Datasheet

Application Guidelines

Temperature curve wave soldering

Green curve:

Temperature on the component side of the pcb

Red curve:

Temperature on the soldering side of the pcb

Room temperature:

Temp 1

Preheating:

Temperature process = Temp 1 … Temp 2

Process time = t1 … t2

Ramp up to soldering temperature:

Process time = t2 … t3

Soldering phase:

Temperature process = Temp 3

Process time = t3 … t4

Iron soldering

Basic specication for iron soldering IEC 60068-2-20

Maximum temperature at tip of iron:

320 °C

Maximum soldering time:

3 sec

Cleaning/Lacquering

The switching elements are not sealed. Cleaning up the PCB may

damage the contacts in the switching elements. For this reason,

the following points should be noted:

–

When soldering make sure that the ux does not pass on the

upper side of the PCB.

–

When cleaning the PCB with detergents ensure that no dust

or other debris may get inside of the switching elements.

–

Ensure that no lacquer penetrates into the interior of the

switching element when lacquering the PCB.

Storage of components

To obtain the optimum solderability of the components, the fol-

lowing points should be noted during storage:

– Do not store components in locations with high temperature

or humidity.

– Do not expose components to corrosive gases.

– Avoid direct sunlight for a long period.

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