User's Manual

AA0133-BLE
- 11 -
ver 0.1
6.0 SOLDERING RECOMMENDATIONS
The B70 should be assembled using a standard lead-free, re-flow profile IPC/JEDEC
J-STD-020. The module can be soldered to the host PCB using a standard
lead or lead-free solder re-flow profiles, see Figure 6-1.
To avoid any damage to the B70, follow these recommendations:
• Do not exceed the peak temperature (TP) of +250°C
• Use no-clean flux solder paste
• Do not wash as moisture can be trapped under the shield
• Use only one flow. If PCB requires multiple flows, apply the module on the final flow.
FIGURE 6-1: RE-FLOW PROFILE