Ff Wi-Fi Module E W N - 8 8 2 2 C S S 3 AH S P E C I F I C A T I O N V 1.4 IEEE 802.11b/g/n/a/ac SDIO Wireless + Bluetooth 2.1/3.0/4.2/5.0 Module E-mail：sales@eardatek.com Earda Technologies Co.
Module：EWN-8822CSS3AH Contents 1 General Specifications ------------------------------------------------- - 3 - 2 Features --------------------------------------------------------------- - 3 2.1 WLAN -------------------------------------------------------------------- - 3 - 2.
Module：EWN-8822CSS3AH 1 General Specifications The module provides a complete solution for a high-performance integrated wireless and Bluetooth device . It provides SDIO interface for WiFi and HS-UART interface for Bluetooth. The module complies with IEEE 802.11 a/b/g/n/ac 2T2R MIMO standard , and Maximum PHY data rate up to 173.3 Mbps using 20 MHz bandwidth ,400 Mbps using 40 MHz bandwidth, and 866.7 Mbps using 80 MHz bandwidth. 2 Features 2.1 WLAN Supports 802.
Module：EWN-8822CSS3AH Short Guard Interval(400ns) Sounding packet 2.2 Bluetooth Compatible with Bluetooth v2.1 and v3.0 Systems Supports Bluetooth 4.1 features Supports Bluetooth 4.2 LE Secure Connection by upper layer software upgrade Support Bluetooth 5.0 and LE 5.0 system Supports all packet types in basic rate and enhanced data rate Supports pico-nets in a scatter-net Supports Secure Simple Pairing Bluetooth 5.
Module：EWN-8822CSS3AH 4 PHY Specification 4.1 Wi-Fi Specification Table 1 EWN-8822CSS3AH Wi-Fi RF Parameters Protocol IEEE 802.11b/g/n/a/ac Interface SDIO 1.1 / 2.0 / 3.0 2.4GHz band CH1~CH14/2400-2483.5MHz 5GHz Band CH36~CH48/5150-5250MHz CH52~CH64/5250-5350MHz Frequency CH100~CH140/5470-5725MHz CH149~CH165/5725-5850MHz 2.4G&5G Band Refer to Channel Plan Domain Code Bandwidth 20/40/80 MHz Maximum PHY data rate up to 173.
Module：EWN-8822CSS3AH 5G Transmit Power 802.11n (2.4G HT20 MCS4): ≤-22dB 802.11n (2.4G HT20 MCS7): ≤-30dB 802.11n (2.4G HT40 MCS0): ≤-8dB 802.11n (2.4G HT40 MCS4): ≤-22dB 802.11n (2.4G HT40 MCS7): ≤-30dB 802.11a (5G 54Mbps): 17 +1/-2dBm 802.11n (5G HT20 MCS7): 16 +1/-2dBm 802.11n (5G HT40 MCS7): 16 +1/-2dBm 802.11ac (5G VHT20 MCS8): 14 +1/-2dBm 802.11ac (5G VHT40 MCS9): 14 +1/-2dBm 802.11ac (5G VHT80 MCS9): 14 +1/-2dBm Other TX power rate see the “power by rate” 5G EVM 2.
Module：EWN-8822CSS3AH 5G Receive Sensitivity @ PER<10% 802.11g (2.4G 24Mbps): -79dBm (Max.) -83dBm (Typ.) 802.11g (2.4G 54Mbps): -70dBm (Max.) -77dBm (Typ.) 802.11n (2.4G HT20 MCS0): -87dBm (Max.) -95dBm (Typ.) 802.11n (2.4G HT20 MCS4): -75dBm (Max.) -80dBm (Typ.) 802.11n (2.4G HT20 MCS7): -69dBm (Max.) -77dBm (Typ.) 802.11n (2.4G HT40 MCS0): -84dBm (Max.) -92dBm (Typ.) 802.11n (2.4G HT40 MCS4): -72dBm (Max.) -76dBm (Typ.) 802.11n (2.4G HT40 MCS7): -66dBm (Max.) -73dBm (Typ.) 802.
Module：EWN-8822CSS3AH 1Mbps for Basic Rate; PHY Rate 2、3 Mbps for Enhanced Data Rate; 1、2 Mbps for BLE Transmit Power 6dBm, typical <-89dBm @ BER=0.1% for GFSK (1Mbps); <-90dBm @ BER=0.01% for π/4-DQPSK (2Mbps); Receive Sensitivity <-83dBm @ BER=0.01% for 8PSK (3Mbps); <-90dBm @ PER=30.8% for BLE GFSK(1Mbps): -20dBm; Maximum Input level π/4-DQPSK (2Mbps): -20dBm; 8PSK(3Mbps): -20dBm.
Module：EWN-8822CSS3AH 7 S11 Report FIG 2 EWN-8822CSS3AH 2.4G Path A FIG 3 EWN-8822CSS3AH 2.4G Path B Waiting for your suggestion at anytime. -9- E-mail：sales@eardatek.
Module：EWN-8822CSS3AH FIG 4 EWN-8822CSS3AH 5G Path A FIG 5 EWN-8822CSS3AH 5G Path B Waiting for your suggestion at anytime. - 10 - E-mail：sales@eardatek.
Module：EWN-8822CSS3AH 8 Module configurations Module Dimension (L*W*T)： 15.2±0.2mm*13.2±0.2mm*2.1±0.2mm。 2.1±0.2 FIG 6 EWN-8822CSS3AH Module Dimension Recommended Footprint : FIG 7 EWN-8822CSS3AH Module Dimension Waiting for your suggestion at anytime. - 11 - E-mail：sales@eardatek.
Module：EWN-8822CSS3AH 9 Pin Definition FIG 8 TOP VIEW See table 5 for the module hardware pin definition. Table 5 EWN-8822CSS3AH Pin Description Power Pin Definition Description 1 GND Ground - - 2 Wi-Fi B Wi-Fi Path B ANT I/O port - - 3 GND Ground - - 4 GND Ground - - 5 GND Ground - - Waiting for your suggestion at anytime. Supply - 12 - Power level E-mail：sales@eardatek.
Module：EWN-8822CSS3AH Power Pin Definition Description 6 GND Ground - - 7 GND Ground - - 8 GND Ground - - 9 Wi-Fi A Wi-Fi Path A ANT I/O port - - 10 GND Ground - - 11 GND Ground - - 12 BT_ANT Bluetooth ANT I/O port - - 13 GPIO6 General Purpose Input/Output Pin VDDIO Depend On VDDIO 14 G_BT General Purpose Input/Output Pin VDDIO Depend On VDDIO 15 WL_REG_ON Low asserting reset for Wi-Fi core VDDIO Depend On VDDIO 16 WL_WAKE_HOST WLAN to wake-up the host
Module：EWN-8822CSS3AH Power Pin Definition Description 37 NC No connect - - 38 BT_REG_ON Low asserting reset for Bluetooth core VDDIO Depend On VDDIO 39 GND Ground - - 40 UART_TXD VDDIO Depend On VDDIO 41 UART_RXD VDDIO Depend On VDDIO 42 UART_RTS_N Bluetooth UART interface VDDIO Depend On VDDIO 43 UART_CTS_N Bluetooth UART interface VDDIO Depend On VDDIO 44 SD_RESET SDIO interface reset VDDIO Depend On VDDIO 45 G_WL General Purpose Input/Output Pin VDDIO Depend
Module：EWN-8822CSS3AH 10 Module Photos PIN1 FIG 9 Diplexers : LD18D2450LAN-D40/M (佳利) FIG 10 Diplexers : RFDIP1607L132A8D1T (华科) FIG 11 TOP VIEW Waiting for your suggestion at anytime. FIG 12 BOTTOM VIEW - 15 - E-mail：sales@eardatek.
Module：EWN-8822CSS3AH 11 Key material list Table 6 EWN-8822CSS3AH Key material list Type Model LD18D2450LAN-D40/M Diplexers Footprint QTY. 1608 2PCS RFDIP1607L132A8D1T IC RTL8822CS-VS-CG QFN76 1 PCS Crystal 40MHz （CX/YDL/JWT/TJ） X3225 1 PCS Waiting for your suggestion at anytime. - 16 - E-mail：sales@eardatek.
Module：EWN-8822CSS3AH 12 Package Information Carrier dimension: （Unit : mm） FIG 13 Carrier size Reel dimension： D=38cm 1400PCS Modules Per Reel FIG 14 Reel Waiting for your suggestion at anytime. FIG 15 Reel figure - 17 - E-mail：sales@eardatek.
Module：EWN-8822CSS3AH 13 Reference design 13.1 Power supply requirement The module power supply voltage is DC+3.3V, and the maximum module current is 800mA. The power supply design needs to consider the output current and power interference. To avoid the +3.3V power supply from interfering with other circuits on the motherboard, it is recommended to supply to the module using the regulator circuit alone. the recommended DC-DC circuit structure shown in the figure below. A 4.
Module：EWN-8822CSS3AH 13.2 SDIO Interface The SDIO interface has 4 data lines, a cock signal line and a command signal line. all of the SDIO lines must be equal length. In order to avoid mutual interference, SDIO lines should be avoided to be adjacent and parallel to other data lines, RF lines and power lines, and Surround the data line and clock line with ground copper. 13.3 RF circuit Due to the SMD package, the RF port impedance must be offset after the module is soldered to the motherboard.
Module：EWN-8822CSS3AH distance from RF routing layer to GND of the next layer. There are RF lines Layout principles : 1. RF line layout needs to match 50 ohms. The line width can be calculated by professional software. (Note: If it is a multi-layer board, The board thickness should calculate the distance from the RF trace layer to the next ground layer.) 2. The RF line must be surrounded by ground copper and ground holes. 3.
Module：EWN-8822CSS3AH 13.4 Motherboard interference avoidance Motherboard interference comes from: high-speed data interface (HDMI), the Operating frequency of main chip, DDR, DC-DC power supply. The method of avoiding interference according to the characteristics of various signals is also different. The main methods of interference avoidance include : 1. keeping away from the source of interference; 2. Adding shields to avoid interference leakage; 3. Reasonable layout to eliminate interference. 13.4.
Module：EWN-8822CSS3AH FIG 21 HDIM and USB interference 13.4.2 The main chip interferes with DDR Because the main chips operate at about 800MHz or DDR2 operate at 667MHz, 3x frequency of 800MHz and 4x frequency of 667MHz are near 2.4GHz band. It must to place Wi-Fi modules and antennas far away from the main chip and DDR. It is strongly recommended that the main chip be isolated from the DDR by a shield. As shown in the figure below.
Module：EWN-8822CSS3AH 13.5 Recommended secondary reflux temperature curve The number of reflux shall not exceed 2 times, and the tin feeding height of the half hole of the module shall be no less than 1/4. The lead-free reflux curve requirements of Wi-Fi module products are shown in figure23： FIG 23 Furnace temperature curve NOTE: 1.The maximum furnace temperature of the module is 260℃, don't exceed this temperature. 2.The gold plating thickness of the module pad is 2u".
Module：EWN-8822CSS3AH 14 Revision History Summary Revised By Revision Release Date V1.0 2021-04-25 First release Jisheng Wang V1.1 2021-09-14 Update PHY specification Jisheng Wang V1.2 2021-11-24 Update BT spceification Jisheng Wang V1.3 2021-11-24 Update BT spceification Jisheng Wang V1.4 2022-03-25 Add Chinese name of Eardatek Jisheng Wang Waiting for your suggestion at anytime. - 24 - E-mail：sales@eardatek.
FCC Statement This device complies with part 15 of the FCC rules. Operation is subject to the following two conditions: (1) thi s device may not cause harmful interference, and (2) this device must accept any interference received, incl uding interference that may cause undesired operation. Changes or modifications not expressly approved by the party responsible for compliance could void the user’ s authority to operate the equipment.
Integration instructions for host product manufacturers according to KDB 996369 D03 OEM Manual v01 2.2 List of applicable FCC rules CFR 47 FCC PART 15 SUBPART C has been investigated. It is applicable to the modular transmitter 2.3 Specific operational use conditions This module is stand-alone modular.
