User's Manual
5
Installation/Mounting
The BTM-RDR-A is designed to be surface-mount soldered to the LED PCB of a lighting fixture and
therefore does not require any wiring connections to the fixture. Please refer to the Dimensions section
of this document for the size, SMT footprint, and pinout for the module. The module can be hand-
soldered to the LED PCB or it can be reflow soldered at the same time as the rest of the components on
the fixture LED PCB.
ESD Handling
The BTM-RDR-A module contains highly sensitive electronic circuitry and is an Electro Static Discharge
Sensitive (ESDS) device. At all times the BTM-RDR-A modules should be handled using proper ESD
protection measures. Failure to observe these recommendations can result in severe damage to the
module.
Reflow Soldering
The recommended reflow profile is as follows.
Parameter Values
Ramp Up Rate (from T
soakmax
to T
peak
)
3°C/sec max
Minimum Soak Temperature
150°C
Maximum Soak Temperature
200°C
Soak Time
60-120 sec
T
liquidus
217°C
Time above TL
60-150 sec
T
peak
250°C
Time within 5°C of T
peak
20-30 sec
Time from 25°C to T
peak
8 min max
Ramp down Rate
6°C/sec max