Datasheet

Page 1

HTCP

Heat Transfer Compound Plus

HTCP is a highly thermally conductive non-curing heat transfer paste, designed for use as a thermal interface

material. It is recommended where large amounts of heat need to be dissipated efficiently, ensuring the reliable

thermal coupling of electronic components. HTCP is a non-silicone paste, suitable for applications where

silicones are prohibited, thus avoiding issues with silicone and low molecular weight siloxane migration.

 High thermal conductivity; optimum efficiency of heat dissipation

 Low viscosity for ease of application; designed for use as a thermal interface material

 Based on a non-silicone oil; avoids issues with silicone and LMW siloxane migration

 Non-curing paste; allows simple and efficient rework of components if required

Approvals RoHS-2 Compliant (2011/65/EU): Yes

Typical Properties Colour: White

Base: Blend of synthetic fluids

Thermo-conductive Component: Powdered metal oxides

Density @ 20°C (g/ml): 3.0

Cone Penetration @ 20°C: 250

Viscosity @ 1rpm (Pa s): 101-112

Thermal Conductivity (Guarded Hot Plate): 2.5 W/m.K

Thermal Conductivity (Heat Flow): 1.7 W/m.K (calculated)

Temperature Range: -50°C to +130°C

Weight Loss after 96 hours @ 100°C: <1.0%

Permittivity @ 1GHz: 4.2

Volume Resistivity: 1 x 10

Ohms-cm

Dielectric Strength: 42 kV/mm

Flammability: UL94 V-0 equivalent

Description Packing Order Code Shelf Life

Heat Transfer Compound Plus 2ml Syringe HTCP02S 48 months

20 ml Syringe HTCP20S 48 months

100 gram tube HTCP100T 48 months

700 gram cartridge HTCP700G 72 months

1 Kg Bulk HTCP01K 72 months

25 kg Bulk HTCP25K 72 months

PAGE 1
Page 1 HTCP Heat Transfer Compound Plus HTCP is a highly thermally conductive non-curing heat transfer paste, designed for use as a thermal interface material. It is recommended where large amounts of heat need to be dissipated efficiently, ensuring the reliable thermal coupling of electronic components. HTCP is a non-silicone paste, suitable for applications where silicones are prohibited, thus avoiding issues with silicone and low molecular weight siloxane migration.
PAGE 2
Page 2 Directions for Use Thermal pastes can be applied to the base and mounting studs of diodes, transistors, thyristors, heat sinks, silicone rectifiers and semi-conductors, thermostats, power resistors and radiators, to name but a few. When the contact surfaces are placed together, a firm metal-to-metal contact will only be achieved on 40 – 60% of the interface, depending on the smoothness of the surfaces.