M12 Quectel Cellular Engine Hardware Design M12_HD_V3.
M12 Hardware Design Document Title M12 Hardware Design Revision 3.3 Date 2012-10-25 Status Released Document Control ID M12_HD_V3.3 l e t l c a i e t u n Q fide n o C General Notes Quectel offers this information as a service to its customers, to support application and engineering efforts that use the products designed by Quectel. The information provided is based upon requirements specifically provided for customers of Quectel.
M12 Hardware Design Contents Table Index........................................................................................................................................ 4 Figure Index ...................................................................................................................................... 5 0. Revision history ............................................................................................................................ 7 1. Introduction ...................
M12 Hardware Design 3.10. SIM card interface ........................................................................................................... 50 3.10.1. SIM card application ............................................................................................. 50 3.10.2. SIM card holder ..................................................................................................... 52 3.11. ADC...........................................................................................
M12 Hardware Design Table Index TABLE 1: RELATED DOCUMENTS ............................................................................................. 8 TABLE 2: TERMS AND ABBREVIATIONS .................................................................................. 9 TABLE 3: MODULE KEY FEATURES ........................................................................................ 13 TABLE 4: CODING SCHEMES AND MAXIMUM NET DATA RATES OVER AIR INTERFACE ...............................................
M12 Hardware Design Figure Index FIGURE 1: MODULE FUNCTIONAL DIAGRAM ...................................................................... 16 FIGURE 2: TOP VIEW OF MODULE PIN ASSIGNMENT......................................................... 18 FIGURE 3: VOLTAGE RIPPLE DURING TRANSMITTING...................................................... 25 FIGURE 4: REFERENCE CIRCUIT FOR THE VBAT INPUT .................................................... 26 FIGURE 5: REFERENCE CIRCUIT FOR POWER SUPPLY ..............
M12 Hardware Design FIGURE 42: REFERENCE CIRCUIT OF THE STATUS ............................................................. 58 FIGURE 43: REFERENCE CIRCUIT OF SD CARD ................................................................... 59 FIGURE 44: REFERENCE CIRCUIT OF RF INTERFACE ......................................................... 61 FIGURE 45: RECOMMENDATION OF RF PAD WELDING ..................................................... 63 FIGURE 46: M12 TOP AND SIDE DIMENSIONS（UNIT: MM） ................
M12 Hardware Design 0. Revision history Revision Date Author Description of change 1.0 2010-07-20 Yong AN Initial 1.1 2010-11-30 Yong AN Added Chapter 4.5 for RF pad welding. 3.0 2012-02-14 Layne YE 1. 2. 3. 4. 5. 3.1 Modified the power supply range. Modified buzzer interface as RESERVED. Modified the display interface as SD interface. Modified the peak current in a transmitting burst. Modified the current consumption in GSM talk mode and GPRS communication mode. 6.
M12 Hardware Design 1. Introduction This document defines the M12 module and describes its hardware interface which are connected with the customer application and the air interface. This document can help customer quickly understand module interface specifications, electrical and mechanical details. Associated with application notes and user guide, customer can use M12 module to design and set up mobile applications easily. l e t l c a i e t u n Q fide n o C 1.1.
M12 Hardware Design 1.2.
M12 Hardware Design Abbreviation Description Li-Ion Lithium-Ion MO Mobile Originated MS Mobile Station (GSM engine) MT Mobile Terminated PAP Password Authentication Protocol PBCCH Packet Switched Broadcast Control Channel PCB Printed Circuit Board PDU Protocol Data Unit PPP Point-to-Point Protocol RF RMS RTC RX SIM SMS l e t l c a i e t u n Q fide n o C Radio Frequency Root Mean Square (value) Real Time Clock Receive Direction Subscriber Identification Module Short Message Service
M12 Hardware Design Abbreviation Description SM SIM phonebook 1.3. Safety cautions The following safety precautions must be observed during all phases of the operation, such as usage, service or repair of any cellular terminal or mobile incorporating M12 module. Manufacturers of the cellular terminal should send the following safety information to users and operating personnel and to incorporate these guidelines into all manuals supplied with the product.
M12 Hardware Design GSM cellular terminals or mobiles operate over radio frequency signal and cellular network and cannot be guaranteed to connect in all conditions, for example no mobile fee or an invalid SIM card. While you are in this condition and need emergent help, Please Remember using emergency call. In order to make or receive call, the cellular terminal or mobile must be switched on and in a service area with adequate cellular signal strength.
M12 Hardware Design 2. Product concept M12 is a Dual-band GSM/GPRS engine that works at frequencies of GSM900MHz and DCS1800MHz. M12 features GPRS multi-slot class 12 and supports the GPRS coding schemes CS-1, CS-2, CS-3 and CS-4. For more details about GPRS multi-slot classes and coding schemes, please refer to Appendix A and Appendix B. With a tiny profile of 29mm×29mm×3.
M12 Hardware Design DATA GPRS CSD SMS Restricted operation: -40°C ~ -35°C and +75°C ~ +80°C 1) Storage temperature: -45°C ~ +85°C GPRS data downlink transfer: max. 85.6 kbps GPRS data uplink transfer: max. 85.
M12 Hardware Design might occur. For example, the frequency error or the phase error could increase. Table 4: Coding schemes and maximum net data rates over air interface Coding scheme 1 Timeslot 2 Timeslot 4 Timeslot CS-1: 9.05kbps 18.1kbps 36.2kbps CS-2: 13.4kbps 26.8kbps 53.6kbps CS-3: 15.6kbps 31.2kbps 62.4kbps CS-4: 21.4kbps 42.8kbps 85.6kbps l e t l c a i e t u n Q fide n o C 2.2.
M12 Hardware Design RF_ANT ESD SAW Filter RF PAM VBAT PWRKEY PMU RF Transceiver 26MHz Reset EMERG_OFF VRTC SD Interface SD Interface l e t l c a i e t u n Q fide n o C RTC 32KHz ADC ADC GPIO & Status& Netlight GPIO UART Serial Interface BB&RF Audio Audio SIM Interface Memory Interface SIM Interface Serial Flash Figure 1: Module functional diagram 2.3.
M12 Hardware Design 3. Application interface The module is equipped with a 64-pin 1.3mm pitch SMT pad that connects to the cellular application platform. Sub-interfaces included in these pads are described in detail in the following chapters: Power supply (refer to Section 3.3) Serial interfaces (refer to Section 3.8) Audio interfaces (refer to Section 3.9) SIM interface (refer to Section 3.10) SD interface (refer to Section 3.
M12 Hardware Design l e t l c a i e t u n Q fide n o C Figure 2: Top view of Module pin assignment 3.1.2. Pin description Table 5: Pin description Power supply PIN NAME PIN NO. I/O DESCRIPTION DC CHARACTERISTICS COMMENT VBAT 50,51 52 I Module main power supply. VBAT=3.3V~4.6V Vmax= 4.6V Vmin=3.3V Vnorm=4.0V It must be able to provide sufficient current in a transmitting burst which typically M12_HD_V3.
M12 Hardware Design rises to 1.6A. VRTC 16 I/O Power supply for RTC when VBAT is not supplied. Charging for backup battery or golden capacitor when the VBAT is supplied. VImax=3.3V VImin=1.5V VInorm=2.8V VOmax=2.85V VOmin=2.6V VOnorm=2.8V Iout(max)= 1mA Iin=2.6~5 uA Recommended to connect to a backup battery or a golden capacitor. VDD_EXT 7 O Supply 2.8V voltage for external circuit. Vmax=2.9V Vmin=2.7V Vnorm=2.8V Imax=20mA 1. If unused, keep this pin open. 2. Recommended to add a 2.2~4.
M12 Hardware Design Module status indication PIN NAME PIN NO. I/O DESCRIPTION DC CHARACTERISTICS COMMENT STATUS 54 O Used to indicate module’s operating status. High level indicates module power-on and low level indicates power-down. VOLmax= 0.15×VDD_EXT VOHmin= 0.85×VDD_EXT If unused, keep this pin open. Audio interfaces l e t l c a i e t u n Q fide n o C PIN NAME PIN NO. I/O DESCRIPTION DC CHARACTERISTICS COMMENT MIC1P MIC1N 23 24 I Positive and negative voice-band input.
M12 Hardware Design Main Serial port PIN NAME PIN NO. I/O DESCRIPTION DC CHARACTERISTICS COMMENT DTR 59 I Data terminal ready RXD 61 I Receive data TXD 60 O Transmit data RTS 58 I Request to send CTS 57 O Clear to send VILmin=-0.3V VILmax= 0.25×VDD_EXT VIHmin= 0.75×VDD_EXT VIHmax= VDD_EXT+0.3 VOLmax= 0.15×VDD_EXT VOHmin= 0.85×VDD_EXT If only use TXD, RXD and GND to communicate, recommended connecting RTS to GND via 0R resistor and keeping other pins open.
M12 Hardware Design SIM_VDD 12 O Voltage supply for SIM card The voltage can be selected by software automatically. Either 1.8V or 3V. SIM_DATA 13 I/O SIM data SIM_VDD=3V VILmax=0.4V VIHmin= SIM_VDD-0.4 VOLmax=0.4V VOHmin= SIM_VDD-0.4 SIM_VDD=1.8V VILmax= 0.15×SIM_VDD VIHmin= SIM_VDD-0.4 VOLmax= 0.15×SIM_VDD VOHmin= SIM_VDD-0.4 All signals of SIM interface should be protected against ESD with a TVS diode array. Maximum trace length is 200mm from the module pad to SIM card holder.
M12 Hardware Design VILmax= 0.12×SIM_VDD VIHmin= 0.9×SIM_VDD VOLmax= 0.12×SIM_VDD VOHmin= 0.9×SIM_VDD SIM_ PRESENCE 11 I SIM card detection VILmin=-0.3V VILmax= 0.25×VDD_EXT VIHmin= 0.75×VDD_EXT VIHmax= VDD_EXT+0.3 If unused, keep this pin open. l e t l c a i e t u n Q fide n o C AUX ADC PIN NAME PIN NO. I/O DESCRIPTION DC CHARACTERISTICS COMMENT ADC0 41 I 40 I General purpose analog to digital converter Voltage range: 0V ~ 2.8V If unused, keep this pin open. PIN NAME PIN NO.
M12 Hardware Design Table 6: Overview of operating modes Mode Function Normal operation GSM/GPRS SLEEP The module will automatically go into SLEEP mode if DTR is set to high level and there is no interrupt (such as GPIO interrupt or data on serial port). In this case, the current consumption of module will reduce to the minimal level. During SLEEP mode, the module can still receive paging message and SMS from the system normally. GSM IDLE Software is active.
M12 Hardware Design 3.3. Power supply 3.3.1. Power features of module The power supply is one of the key issues in the designing GSM terminals. Due to the 577us radio burst emission in GSM every 4.615ms, power supply must be able to deliver high current peaks in a burst period. During these peaks, drops on the supply voltage must not exceed minimum working voltage of module. For the M12 module, the max current consumption could reach to 1.6A during a transmit burst.
M12 Hardware Design VBAT + C1 100uF C3 C4 10pF 33pF 0603 0603 C2 100nF l e t l c a i e t u n Q fide n o C GND Figure 4: Reference circuit for the VBAT input 3.3.3. Reference design for power supply The power design for the module is very important, since the performance of power supply for the module largely depends on the power source. The power supply is capable of providing the sufficient current up to 2A at least.
M12 Hardware Design 3.3.4. Monitor power supply To monitor the supply voltage, customer can use the “AT+CBC” command which includes three parameters: charging status, remaining battery capacity and voltage value (in mV). It returns the 0-100 percent of battery capacity and actual value measured between VBAT and GND. The voltage is continuously measured at an interval depending on the operating mode.
M12 Hardware Design PWRKEY 4.7K Turn on pulse 47K l e t l c a i e t u n Q fide n o C Figure 6: Turn on the module using driving circuit The other way to control the PWRKEY is using a button directly. A TVS component is indispensable to be placed nearby the button for ESD protection. When pressing the key, electrostatic strike may generate from finger. A reference circuit is showed in Figure 7.
M12 Hardware Design 1 VBAT 2 EMERG_OFF (INPUT) >1s VIH > 0.6*VBAT PWRKEY (INPUT) VIL<0.1*VBAT l e t l c a i e t u n Q fide n o C 54ms VDD_EXT (OUTPUT) 800ms STATUS (OUTPUT) MODULE STATUS OFF BOOTING RUNNING Figure 8: Timing of turning on system ① Make sure that VBAT voltage is stable before pulling down PWRKEY pin. The interval time between them is recommended 30ms. ② Keep the EMERG_OFF pin open if not used.
M12 Hardware Design 3.4.2.1. Power down module using PWRKEY pin In application, the module can be turned off by driving the PWRKEY to a low level voltage for certain time. The power-down scenario is illustrated in Figure 9. The power-down procedure causes the module to log off the network and allows the software to save important data before completely disconnecting the power supply, thus it is a safe way.
M12 Hardware Design Before the completion of the power-down procedure, the module sends out the result code as shown below: NORMAL POWER DOWN After this moment, no other AT commands can be executed. And then the module enters the POWER DOWN mode, only the RTC is still active. The POWER DOWN mode can also be indicated by STATUS pin, which is a low level voltage in this mode. For details about the AT command of “AT+QPOWD”, please refer to document [1]. l e t l c a i e t u n Q fide n o C 3.4.2.3.
M12 Hardware Design button. The circuit is illustrated as the following figures. EMERG_OFF 4.7K Emergency shutdown pulse l e t l c a i e t u n Q fide n o C 47K Figure 10: Reference circuit for EMERG_OFF by using driving circuit S1 EMERG_OFF TVS Close to S1 Figure 11: Reference circuit for EMERG_OFF by using button Be cautious to use the pin EMERG_OFF. It should only be used under emergent situation.
M12 Hardware Design certain time, which is similar to the way to turn on module. Before restarting the module, at least 500ms should be delayed after detecting the low level of STATUS. The restart scenario is illustrated as the following figure. Turn off PWRKEY (INPUT) Delay >0.5s Restart Pull down the PWRKEY to turn on the module STATUS (OUTPUT) l e t l c a i e t u n Q fide n o C Figure 12: Timing of restarting system The module can also be restarted by the PWRKEY after emergency shutdown.
M12 Hardware Design 3.5.1. Minimum functionality mode Minimum functionality mode reduces the functionality of the module to minimum level, thus minimize the current consumption when the slow clocking mode is activated at the same time. This mode is set with the “AT+CFUN” command which provides the choice of the functionality levels =0，1，4.
M12 Hardware Design Receive a voice or data call from network to wake up module. Receive a SMS from network to wake up module. Note: DTR pin should be held low level during communicating between the module and DTE. c3.6.
M12 Hardware Design Module VRTC 1.5K RTC Core Rechargeable Backup Battery l e t l c a i e t u n Q fide n o C Figure 15: RTC supply from rechargeable battery Module VRTC 1.5K RTC Core Large Capacitance Capacitor Figure 16: RTC supply from capacitor Coin-type rechargeable capacitor such as XH414H-IV01E from Seiko can be used. M12_HD_V3.
M12 Hardware Design l e t l c a i e t u n Q fide n o C Figure 17: Seiko XH414H-IV01E Charge Characteristic 3.8. Serial interfaces The module provides three unbalanced asynchronous serial ports including UART, Debug Port and UART3.The module is designed as a DCE (Data Communication Equipment), following the traditional DCE-DTE (Data Terminal Equipment) connection. Autobauding function supports baud rate from 4800bps to 115200bps.
M12 Hardware Design DBG_TXD: Send data to the COM port of computer DBG_RXD: Receive data from the COM port of computer The UART3 Port: TXD3: Send data to the RXD of DTE RXD3: Receive data from the TXD of DTE The logic levels are described in the following table. l e t l c a i e t u n Q fide n o C Table 8: Logic levels of the serial interface Parameter Min Max Unit VIL 0 0.25×VDD_EXT V 0.75×VDD_EXT VDD_EXT +0.3 V 0 0.15×VDD_EXT V 0.
M12 Hardware Design Used for AT command, GPRS data, CSD etc. Multiplexing function is supported on the UART Port. So far only the basic mode of multiplexing is available. Support the communication baud rates as the following: 300,600,1200,2400,4800,9600,14400,19200,28800,38400,57600,115200. The default setting is autobauding mode. The following baud rates are supported for autobauding function: 4800, 9600, 19200, 38400, 57600, 115200.
M12 Hardware Design 3.8.1.2. The connection of UART The connection between module and host via UART port is very flexible. Three connection styles are illustrated as below. UART Port connection is shown as below when it is applied in modulation-demodulation. Module (DCE) PC (DTE) Serial Port Serial port l e t l c a i e t u n Q fide n o C TXD RXD RTS CTS DTR DCD TXD RXD RTS CTS DTR DCD RI RING GND GND Figure 18: Connection of all functional UART port Three lines connection is shown as below.
M12 Hardware Design Module(DCE) Host (DTE) Controller TXD TXD RXD RXD RTS RTS CTS CTS GND GND l e t l c a i e t u n Q fide n o C Figure 20: Connection of UART port with hardware flow control 3.8.1.3. Firmware upgrade The TXD and RXD can be used to upgrade firmware. The PWRKEY pin must be pulled down before the firmware upgrade. Please refer to the following figure for firmware upgrade.
M12 Hardware Design 460800bps. Module (DCE) Computer Debug port DBG_TXD TXD DBG_RXD RXD l e t l c a i e t u n Q fide n o C GND GND Figure 22: Connection of debug port 3.8.3. UART3 Port UART3: Two data lines: TXD3and RXD3 UART3 port is used for AT command only and does not support GPRS data, CSD, Multiplexing function etc.
M12 Hardware Design Figure 23: Connection of UART3 port 3.8.4. UART Application The reference design of 3.3V level match is shown as below. When the peripheral MCU/ARM system is 3V, the divider resistor should be changed from 5.6K to 10K. Module MCU/ARM /TXD 1K RXD 1K l e t l c a i e t u n Q fide n o C /RXD /RTS /CTS GPIO EINT GPIO TXD 1K RTS 1K CTS 1K DTR 1K RI 1K DCD GND GND 5.6K 5.6K 5.6K Voltage level:3.3V Figure 24: 3.
M12 Hardware Design VCC_MCU 4.7K VDD_EXT 5.6K MCU/ARM 4.7K Module /TXD RXD /RXD TXD 4.7K VCC_MCU 4.7K VDD_EXT /RTS /CTS GPIO EINT GPIO GND RTS CTS DTR RI DCD GND l e t l c a i e t u n Q fide n o C Voltage level: 5V Figure 25: 5V level match circuit The following picture is an example of connection between module and PC.
M12 Hardware Design SP3238 28 25 1 3 DCD TXD CTS RI MODULE GND V+ C1- GND C2+ VCC C2- V- 24 23 22 19 T1IN T2IN T3IN T4IN 17 T5IN 16 21 20 18 RXD DTR RTS C1+ T4OUT T2OUT T3OUT T1OUT T5OUT /R1OUT R1OUT R2OUT R3OUT R1IN R2IN R3IN 27 2 26 GND 3V 4 GND 10 6 7 5 12 8 9 11 l e t l c a i e t u n Q fide n o C 13 3V ONLINE 15 /STATUS 14 /SHUTDOWN 6 7 8 9 TO PC serial port 1 2 3 4 5 GND Figure 26: RS232 level match circuit 3.9.
M12 Hardware Design AIN1 and AIN2, which may be used for both microphone and line inputs. An electret microphone is usually used. AIN1 and AIN2 are both differential input channels. AOUT1 and AOUT2, which may be used for both receiver and speaker outputs. AOUT1 channel is typically used for a receiver, while AOUT2 channel is typically used for headset or speaker. AOUT1 channel is a differential channel and AOUT2 is a single-ended channel. SPK2P and AGND can establish a pseudo differential mode.
M12 Hardware Design circuit is shown in Figure 27. Close to Microphone GND Differential layout 10pF 0603 33pF 0603 ESD Module MICxP 10pF 0603 MICxN Electret Microphone 33pF 0603 l e t l c a i e t u n Q fide n o C 10pF 0603 33pF 0603 ESD GND Figure 27: Microphone reference design for AIN1&AIN2 3.9.3.
M12 Hardware Design Close to speaker GND Differential layout Module 10pF 0603 33pF 0603 10pF 0603 33pF 0603 10pF 0603 33pF 0603 ESD Amplifier circuit SPK1P SPK1N ESD l e t l c a i e t u n Q fide n o C GND Figure 29: Reference design with an amplifier for AOUT1 Texas Instruments TPA6205A1 is recommended for a suitable differential audio amplifier. There are plenty of excellent audio amplifiers in the market.
M12 Hardware Design Close to speaker GND Differential layout Module 10pF 0603 33pF 0603 ESD 10pF 0603 33pF 0603 ESD Amplifier circuit C1 SPK2P AGND C2 l e t l c a i e t u n Q fide n o C GND Figure 31: Reference design with an amplifier for AOUT2 Note: The value of C1 and C2 depends on the input impedance of audio amplifier. 3.9.4. Earphone interface configuration Close to Socket Differential layout Module GND 4.
M12 Hardware Design Table 12: Typical speaker characteristic Parameter Normal Output(SPK1) Auxiliary Output(SPK2) Min Typ 32 Single Ended Load resistance 28 Ref level 0 Differential Load resistance 28 Ref level 0 Load resistance 16 Ref level 0 Single Ended Maxim driving current limit of SPK1 and SPK2 Max Unit Ohm 2.4 32 Vpp Ohm 4.8 32 Vpp Ohm 2.4 Vpp 50 mA l e t l c a i e t u n Q fide n o C 3.10. SIM card interface 3.10.1.
M12 Hardware Design default configuration, SIM card detection function is disabled. Customer’s application can use “AT+QSIMDET=1,0” to switch on and “AT+QSIMDET=0,0” to switch off the SIM card detection function. For details of this AT command, please refer to document [1]. When “AT+QSIMDET=1,0” is set and the tray with SIM card is removed from SIM socket, the following URC will be presented.
M12 Hardware Design GND 33pF 100nF Module SIM_VDD SIM_RST SIM_CLK SIM_PRESENCE SIM_DATA GND SIM_Holder VCC RST CLK 22R 22R GND VPP IO 22R 33pF 33pF 33pF l e t l c a i e t u n Q fide n o C ESDA6V8V6 GND GND Figure 34: Reference circuit of the 6 pins SIM card In SIM interface designing, in order to ensure good communication performance with SIM card, the following design principles should be complied with. Place the SIM card holder close to module as close as possible.
M12 Hardware Design l e t l c a i e t u n Q fide n o C Figure 35: Amphenol C707 10M006 512 2 SIM card holder Table 14: Pin description of Amphenol SIM card holder Name Pin Function SIM_VDD C1 SIM Card Power supply SIM_RST C2 SIM Card Reset SIM_CLK C3 SIM Card Clock GND C5 Ground C6 Not Connect C7 SIM Card data I/O VPP SIM_DATA For 8-pin SIM card holder, it is recommended to use Molex 91228. Please visit http://www.molex.com for more information. M12_HD_V3.
M12 Hardware Design l e t l c a i e t u n Q fide n o C Figure 36: Molex 91288 SIM card holder Table 15: Pin description of Molex SIM card holder Name Pin Function SIM_VDD C1 SIM Card Power supply SIM_RST C2 SIM Card Reset SIM_CLK C3 SIM Card Clock SIM_PRESENCE C4 SIM Card Presence Detection GND C5 Ground C6 Not Connected SIM_DATA C7 SIM Card Data I/O SIM_DETECT C8 Pulled down GND with external circuit. When the tray is present, C4 is connected to C8. VPP 3.11.
M12 Hardware Design Table 16: Pin definition of the ADC Name Pin Function ADC0 41 Analog to digital converter. ADC1 40 Analog to digital converter Table 17: Characteristics of the ADC Item Min Voltage Range 0 Typ Max Units 2.8 V l e t l c a i e t u n Q fide n o C ADC Resolution 10 bits ADC Accuracy 2.7 mV 3.12. Behaviors of the RI Table 18: Behaviors of the RI State RI response Standby HIGH Voice calling Changed to LOW, then: 1. Changed to HIGH when call is established. 2.
M12 Hardware Design RI HIGH Off-hook by“ATA” LOW On-hook by “ATH” Idle Ring SMS received l e t l c a i e t u n Q fide n o C Figure 37: RI behaviour of voice calling as a receiver HIGH RI Data calling establish LOW On-hook by “ATH” SMS received Idle Ring Figure 38: RI behaviour of data calling as a receiver HIGH RI LOW Idle Calling Talking On-hook Idle Figure 39: RI behaviour as a caller M12_HD_V3.
M12 Hardware Design RI HIGH 120ms LOW URC or SMS received Idle or talking l e t l c a i e t u n Q fide n o C Figure 40: RI behaviour of URC or SMS received 3.13. Network status indication The NETLIGHT signal can be used to drive a network status indicator LED. The working state of this pin is listed in Table 19. Table 19: Working state of the NETLIGHT State Off Module function The module is not running. 64ms On/ 800ms Off The module is not synchronized with network.
M12 Hardware Design 3.14. Operating status indication The STATUS pin is set as an output pin and can be used to judge whether module is power-on, please refer to Section 3.4. In customer design, this pin can be connected to a GPIO of DTE or be used to drive an LED in order to judge the module’s operation status. A reference circuit is shown in Figure 42.
M12 Hardware Design 3.16. SD card interface The module provides SD card interface that supports many types of memory, such as Memory Stick, SD/MCC card and T-Flash or Micro SD card.
M12 Hardware Design Table 23: Pin name of the SD card and T-Flash(Micro SD) card Pin No.
M12 Hardware Design 4. Antenna interface The Pin 43 is the RF antenna pad. The RF interface has an impedance of 50Ω. A reference circuit is shown in the following figure. In order to adjust RF performance, it should reserve a П-type matching circuit. By default, the resistance of R1 is 0Ω and capacitors C1 and C2 are not soldered. Module R1 0R RF_ANT l e t l c a i e t u n Q fide n o C C1 NM C2 NM Figure 44: Reference circuit of RF interface 4.1.
M12 Hardware Design 4.2. RF output power Table 25: The module conducted RF output power Frequency Max Min EGSM900 33dBm ±2dB 5dBm±5dB DCS1800 30dBm ±2dB 0dBm±5dB Note: In GPRS 4 slots TX mode, the max output power is reduced by 2.5dB. This design conforms to the GSM specification as described in section 13.16 of 3GPP TS 51.010-1. l e t l c a i e t u n Q fide n o C 4.3.
M12 Hardware Design l e t l c a i e t u n Q fide n o C Figure 45: Recommendation of RF pad welding M12_HD_V3.
M12 Hardware Design 5. Electrical, reliability and radio characteristics 5.1. Absolute maximum ratings Absolute maximum ratings for power supply and voltage on digital and analog pins of module are listed in the following table: Table 28: Absolute maximum ratings l e t l c a i e t u n Q fide n o C Parameter Min Max Unit VBAT -0.3 4.7 V Peak current of power supply 0 2 A RMS current of power supply (during one TDMAframe) 0 0.7 A Voltage at digital pins -0.3 3.
M12 Hardware Design 5.3. Power supply ratings Table 30: The module power supply ratings Parameter Description Conditions Min Typ Max Unit VBAT Supply voltage Voltage must stay within the min/max values, including voltage drop, ripple, and spikes. 3.3 4.0 4.6 V Voltage drop during transmitting burst Maximum power control level on GSM850 and GSM900.
M12 Hardware Design Parameter Description Conditions DCS1800 Peak supply current (during transmission slot) 1) 2) Min 2) Maximum power control level on GSM900. Typ Max 477 1.6 Unit mA 1.8 A Power control level PCL 5 Power control level PCL 0 l e t l c a i e t u n Q fide n o C 5.4. Current consumption The values for current consumption are shown in Table 31.
M12 Hardware Design @power level #19,Typical 111mA DCS 1800 @power level #0 <490mA,Typical 464mA @power level #7,Typical 172mA @power level #15,Typical 102mA DATA mode, GPRS ( 4 Rx,1 Tx ) CLASS 12 EGSM 900 @power level #5 <350mA,Typical 230mA @power level #12,Typical 118mA @power level #19,Typical 93mA DCS 1800 @power level #0 <300mA,Typical 216mA @power level #7,Typical 118mA @power level #15,Typical 94mA l e t l c a i e t u n Q fide n o C DATA mode, GPRS ( 1 Rx, 4 Tx ) CLASS 12 EGSM 900 @power le
M12 Hardware Design 6. Mechanical dimensions This chapter describes the mechanical dimensions of the module. 6.1. Mechanical dimensions of the module l e t l c a i e t u n Q fide n o C Figure 46: M12 top and side dimensions（Unit: mm） M12_HD_V3.
M12 Hardware Design test point l e t l c a i e t u n Q fide n o C Figure 47: M12 bottom dimensions（Unit: mm） Figure 48: Pad bottom dimensions（Unit: mm） M12_HD_V3.
M12 Hardware Design 6.2. Footprint of recommendation l e t l c a i e t u n Q fide n o C single pad M12_HD_V3.
M12 Hardware Design safe area line module dimension keepout area l e t l c a i e t u n Q fide n o C Figure 49: Footprint of recommendation（Unit: mm） Note1：Keep out the area below the test point in the host PCB. Place solder mask. Note2：In order to maintain the module, keep about 3mm between the module and other components in host PCB. Note3：Keep out area in above figure in which is forbid to pour ground copper.
M12 Hardware Design 6.3. Top view of the module l e t l c a i e t u n Q fide n o C Figure 50: Top view of the module 6.4. Bottom view of the module Figure 51: Bottom view of the module M12_HD_V3.
M12 Hardware Design Appendix A: GPRS coding schemes Four coding schemes are used in GPRS protocol. The differences between them are shown in Table 33. Table 33: Description of different coding schemes Scheme CS-1 CS-2 CS-3 CS-4 Code Rate USF Pre-coded USF Radio Block excl.USF and BCS BCS Tail Coded Bits Punctured Bits Data Rate Kb/s l e t l c a i e t u n Q fide n o C 1/2 3 3 181 40 4 456 0 9.05 2/3 3 6 268 16 4 588 132 13.4 3/4 3 6 312 16 4 676 220 15.
M12 Hardware Design Appendix B: GPRS multi-slot classes Twenty-nine classes of GPRS multi-slot modes are defined for MS in GPRS specification. Multi-slot classes are product dependant, and determine the maximum achievable data rates in both the uplink and downlink directions. Written as 3+1 or 2+2, the first number indicates the amount of downlink timeslots, while the second number indicates the amount of uplink timeslots.
M12 Hardware Design Shanghai Quectel Wireless Solutions Co., Ltd. Room 501, Building 13, No.99, Tianzhou Road, Shanghai, China, 200233 Tel: +86 21 5108 6236 Mail: info@quectel.com M12_HD_V3.
