Datasheet

EVE GmbH • phone +49 (0) 25 72 / 93 51 - 0 • fax +49 (0) 25 72 / 93 51 - 24 • email info@eve.de • www.eve.de • www.econconnect.de

Jacks, unshielded

Modular

PCB, Low Prole

SPECIFICATION:

Current rang: 1.5 A

Insulaon resistance: 500 MΩ min.

Contact resistance: 40 mΩ max.

Dielectric voltage: 1000 V AC

Operaon temperature: 0 °C to +70 °C

MATERIAL:

Housing: PBT UL94V-0

Contacts: Phosphorbonze

Solder pins: Phosphorbronze

FINISH:

Contacts: Gold over nickel

Solder pins: Tin over nickel

HANDLING:

Processing: Wave soldering

Packing: Tray

TOLERANCE:

.X ± 0.38

.XX ± 0.25

Dimensions

Posions: A

6 12.96

8 15.00

10 15.00

Order-Informaon

Idener:

Posions:

Conductors:

Contact Plang:

MEB

Modular Jack low prole, unshieldet, PCB mount 6: 6P 6: 6C empty: 6 µ“ Gold *

8: 8P 8: 8C B: 15 µ“ Gold

10: 10P 10: 10C C: 30 µ“ Gold

D: 50 µ“ Gold

* = standard

PAGE 1
Modular Jacks, unshielded PCB, Low Profile SPECIFICATION: Current rating: Insulation resistance: Contact resistance: Dielectric voltage: Operation temperature: MATERIAL: Housing: Contacts: Solder pins: 1.5 A 500 MΩ min. 40 mΩ max. 1000 V AC 0 °C to +70 °C PBT UL94V-0 Phosphorbonze Phosphorbronze FINISH: Contacts: Solder pins: Gold over nickel Tin over nickel HANDLING: Processing: Packing: Wave soldering Tray TOLERANCE: .X .XX ± 0.38 ± 0.25 Dimensions Positions: A 6 12.96 8 15.00 10 15.