Datasheet

HTSX

Silicone Heat Transfer Compound Xtra

HTSX is an enhanced version of HTS. It is a non-curing heat transfer paste with extremely low oil bleeding,

designed for use as a thermal interface material. It is recommended where the efficient and reliable thermal

coupling of electronic components or heat dissipation between any surfaces are required. HTSX is based on a

silicone oil, offering an exceptionally wide operating temperature range.

 General purpose thermal management paste; excellent stability in a range of conditions

 Based on a silicone oil; offers an exceptionally wide operating temperature range

 Very good thermal conductivity; designed for use as a thermal interface material

 Non-curing paste; allows simple and efficient rework of components if required

Approvals RoHS-2 Compliant (2015/863/EU): Yes

Typical Properties Colour: White

Base: Silicone Oil

Thermo-conductive Component: Powdered metal oxides

Density @ 20°C (g/ml): 3.10

Cone Penetration @ 20°C: 400

Viscosity @ 1rpm (Pa s) : 260-290

Thermal Conductivity (Guarded Hot Plate): 1.58 W/m.K (calculated)

Thermal Conductivity (Heat Flow): 1.05 W/m.K

Temperature Range: -50°C to +200°C

Weight Loss after 15 days @150°C: 0.28%

Weight Loss after 15 days @ 200°C: 1.16%

Permittivity @ 10

Hz: 4.9

Volume Resistivity: 1 x 10

Ohms-cm

Dielectric Strength: 18 kV/mm

Description Packing Order Code Shelf Life

Silicone Heat Transfer Compound 35ml Syringe HTSX35SL 48 Months

830g Cartridge HTSX830G 48 Months

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HTSX Silicone Heat Transfer Compound Xtra HTSX is an enhanced version of HTS. It is a non-curing heat transfer paste with extremely low oil bleeding, designed for use as a thermal interface material. It is recommended where the efficient and reliable thermal coupling of electronic components or heat dissipation between any surfaces are required. HTSX is based on a silicone oil, offering an exceptionally wide operating temperature range.
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Directions for Use Thermal pastes can be applied to the base and mounting studs of diodes, transistors, thyristors, heat sinks, silicone rectifiers and semi-conductors, thermostats, power resistors and radiators, to name but a few. When the contact surfaces are placed together, a firm metal-to-metal contact will only be achieved on 40 – 60% of the interface, depending on the smoothness of the surfaces.