User's Manual

Document Number 001
DOC
–
Wifi Module Installation
Guide
Revision
006
© Dyson Technology Limited 2015
7
4.3. PCB Guidelines:
1. Ground via holes must be located close to module ground pads.
2. Signal traces must not run underneath the module on the layer where the module is mounted.
3. Have a complete ground pour in layer 2 for thermal dissipation.
4. Have a solid ground plane and ground via holes under the module for stable system and thermal
dissipation.
5. Increase the ground pour in the first layer and have all of the traces from the first layer on the
inner layers, if possible.
6. Signal traces can be run on a third layer under the solid ground layer, which is below the module
mounting layer.
7. Power traces can be run on a third layer. Use ground to insulate signal traces from power. Use
thick traces for power.
8. Use lots of ground stitches around the RF transmission line (0.5mm pitch)
9. RF transmission line is 50Ω grounded CPW with dimensions calculated using ‘AWR txline 2003’.
Dimensions calculated using the PCB stack detailed in Section 4.2 using Er 4.2, dielectric height
from layer 1 to layer 2 of 0.37mm and trace plating thickness of 0.043mm. Width(W) = 0.55mm,
Gap(G) = 0.23mm, Height(H)=0.37mm.
10. Lots of stitches for ground in general
11. Lots of ground stitches around the board
12. No signal or power traces running on the edge of the board.