User Manual

ManualsBrandsElenco ManualsRoboticsSL-75 Temperature Controlled Soldering Station

ELECTRONIC SOLDERING STATION

MODEL SL-75

Use these settings for

soldering temperature

sensitive components.

Use these settings for

general soldering and

connections that require

more heat.

Park Position

In these settings, temperatures are

too low for soldering. Set the station

in these positions when not using it

to reduce oxidation of the soldering

iron tip.

General Areas of Temperature Settings

350

450

700

600

The SL-75 Electronic-Controlled Soldering Station

has been developed to meet the present needs of the

electronics industry. It incorporates an electronic

circuit which enables the user to change the tip

temperature from 350

F to 900

F without the need to

change the tip or heating element.

PRODUCT DESCRIPTION

Soldering at the correct temperature is very important

to ensure a perfect solder connection. If the

temperature is too low, the solder will not flow

correctly and will cause cold solder joints. If the

temperature is too high, the flux will be burned and

not allow the solder to flow. High temperature can also

cause damage to the PC board and other sensitive

components. When the tip working temperature is set

within the correct parameters suited to the particular

solder being used, a good joint is assured.

WORKING TEMPERATURE

When using lead-free solder, increase all temperature settings by 50°F.

HEAT SINKING

Electronic components such as transistors, ICs, and

iodes can be damaged by the heat during soldering.

Heat sinking is a way of reducing the heat on the

components while soldering. Dissipating the heat can

be achieved by using long nose pliers, an alligator clip,

or a special heat dissipating clip. The heat sink should

be held on the component lead between the part and

the solder joint.

1. Wet the sponge with preferably distilled water, and

then place it into the tray.

2. Plug the soldering iron line cord into AC

receptacle. Make sure the control knob is in the

OFF position. Turn the control knob to the ON

position, setting it midway.

3. Allow the iron to heat up for a few minutes. Now

set it to the desired temperature. See the chart for

relative temperatures. Using the lowest power

setting will protect sensitive devices.

OPERATION

No part of this book shall be reproduced by any means; electronic, photocopying, or otherwise without written permission from the publisher.

-4-

SOLDERING SURFACE MOUNT COMPONENTS

1. Using tweezers, place the surface mount

component on the PC board pads and secure in

place with tape (see Figure 2).

2. Apply a small amount of solder to the soldering

iron tip. This allows the heat to leave the iron and

flow onto the foil.

3. Place the iron in contact with the PC board foil.

Apply a small amount of solder simultaneously to

the foil and the component and allow them to melt

the solder.

4. Remove the iron and allow the solder to cool. The

solder should have flowed freely and not lump up

around the component.

5. Remove the tape and solder the other side of the

component.

After a component is completely soldered, each solder

joint should be inspected with a magnifying glass. If the

solder has not flowed smoothly, a bad solder joint is

indicated. This occurs when the component and pad

have not been heated sufficiently. To correct, reheat

the connection and if necessary add a small amount

of additional solder.

Another way to solder surface mount components is

as follows:

1. Apply a small amount of solder to the soldering

iron tip as shown in Figure 3.

2. Using tweezers, hold the component on the PC

board pads.

3. Apply the soldering iron simultaneously to the

component and pad and allow the solder to flow

around the component.

4. Remove the soldering iron and allow the

connection to cool.

Tweezers or pliers

Solder

Soldering iron

Surface mount

component

Figure 3

Tape

Iron

Solder

Figure 2

Heat sink

(ST-23)

Soldering iron

Solder

Heat sensitive

component (diode)

PC board

Figure 1

Replacement Tips for Solder Station

SR-1NT - Conical Tip

SL-75T2 - Wedge Tip

-OR-

Model TIPK-2

A complete soldering iron tip package that

contains the following:

3 pcs. - SR-1NT Conical Tip

2 pcs. - SR-1NT1 Chisel Tip

1 pc. - SL-75T2 Wedge Tip

SL-75_Solder_Station_REV-E_102214.qxp_SL-75 Solder Station REV-E 10/24/14 3:03 PM Page 1

Summary of content (4 pages)

PAGE 1
SL-75_Solder_Station_REV-E_102214.qxp_SL-75 Solder Station REV-E 10/24/14 3:03 PM Page 1 HEAT SINKING Soldering iron Electronic components such as transistors, ICs, and diodes can be damaged by the heat during soldering. Heat sinking is a way of reducing the heat on the components while soldering. Dissipating the heat can be achieved by using long nose pliers, an alligator clip, or a special heat dissipating clip. The heat sink should be held on the component lead between the part and the solder joint.
PAGE 2
SL-75_Solder_Station_REV-E_102214.qxp_SL-75 Solder Station REV-E 10/24/14 3:03 PM Page 2 SAFETY PRECAUTIONS Like all electrical devices, the solder station must be handled with care. The soldering iron and tip can reach high temperatures and these simple safety rules should be followed. ● Keep children out of reach of the soldering station. ● To protect your eyes, use safety goggles. ● Keep flammable material away from the soldering iron. ● DO NOT cool iron by dipping it into any liquid or water.
PAGE 3
SL-75_Solder_Station_REV-E_102214.qxp_SL-75 Solder Station REV-E 10/24/14 3:03 PM Page 2 SAFETY PRECAUTIONS Like all electrical devices, the solder station must be handled with care. The soldering iron and tip can reach high temperatures and these simple safety rules should be followed. ● Keep children out of reach of the soldering station. ● To protect your eyes, use safety goggles. ● Keep flammable material away from the soldering iron. ● DO NOT cool iron by dipping it into any liquid or water.
PAGE 4
SL-75_Solder_Station_REV-E_102214.qxp_SL-75 Solder Station REV-E 10/24/14 3:03 PM Page 1 HEAT SINKING Soldering iron Electronic components such as transistors, ICs, and diodes can be damaged by the heat during soldering. Heat sinking is a way of reducing the heat on the components while soldering. Dissipating the heat can be achieved by using long nose pliers, an alligator clip, or a special heat dissipating clip. The heat sink should be held on the component lead between the part and the solder joint.