Information

ManualsBrandsE+E Elektronik ManualsActive ComponentsHTE501-TRCT Temperature and humidity sensor -40 up to 135 °C

HANDLING INSTRUCTIONS

HTE501

1 Introduction

This document provides handling instructions for the digital humidity and temperature sensors HTE501.

2 Processing Information

2.1 Storage Instructions

The HTE501 is a highly accurate temperature and humidity sensor. Therefore the storage instructions

should be precisely followed. Pursuant to IPC/JEDEC J-STD-020E the Moisture Sensitivity Level (MSL) is

1. At the same time, it is recommended to further process the sensors within 1 year after date of delivery.

Please also note that high chemical vapors and long exposure times can influence the characteristic of the

sensor.

It is advisable to keep the sensor package in the original manufacturing packaging. If it is compulsory to

remove the packaging, ESD trays made from PS (Polystyrol) are recommended, keeping the storage

temperature in the range of 0...55 °C. In addition, sealed ESD bags are further recommended.

2.2 Soldering Instructions

For mechanical as well as electrical connection the pads have to be soldered to the PCB. The center pad

(die pad) may be left floating, anyway it is recommended to connect it to the PCB for accurate

measurement results.

Except for the exposed die pad, the lands should be 0.05 mm larger than the package pads and 0.2 mm

longer at the outward side. For the exact dimensions of the land pattern, please see the product datasheet.

For soldering, a lead-free, air, and nitrogen reflowable no-clean type 3 solder paste, which meets the

requirements of the RoHS Directive 2002/95/EC, Art. 4, as well as the standards by J STD 004 is

recommended. As an example, the solder paste EM 907 from Kester is one of these candidates,

exceeding the reliability standards required by J-STD-004B-WAM1. A typical soldering profile for this

soldering paste can be found below in Figure 1.

Kester Reflow Profile

SnAgCu Alloys

100

150

200

250

300

0 30 60 90 120 150 180 210 240 270 300

Time (sec.)

Temperature (C)

Pre-heating Zone

(2.0-4.0 min. max.)

Soaking Zone

(2.0 min.max.)

60-90 sec. typical

Reflow Zone

time above 217 C

(90 sec max)

60-75 sec. typical

Peak Temp.

235 - 255 C

<2.5 C/Sec

Figure 1: Recommended reflow profile using a standard reflow soldering oven

Summary of content (3 pages)

PAGE 1
HANDLING INSTRUCTIONS HTE501 1 Introduction This document provides handling instructions for the digital humidity and temperature sensors HTE501. 2 Processing Information 2.1 Storage Instructions The HTE501 is a highly accurate temperature and humidity sensor. Therefore the storage instructions should be precisely followed. Pursuant to IPC/JEDEC J-STD-020E the Moisture Sensitivity Level (MSL) is 1.
PAGE 2
Please note that in case of several soldering cycles the humidity sensor is soldered in the last one to avoid contamination of the active area. It is advisable to keep this solder paste refrigerated at 0 - 10°C. Prior to printing, the solder paste should be stabilized at room temperature. Please contact Kester for additional information. The sensor is assigned a process sensitivity level (PSL) according to EIA/IPC/JEDEC J-STD-075A.
PAGE 3
2.4.4 Performance Measurement In order to obtain precise, repeatable and meaningful measurement results, it is absolutely necessary to subject the test samples to a defined procedure consisting of a defined heating and reconditioning step before a characteristic curve can be measured. The following procedure must be followed: 1) Heat the sensors from room temperature to 125 °C 2) Store them at 125 °C ±5 °C for at least 6 hours. 3) Allow the sensor to cool down to room conditions 4) Moistening: a.