Introduction to the E+E Digital Humidity and Temperature Sensor HTE501 The next generation of digital RH/T sensor combines accuracy and reliability to meet the highest current and future requirements. The integrated constant current heater as well as the innovative and proven E+E proprietary coating ensures outstanding performance even in harsh environments. In a DFN package with a footprint of only 2.5 x 2.5 mm, the HTE501 provides an exceptional accuracy of up to ±1.8 %RH incl.
CONTENTS Introduction to the E+E Digital Humidity and Temperature Sensor.......................................................1 1 Pin Configuration.................................................................................................................................5 2 Typical Application...............................................................................................................................5 3 Specifications..............................................................
LIST OF FIGURES Figure 1: DFN8 pin configuration....................................................................................................................................5 Figure 2: Typical application schematic...........................................................................................................................5 Figure 3: Humidity measurement accuracy @ 25 °C (incl. hysteresis)...........................................................................
LIST OF TABLES Table 1: List of HTEx specific acronyms..........................................................................................................................4 Table 2: HTE501 pin assignment....................................................................................................................................5 Table 3: Relative humidity sensor....................................................................................................................................
1 Pin Configuration Top view 8 7 6 5 1 2 3 4 SDA HI A1 SCL Bottom view GND A3 A2 VDD GND A3 A2 VDD 8 7 6 5 1 2 3 4 SDA HI A1 SCL Thermal pad internally connected to GND Figure 1: DFN8 pin configuration PIN # NAME PIN TYPE 1 SDA 2 HI Output open drain Indicates heater status and measurement invalid 3 A1 Input high-Z I2C device address pin, bit 1 of the 7 bit address; do not leave floating 4 SCL I/O with pull-up Serial clock line for I2C communication 5 VDD Power Positive suppl
3 Specifications 3.1 Relative Humidity Sensor PARAMETER CONDITION(S) MIN Operating range TYP 0 Periodic mode, Td < 80 °C Accuracy1)2) ±1.8 Hysteresis2) Resolution3) Repeatability4) Response time5) Long term drift6) MAX UNITS 100 %RH See Figure 3 %RH ±0.9 %RH 13 bit 0.02 %RH 13 bit 0.02 %RH 5 s <0.5% %RH/yr �63 Table 3: Relative humidity sensor Humidity Measurement Deviation @25°C ± DRH [%] +/‐ Humiditiy Deviation [%RH] 6.0 5.0 max 4.0 typ 3.0 2.0 1.0 0.
Genauigkeit_Temperatur ± ∆T [°C] HTEx Temperature accuracy ±1.0 ±0.9 ±0.8 max ±0.7 typ ±0.6 ±0.5 ±0.4 ±0.3 ±0.2 ±0.1 ±0.0 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 110 120 130 T [°C] Figure 4: Temperature sensor accuracy 12.07.2016 Haider Albin 3.3 1/1 Recommended Operating Conditions Humidity and temperature: The sensor shows best performance when operated within the normal operating conditions (dark green area in Figure 5).
4 Electrical Characteristics 4.1 Absolute Maximum Ratings The absolute maximum ratings as given in Table 5 are stress ratings only and give additional information. Functional operation of the device at these conditions is not implied. Exposure to absolute maximum rating conditions for extended periods may affect the device reliability (e.g. hot carrier degradation, oxide breakdown). PARAMETER SYMBOL MIN MAX UNIT Power Supply VDD -0.3 3.6 V Digital I/O pins VLOGIC -0.3 5.
PARAMETER Input voltage Output voltage Internal pull-up resistor External pull-up resistor Capacitive bus load 1) SYMBOL CONDITION / COMMENT VIL Low level VIH High level VOL Current into pin: IOL= 4.0 mA VOH High level open drain VDD=3.60 V & pin voltage = 0.7*VDD VDD=3.30 V & pin voltage = 0.7*VDD VDD=3.00 V & pin voltage = 0.7*VDD VDD=2.35 V & pin voltage = 0.7*VDD At I²C lines, pull-up current ≤4.0 mA @ 3.3 V Standard RPUPI RPUPE CB MIN TYP 0.7*VDD 0 0.725 0.25 MAX UNIT 0.
PARAMETER SYMBOL CONDITION / COMMENT Power-up time tPWRU Reset time tRESET T-Measurement tT RH-Measurement tRH TYP UNIT 1.1 ms 0.9 ms 8 bit resolution 0.3 ms 9 bit resolution 0.6 ms 10 bit resolution 1.2 ms 11 bit resolution 2.3 ms 12 bit resolution 4.5 ms 13 bit resolution 8.9 ms 14 bit resolution 17.8 ms 8 bit resolution 0.1 ms 9 bit resolution 0.3 ms 10 bit resolution 0.5 ms 11 bit resolution 1.0 ms 12 bit resolution 2.0 ms 13 bit resolution 4.
TEMPERATURE HUMIDITY bit Resolution [°C] Resolution [%RH] 14 0.01 0.01 13 0.01 0.02 12 0.02 0.04 11 0.06 0.09 10 0.11 0.18 9 0.21 0.35 8 0.42 0.69 Table 10: Measurement resolution 5 Interface 5.1 Pin Configuration, Assignment and Description Please refer to chapter 1. 5.2 Supply Pins (VDD, GND) The supply pins must be equipped with a bypass ceramic capacitor of at least 100nF.
5.3 I2C Communication The I²C communication is based on the NXP UM10204 I²C bus specification and user manual1). The HTE501 supports the modes “standard“ (100 kHz), “fast mode“(400 kHz) and “fast mode plus” (1 000 kHz). The sensor works as SLAVE and needs to be queried by a MASTER. Please consider self-heating due to a low RPU when the sensor has to sink the pull-up current. In this case, the residual voltage on the SCL or SDA pin briefly generates a power loss in the sensor. Example: 4mA * 0.4V = 1.
6 Sensor Communication 6.
READ Measureme Measurement COMMAND Singl Shot Measureme READ Measureme Measurement COMMAND Singl Shot Measureme Single Measureme at power up optional COMMA Fetch Measureme VPORP time 0V tPWRU tMEAS tMEAS Time until next COMMAND tMEAS Time until next COMMAND Periodic mode 2.
6 5 4 3 2 1 6 5 4 3 2 1 I2C-ADDRESS I2C-ADDRESS R/W R/W S S 7 7 7 6 W A 7 0 0 W A 0 0 6 5 4 5 4 CMD 2 1 0 7 6 5 4 3 2 1 0 3 2 MSB 3 1 0 A 7 0 A 0 6 5 4 3 2 1 0 CMD LSB CMD LSB 16 BIT COMMAND 16 BIT COMMAND stretching has been issued, CMD MSB A 0 A 0 P P ! ! S S 7 6 5 4 3 2 1 7 6 5 4 3 2 1 I2C-ADDRESS I2C-ADDRESS R/W R/W I²C Datenstruktur I²C Datenstruktur R 1 R 1 NEXT 1 NEXT 1 ! !N 1 1 1 N 1 SCL FREE FOR OTHER BUS MEMBERS MEASUREMENT
6.6 Fetch Periodic RH&T Measurement Results (0xE000) Readout of calculation results in periodic measurement mode can be performed using the fetch command. This is similar to the readout of measurement results in single-shot mode, except that clock stretching is always disabled. The slave will answer with NACK if no measurement results are available.
6.8 Break Command (0x3093) The periodic measurement mode can be stopped using the break command. After finishing an ongoing measurement, the sensor will enter the idle mode. An ongoing measurement can delay the transition into the idle mode.
6.10 Status Register (0xF32D, 0xF352, 0x3041) The sensor implements two 16 bit status registers.
3 POR 0: no POR since status 1 clear 1: POR occurred This bit is cleared upon the Clear Status Register 1 command 2 Reserved - 1 Reserved - 0 CRC 1: checksum of the latest write transfer failed Table 12: Status Register 1 BIT 15 NAME DESCRIPTION NEW_MEAS 14 NEW_T_MEAS 13 NEW_RH_MEAS 12 NEW_TD_MEAS 11 Reserved New measurement (T, RH) since last readout available New T value since last readout available Cleared upon start of T/RH readout New RH value since last readout available Clear
6.11 Read Identification (0x7029) Each sensor device has a specific 8-byte identification This Identification allows a factory backtracking of each device. When the following command is issued, the I2C slave sends all 8 bytes consecutively, followed by a CRC8 checksum (see chapter 6.14).
Switching on/off the heater: Command CMD Hex Code MSB Heater ON 0x30 I²C Heater OFF 6 5 4 0x66 Datenstruktur 3 2 1 R/W 7 S LSB 0x6D 7 W A 0 0 I2C ADDRESS 6 5 4 3 2 1 0 7 6 A 0 CMD MSB=0x30 5 4 3 2 1 0 A 0 CMD LSB=0x6? P 16 BIT COMMAND Figure 23: Constant current heater commands At any kind of reset the heater gets deactivated automatically. The heater current value is adjustable between 5 mA and 80 mA. The default value for the heater current after power-up is 5 mA.
ADDRESS DEFAULT VALUE FUNCTION DESCRIPTION BIT 0x08 0x0F 0x10 0x11 Heater settings Measurement resolution 0x07 (0000 0111) 5 mA, Heater off 0x2D (0010 1101) T = 13 bit RH = 13 bit Measurement interval in periodic mode 0x0014 1 second 7 NAME R/W Reserved - DESCRIPTION - 6:3 CURRENT R/W Select constant current for heater I = (CURRENT + 1) * 5 mA CURRENT = 0...15, I = 5...
T1 x T2 b E E2 e D S A L D2 Figure 26: Package layout PARAMETER SYMBOL MIN. NOM. MAX. UNIT Package width D 2.40 2.50 2.60 mm Package length E 2.40 2.50 2.60 mm Package height A 0.80 0.90 1.00 mm Cavity diameter S 1.30 mm On top of package Leadframe height Not shown in the drawing A3 0.20 mm Pad pitch e 0.50 mm Pad width b 0.20 0.25 0.30 mm Pad length L 0.30 0.35 0.40 mm Thermal pad length D2 1.00 1.10 1.20 mm Thermal pad width E2 1.70 1.
Orientation on the tape: Figure 28: Orientation on the tape 6.17 Traceability There are two possibilities for identification / traceability: 1. Read identification command (0x7029): serial number of each individual sensor (see description of command 0x7029) 2. Laser marking: A triangular mark at the top left indicates pin 1. The upper line represents the designation of the component and consists of up to 6 characters. The “x” is a placeholder for the exact type, e.g. 501.
6.19 Recommended Layout Recommended Land Pattern Recommended Stencil Aperture 2.5 0.95 0.5 0.5 0.5 0.5 0.5 1.8 0.5 0.27 0.27 2.5 1.1 0.3 0.6 0.6 0.3 0.6 Figure 30: Recommended land pattern and stencil aperture 7 Quality The HTEx qualification is performed based on the JEDEC JESD47 qualification test method. The device is fully RoHs and WEEE compliant. 8 Additional Documentation DOCUMENT DESCRIPTION LINK HTE501 Handling Instructions www.epluse.
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