Datasheet
Application guidelines
Temperature curve wave soldering
Green curve:
Temperature on the component side of the pcb
Red curve:
Temperature on the soldering side of the pcb
Room temperature:
Temp 1
Preheating:
Temperature process = Temp 1 … Temp 2
Process time = t1 … t2
Ramp up to soldering temperature:
Process time = t2 … t3
Soldering phase:
Temperature process = Temp 3
Process time = t3 … t4
Iron soldering
Basic specication for iron soldering IEC 60068-2-20
Maximum temperature at tip of iron:
320 °C
Maximum soldering time:
3 sec
Cleaning/Lacquering
The switching elements are not sealed. Cleaning up the PCB may
damage the contacts in the switching elements. For this reason,
the following points should be noted:
–
When soldering make sure that the ux does not pass on the
upper side of the PCB.
–
When cleaning the PCB with detergents ensure that no dust
or other debris may get inside of the switching elements.
–
Ensure that no lacquer penetrates into the interior of the
switching element when lacquering the PCB.
Storage of components
To obtain the optimum solderability of the components, the fol-
lowing points should be noted during storage:
– Do not store components in locations with high temperature
or humidity.
– Do not expose components to corrosive gases.
– Avoid direct sunlight for a long period.
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