User Manual

datasheet
Version 0.9
2017-09-13
deRFsamR21E-23S00/-23S20 datasheet
www.dresden-elektronik.de
Page 12 of 36
Figure 7-3: Recommended Footprint for deRFsamR21E-23S20
The recommended
 pad size is 0.9 x 1.4 mm,
 solder mask clearance is 75 to 100 µm,
 stencil opening is 0.8 x 1.25 mm with stencil thickness 100 to 150 µm.
The 23S00 with internal antenna requires the user to follow the placement and layout
guidelines for best RF performance. For more details see Section 11.6 and 11.7.
With the RF-pad of 23S20 it is possible to implement antenna diversity and front-end design
for increased transmit power and receiver sensitivity as well as custom antenna design. More
details can be found in chapter 11.8.1 External front end and antenna diversity.
5.3. ECAD libraries
dresden elektronik offers schematic and footprint libraries for all available radio modules for
ECAD design software Altium Designer
®
[3] and Eagle
®
[5]. This allows a fast design-in of
radio modules into a custom product.
The pin-assignment in the schematic library is a suggestion for frequently used functions. A
detailed description on this configuration can be found in Section 10. The pins can be muxed
in many different ways with other functions depending on application needs. For more details
on that refer to Section 6.
5.4. STEP model library
dresden elektronik offers a STEP model library with all available OEM radio modules for CAD
design tools [7].