Data Sheet

PN512_C1_SDS All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product short data sheet
COMPANY PUBLIC
Rev. 3.2 — 20 September 2012
120132 22 of 27
NXP Semiconductors
PN532/C1
Near Field Communication (NFC) controller
10. Package outline
This package is MSL level 2.
Fig 14. Package outline HVQFN40 (SOT618-1)
terminal 1
index area
0.51
A
1
E
h
b
UNIT
ye
0.2
c
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
mm
6.1
5.9
D
h
4.25
3.95
y
1
6.1
5.9
4.25
3.95
e
1
4.5
e
2
4.5
0.30
0.18
0.05
0.00
0.05 0.1
DIMENSIONS (mm are the original dimensions)
SOT618-1 MO-220- - - - - -
0.5
0.3
L
0.1
v
0.05
w
0 2.5 5 mm
scale
SOT618-1
HVQFN40: plastic thermal enhanced very thin quad flat package; no leads;
40 terminals; body 6 x 6 x 0.85 mm
A
(1)
max.
A
A
1
c
detail X
y
y
1
C
e
L
E
h
D
h
e
e
1
b
11 20
40
31
30
21
10
1
X
D
E
C
B
A
e
2
01-08-08
02-10-22
terminal 1
index area
1/2 e
1/2 e
AC
C
B
v
M
w
M
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
D
(1)
E
(1)