Datasheet
DOW CORNING
®
732
Multi-Purpose Sealant
FEATURES
General purpose silicone adhesive/sealant (specified)
APPLICATIONS
• General industrial sealing and bonding applications.
• Complies with MIL-A-46106 and FDA 177.2600.
TYPICAL PROPERTIES
Specification Writers: These values are not intended for use in preparing specifications.
Please contact your local Dow Corning sales office or your Global Dow Corning
Connection before writing specifications on this product.
CTM* ASTM* Property Unit Value
As supplied
0176 Appearance Non-slump paste
Color(s) White, black or
clear
0364 Extrusion rate1 g/minute 350
0098 Skin-over time minutes 7
0095 Tack-free time minutes 20
Mechanical properties, cured 7 days in air at 25ºC (77ºF) and
50% relative humidity
0097B D1475 Specific gravity 1.04
0099 D2240 Durometer hardness, Shore A 25
0137A D412 Tensile strength MPa 2.3
0137A D412 Elongation at break % 540
0420 Volume coefficient of thermal 1/K 1.12x10
-3
expansion
Electrical properties, cured 7 days in air at 25ºC (77ºF) and
50% relative humidity
0114 D149 Dielectric strength kV/mm 21.6
0112 D150 Dielectric constant at 100Hz/100kHz 2.8
0112 D150 Dissipation factor at 100Hz/100kHz 0.0015
0112 D150 Volume resistivity Ohm.cm 1.5x1015
1. Extrusion rate: 3.2mm orifice at 0.62MPa.
* CTM: Corporate Test Method, copies of CTMs are available on request.
ASTM: American Society for Testing and Materials.
HOW TO USE
Substrate preparation
All surfaces must be clean and dry.
Degrease and wash off any
contaminants that could impair
adhesion. Suitable solvents include
isopropyl alcohol, acetone or methyl
ethyl ketone.
Unprimed adhesion may be obtained
on many substrates such as glass,
metals and most common engineering
plastics. Substrates to which good
adhesion is normally not obtained
include PTFE, polyethylene,
polypropylene and related materials.
• One-component adhesive/sealant
• Cures at room temperature when
exposed to moisture in the air
• Acetoxy cure system
• Non-sag, paste consistency
• Easy to apply
• Cures to a tough, flexible rubber
• Good adhesion to many substrates
• Stable and flexible from
-60ºC (-76ºF) to +180ºC (356ºF),
with short peaks up to +205ºC
(401ºF)
• Black version: stable and flexible
from -60ºC (-76ºF) to +205ºC
(401ºF), with short peaks up to
+230ºC (446ºF)
• Excellent dielectric properties
• Complies with MIL-A-46106
• Complies with FDA 177.2600
• Available in white, black or clear
Product Information