CHIP2450-3216 Specification THESE DRAWINGS AND SPECIFICATIONS ARE THE PROPERTY OF PBXY TECHNOLOGY Limited AND SHALL NOT BE REPRODUCED OR USED AS THE BASIS FOR THE MANUFACTURE OR SALE OF APPARATUS OR DEVICES WITHOUT PERMISSION DOCUMENT NO.
PAGE 7
. Environmental Characteristics (1) Reliability Test (2) Storage Condition (a) At warehouse: The temperature should be within 0 ~ 30℃ and humidity should be less than 60% RH. The product should be used within 1 year from the time of delivery. (b) On board: The temperature should be within -40~85℃ and humidity should be less than 85% RH. (3) Operating Temperature Range Operating temperature range : -40℃ to +105℃. UNLESS OTHER SPECIFIED TOLERANCES ON： X＝± X.X＝± X.
PAGE 8
. Recommended Reflow Soldering (1) Soldering Gun Procedure Note the follows, in case of using solder gun for replacement. (a) The tip temperature must be less than 350°C for the period within 3 seconds by using soldering gun under 30 W. (b) The soldering gun tip shall not touch this product directly. (2) Soldering Volume Note that excess of soldering volume will easily get crack the body of this product. UNLESS OTHER SPECIFIED TOLERANCES ON： X＝± X.X＝± X.
PAGE 9
. Taping Package and Label Marking: (unit: mm) (1) Quantity/Reel: 5000pcs/Reel (2) Carrier tape dimensions (3) Taping reel dimensions UNLESS OTHER SPECIFIED TOLERANCES ON： X＝± X.X＝± X.