Product Specs

Table Of Contents
4 Pin assignments
Page
15
Pin
Name
Type
Description
44
NC
No connect
Leave unconnected
45
VSS
Power
Ground
46
DEC4
Power
1.3 V regulator supply decoupling
Input from DC/DC regulator
Output from 1.3 V LDO
47
DCC
Power
DC/DC regulator output
48
VDD
Power
Power supply
Bottom of chip
Die pad
VSS
Power
Ground pad
Exposed die pad must be connected
to ground (VSS) for proper device
operation.
4.2 WLCSP ball assignments
1 2 3 4
A
B
C
D
E
F
G
H
5 6 7
Figure 3: WLCSP ball assignments, top view
Table 3: WLCSP ball assignments
Ball
Name
Description
A1
XC2
Analog input
Connection for 32 MHz crystal
A2
DEC2
Power
1.3 V regulator supply decoupling (Radio
supply)
A3
P0.28
Digital I/O
General purpose I/O
3
AIN4
Analog input
SAADC/COMP/LPCOMP input
A4
P0.29
Digital I/O
General purpose I/O
3
AIN5
Analog input
SAADC/COMP/LPCOMP input
A5
P0.30
Digital I/O
General purpose I/O
3
AIN6
Analog input
SAADC/COMP/LPCOMP input
A6
DEC4
Power
1.3 V regulator supply decoupling
Input from DC/DC converter. Output
from 1.3 V LDO
A7
VDD
Power
Power supply
B2
XC1
Analog input
Connection for 32 MHz crystal
B3
P0.25
Digital I/O
General purpose I/O
3
1
See GPIO located near the radio on page 17 for more information.
2
See NFC antenna pins on page 17 for more information.
N52832
CIAAHP
YYWWLL