Datasheet

PRODUCT SPECIFICATION Open Frame
Page 8/12
Document prepared and responsible for
M. Mauritz
E2OFxW3 60
Approved by
Day
Month
Year
Revision
S. Schmalhofer
20
01
15
I
3.4.5 Thermal Considerations
In order to ensure safe and reliable operation of the open frame power supply in the most
adverse conditions permitted in the end-use equipment, the temperature of the components
listed in the table below must be not exceeded. See mechanical drawing for component
locations. Temperature should be monitored using thermocouples placed on the hottest part
of the component (out of any direct air flow).
Temperature Measurments ( Ambient temperature - max. 50°C)
Component
Max. Temperature °C
C4
100 °C
C7
100 °C
D3
110 °C
Q1
115 °C *
T1
110 °C
* A thermal shut down at the PCB placed near the Mosfet protects the power supply and the
surroundings form hazard temperatures.
To reset the thermal safety shut down the mains voltage has to be switched off and (after
cooling down) switched on again.
It is end application consideration to ensure that all surrounding components (including
cables) have a proper technical specification approval with respect to in the temperatures
measured on the power supply components built into the end application.
3.5 Marking
Product name
Input parameters
Output parameters
Date code of production
CE marking
Bar code