Embedded Computing for Business-Critical ContinuityTM MITX-430/MITX-440-DVI-2E Installation and Use Guide P/N: 6806800K37B August 2010
© 2010 Emerson All rights reserved. Trademarks Emerson, Business-Critical Continuity, Emerson Network Power and the Emerson Network Power logo are trademarks and service marks of Emerson Electric Co. © 2010 Emerson Electric Co. All other product or service names are the property of their respective owners. Intel® is a trademark or registered trademark of Intel Corporation or its subsidiaries in the United States and other countries.
Contents About this Manual . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 1.1 1.2 1.3 1.4 1.5 2 Hardware Preparation and Installation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 2.1 2.
Contents Contents 3.2 4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57 4.1 4.2 4.3 4.4 4.5 4.6 4.7 4.8 4.9 4.10 4.11 4.12 4 Connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 3.2.1 Clear CMOS (P3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Contents 4.13 4.14 4.15 4.16 4.17 4.18 4.19 4.20 4.21 4.22 4.23 4.24 5 4.12.2 ICH8-M GPIO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64 Chipset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68 Clock Generator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Contents Contents 5.5.2.8 6 Operating System and Driver Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105 6.1 6.2 A OEM-Reserved Status Code Ranges . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103 Supported Operating System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105 Supported Drivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
List of Tables Table 1-1 Table 1-2 Table 1-3 Table 1-4 Table 1-5 Table 1-6 Table 2-1 Table 2-2 Table 3-1 Table 3-2 Table 3-3 Table 3-4 Table 3-5 Table 3-6 Table 3-7 Table 3-8 Table 3-9 Table 3-10 Table 3-11 Table 3-12 Table 3-13 Table 3-14 Table 3-15 Table 3-16 Table 3-17 Table 3-18 Table 3-19 Table 3-20 Table 3-21 Table 4-1 Table 4-2 Table 4-3 Table 5-1 Table 5-2 Table 5-3 Table 5-4 Single Core Processor Board Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
List of Tables Table 5-5 Table 5-6 Table 5-7 Table 5-8 Table 5-9 Table 5-10 Table 5-11 Table 5-12 Table 5-13 Table 5-14 Table 5-15 Table 5-16 Table 5-17 Table 5-18 Table 5-19 Table 5-20 Table 5-21 Table 5-22 Table 5-23 Table 5-24 Table 5-25 Table 5-26 Table 5-27 Table 5-28 Table 5-29 Table 5-30 Table 5-31 Table 5-32 Table 5-33 Table 5-34 Table 5-35 Table 5-36 Table 5-37 Table 5-38 Table 5-39 Table 6-1 8 ACPI Settings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
List of Tables Table A-1 Table A-2 Emerson Network Power - Embedded Computing Publications . . . . . . . . . . . . . . . . . . 107 Related Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
List of Tables 10 MITX-430/MITX-440-DVI-2E Installation and Use Guide (6806800K37B)
List of Figures Figure 1-1 Figure 1-2 Figure 1-3 Figure 2-1 Figure 3-1 Figure 3-2 Figure 4-1 Figure 4-2 Figure 4-3 Figure 4-4 Declaration of Conformity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Single Core Processor Board - Serial Number Location . . . . . . . . . . . . . . . . . . . . . . . Dual Core Processor Board -Serial Number Location . . . . . . . . . . . . . . . . . . . . . . . . . Board Thermal Management . . . . . . . . . . . . . . . . . . .
List of Figures 12 MITX-430/MITX-440-DVI-2E Installation and Use Guide (6806800K37B)
About this Manual Overview of Contents This manual is divided into the following chapters and appendix. z Chapter 1, Introduction, on page 21, describes the features of single core and dual core processors, standard compliances, mechanical data, ordering information, and product identification.
About this Manual About this Manual 14 Abbreviation Definition ATA Advanced Technology Attachment ATAPI AT Attachment Packet Interface ATX Advance Technology Extended BDS Boot Device Selection BIOS Basic Input-Output System BSP Boot Strap Processor CMOS Complementary Metal Oxide Semiconductor COM Communications CRT Cathode Ray Tube CSM Compatibility Support Module CTS Clear To Send DC Dual Core/Direct Current DCD Data Carrier Detect DMA Direct Memory Access DMI Direct Media
About this Manual Abbreviation Definition GBE Gigabit Ethernet GLCI Gigabit LAN Connect Interface GPI General Purpose Input GPIO General Purpose Input Output GPO General Purpose Output GPU Graphics Processing Unit IDE Integrated Device Electronics IGD Internal Graphics Device IPL Initial Program Loader LFP Local Flat Panel LPC Low Pin Count LPT Line Printer Terminal LVDS Low Voltage Differential Signaling MAC Medium Access Control MSR Mode Specific Register NMI Non-Maskable
About this Manual About this Manual 16 Abbreviation Definition PWM Pulse Width Modulation PXE Preboot Execution Environment RGB Red,Green,Blue RTC Real Time Clock RTS Request To Send RXD Receive X Data SATA Serial AT Attachment SC Single Core SCSI Small Computer System Interface SIMD Single Instruction Multiple Data SIO Super Input/Output SMBus System Management Bus SMM System Management Mode SPD Serial Presence Detect SPI Serial Peripheral Interface SPP Standard Parallel
About this Manual Abbreviation Definition WDT Watch Dog Timer WP Write Protect XD Execute Disable XDP Extended Debug Port Conventions The following table describes the conventions used throughout this manual.
About this Manual About this Manual Notation Description | Logical OR Indicates a hazardous situation which, if not avoided, could result in death or serious injury Indicates a hazardous situation which, if not avoided, may result in minor or moderate injury Indicates a property damage message No danger encountered. Pay attention to important information Summary of Changes This is the initial version of the manual.
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About this Manual About this Manual 20 MITX-430/MITX-440-DVI-2E Installation and Use Guide (6806800K37B)
Chapter 1 Introduction 1.1 Features The MITX-430 is a Mini-ITX motherboard based on the Intel® Atom™ D410 single-core or D510 dual-core processor that offers improved processing and graphics performance over existing Mini-ITX Intel Atom based products. It is designed to allow easy, cost-effective replacement of the motherboard in a production environment. There are two versions of MITX-430: z MITX-430 - Single core processor for low power consumption.
Introduction Table 1-1 Single Core Processor Board Features (continued) Function Features System BIOS feature One piece 4MB SPI boot device Super I/O W83627UHG-LF RTC Integrated in ICH8-M Audio z Audio on board (ALC888-GR-LF) z Rear: Line-in, Line out, MIC-in LAN 10/100/1000M Ethernet PHY, Intel WG82567V USB Supports 10 USB2.
Introduction Table 1-1 Single Core Processor Board Features (continued) 1.1.
Introduction Table 1-2 Dual Core Processor Board Features (continued) Function Features LAN z 10/100/1000M Ethernet PHY, Intel WG82567V z 10/100/1000M Ethernet Controller, Intel WG82574L USB Supports 10 USB2.0 high speed ports (four rear, five on header, and one mini PCI-Express) Expansion slots z One PCI-E x1 slot z One Mini-PCIE card slot z One standard USB flash disk (2x5Pin, 2.54mmPitch) z Two 2xUSB2.
Introduction Table 1-2 Dual Core Processor Board Features (continued) 1.2 Function Features Board size z Mini-ITX 170mm x 170mm z 6 Layers PCB Standard Compliances MITX-430/MITX-440-DVI-2E meets the following standards. Table 1-3 Standard Compliances Standard Description IEC 60950-1 General requirements of Safety-Part 1 of Information Technology Equipment. EN55024 (EU) Limits and methods of measurements of immunity characteristics of Information Technology Equipment.
Introduction Figure 1-1 26 Declaration of Conformity MITX-430/MITX-440-DVI-2E Installation and Use Guide (6806800K37B)
Introduction 1.3 Mechanical Data The following table provides details about the dimensions and weight of the board: Table 1-4 Mechanical Data Feature Value Dimensions 170mm x 170mm Weight Dual core board: 353g Single core board: 325g 1.4 Ordering Information When ordering board variants or board accessories, use the order numbers given in the following sections. 1.4.1 Supported Board Models The following board models are supported: Table 1-5 Available Board Variants 1.4.
Introduction Table 1-6 Available Board Accessories (continued) 1.5 Order Number Description MITX-430 One IO shield MITX-440-DVI-2E One IO shield Product Identification The following graphic shows the location of the serial number label on the board.
Introduction Figure 1-3 Dual Core Processor Board -Serial Number Location MITX-430/MITX-440-DVI-2E Installation and Use Guide (6806800K37B) 29
Introduction 30 MITX-430/MITX-440-DVI-2E Installation and Use Guide (6806800K37B)
Chapter 2 Hardware Preparation and Installation 2.1 Environmental and Power Requirements The following environmental and power requirements are applicable to the motherboard. 2.1.1 Environmental Requirements You must make sure that the motherboard, when operated in your particular system configuration, meets the environmental requirements specified below. Operating temperatures refer to the temperature of the air circulating around the motherboard and not to the component temperature.
Hardware Preparation and Installation Table 2-1 Environmental Requirements (continued) Requirement Operating Shock Non-operating 20G peak (half sine) 11ms Altitude 2.1.2 -60 to 4000 m ASL Thermal Requirements Table 2-2 Critical Temperature Spots Item Thermal Dissipation Power (W) Maximum Allowable Temperature (0C) CPU D510 <= 13W 100 (Tj) D410 <= 10W ICH8-M 3W 92 (Tc) System Overheating Cooling Vents Improper cooling can lead to system damage and can void the manufacturer's warranty.
Hardware Preparation and Installation Personal Injury During operation, hot surfaces may be present on the heat sinks and the components of the product. To prevent injury from hot surface do not touch any of the exposed components or heatsinks on the product. Use the handle and face plate, where applicable, or the board edge when removing the product from the enclosure. 2.1.3 Power Requirements (Single Core Processor Board) The power consumption is tested under the following conditions with: 2.1.3.
Hardware Preparation and Installation VGA + LVDS dual display 2.1.3.2 12V 5V 3.3V Current(A) 0.88 1.8 0.67 Power(W) 10.56 9 2.21 Total 21.77 z Tested with 12.1" LCD Panel (P/N: G121X1-L01). The LCD inverter uses 12V. z The test devices do not include PCIE x1 add-in card and Mini-PCIE card. The two SATA devices are powered externally. If you use all the devices and power internally, then you must add all the power consumption.
Hardware Preparation and Installation 2.1.3.3 Standby Mode Power Consumption 2.1.3.3.1 S3 Sleep Mode 5V standby Current(A) 0.3 Power(W) 1.5 2.1.3.3.2 S5 Sleep mode 5V standby 2.1.4 Current(A) 0.23 Power(W) 1.15 Power Requirements (Dual Core Processor Board) The power consumption is tested under the following conditions with: z 2*2G SO-DIMM z One 2.5” ATA HDD z One infonion TPM module z One USB keyboard z One USB mouse z One PS/2 keyboard z One PS/2 mouse z One 3.
Hardware Preparation and Installation 2.1.4.1 Full Loading Running Burn-in Test VGA and LVDS dual display, without DVI display. 2.1.4.2 12V 5V 3.3V Current (A) 1.18 2.25 1 Power (W) 14.16 11.25 3.3 Source ATX ATX ATX Total (W) 28.71 z Tested with 12.1" LCD Panel (P/N: G121X1-L01). The LCD inverter uses 12V. z The test devices do not include PCIE x1 add-in card and Mini-PCIE card. The two SATA devices are powered externally.
Hardware Preparation and Installation 2.1.4.3 Standby Mode Power Consumption 2.1.4.3.1 S3 state 5V standby Current(A) 0.19 Power(W) 0.95 Source ATX 2.1.4.3.2 S5 State 5V standby Current(A) 0.13A Power(W) 0.65 Source ATX 2.2 Board Thermal Management and Placement 2.2.1 Board Thermal Management The motherboard provides some thermal management strategy, including CPU junction temperature monitor. It can take corresponding action to protect system at catastrophic overheating.
Hardware Preparation and Installation Figure 2-1 shows the thermal management diagram. Figure 2-1 Board Thermal Management Two PNP thermal transistors are integrated in Pineview-D processor. It is used as a diode and connects to an external digital thermal sensor EMC2103. CPU receives the data of junction temperature through SMBus. Note that, this is an inaccurate value and the temperature offset must be taken into account by reading MSR of CPU.
Hardware Preparation and Installation 2.3 Unpacking and Inspecting the Board Damage of Circuits Electrostatic discharge and incorrect installation and removal of the product can damage circuits or shorten their life. Before touching the product make sure that your are working in an ESD-safe environment or wear an ESD wrist strap or ESD shoes. Hold the product by its edges and do not touch any components or circuits. Shipment Inspection To inspect the shipment, follow the steps mentioned below: 1.
Hardware Preparation and Installation 2. Check for damage and report any damage or differences to the customer service. 3. Remove the desiccant bag shipped together with the product. Environmental Damage Improper disposing of used products may harm the environment. Always dispose of used products according to your country’s legislation and manufacturer’s instructions. 2.
Hardware Preparation and Installation Prepare the components to be installed or replaced. When you hold or transport the components, use the special antistatic package. Prepare the cross screwdriver, screws, plastic supports, cooling gel, and ESD-preventive wrist strap. 2.5 z Confirm installation or changing position Confirm the position where the MITX-430/MITX-440-DVI-2E will be installed.
Hardware Preparation and Installation 2.6 Memory Module Installation and Removal When you install or replace the module, pay attention to the following: z The MITX-430/MITX-440-DVI-2E supports single channel DDR2 667MHz, two SO-DIMM slots. z The SO-DIMMs must have the same sizes, frequencies, types and technologies, physical designs, and manufacturers. z SO-DIMMs must be of single or dual rank type. Quad rank type modules are not supported.
Hardware Preparation and Installation Removing Memory Module 1. Wear the ESD-preventive wrist strap. 2. Release the module from the slot by pushing the spring latches on either side of the module outward. 3. Lift the module from the motherboard. Damage of the Product and Additional Devices and Modules Incorrect installation or removal of additional devices or modules damages the product or the additional devices or modules.
Hardware Preparation and Installation 44 MITX-430/MITX-440-DVI-2E Installation and Use Guide (6806800K37B)
Chapter 3 Controls, LEDs, and Connectors 3.1 Board Layout Figure 3-1shows the location of the major components on the motherboard.
Controls, LEDs, and Connectors Figure 3-2 Dual Core Motherboard Components BIOS socket (far side) 46 MITX-430/MITX-440-DVI-2E Installation and Use Guide (6806800K37B)
Controls, LEDs, and Connectors 3.2 Connectors The following subsections describe the connectors used on the board. 3.2.1 Clear CMOS (P3) Table 3-1 Clear CMOS 3.2.
Controls, LEDs, and Connectors 3.2.3 LVDS Backlight Header (P23) Table 3-3 LVDS Backlight Header PIn Definition 3.2.4 PIN PIN Name 1 VCC12V 2 LVDS_BKLT_EN 3 GND 4 LCD_BKL_ADJ 5 VCC5V LVDS Power Header P5 selects the power of LCD Panel. Table 3-4 LVDS Power 3.2.5 HEADER MODE 1-2 short 3.
Controls, LEDs, and Connectors Table 3-5 MINI IDE Header PIN Definition (continued) 3.2.
Controls, LEDs, and Connectors Table 3-6 USB Flash Header Pin Definition (continued) 3.2.7 PIN PIN Name PIN PIN Name 7 GND 8 GND 9 KEY 10 NC USB Header (P12) Table 3-7 USB Header Pin Definition 3.2.
Controls, LEDs, and Connectors 3.2.9 GPIO Header (P4) Table 3-9 GPIO Header Pin Definition PIN PIN Name PIN PIN Name 1 GPO0 2 GPI0 3 GPO1 4 GPI1 5 GPO2 6 GPI2 7 GPO3 8 GPI3 9 VCC5DUAL 10 GND 3.2.10 COM Header (P9, P27) Table 3-10 COM3, COM6 Header Pin Definition PIN PIN Name PIN PIN Name 1 DCD 2 RXD 3 TXD 4 DTR 5 GND 6 DSR 7 RTS 8 CTS 9 RING 10 KEY 3.2.
Controls, LEDs, and Connectors Table 3-11 RS-232/422/485 Header Pin Definition (continued) PIN PIN Name 2 RS422TX_P 3 RS422RX_485DAT_P 4 RS422RX_485DAT_N 5 GND Table 3-12 RS-232/422/485 Jumper Selection (P28) PIN PIN Name 1-2 short RS-232 2-3 short RS422/RS-485 3.2.
Controls, LEDs, and Connectors Table 3-14 COM4, COM5 Pin9 Selection (continued) PIN PIN Name P19 2-3 short COM4 Pin9 is 12V P20 2-3 short P21 1-2 short COM5 Pin9 is Ring P21 2-3 short COM5 Pin9 is 5V P22 1-2 short P21 2-3 short COM5 Pin9 is 12V P22 2-3 short 3.2.
Controls, LEDs, and Connectors 3.2.14 LPT Header (P11) Table 3-16 LPT Header Pin Definition PIN PIN Name PIN PIN Name 1 STB# 2 PD0 3 PD1 4 PD2 5 PD3 6 PD4 7 PD5 8 PD6 9 PD7 10 ACK# 11 BUSY# 12 PE# 13 SLCT# 14 AFD# 15 ERR# 16 INIT# 17 SLIN# 18 GND 19 GND 20 GND 21 GND 22 GND 23 GND 24 GND 25 GND 26 KEY 3.2.
Controls, LEDs, and Connectors Table 3-17 Front Panel Header Pin Definition (continued) PIN PIN Name PIN PIN Name 9 STANDBY LED PWR 10 STANDBY LED 3.2.16 BIOS Program Header (P16) Table 3-18 BIOS Program Header Pin Definition PIN PIN Name PIN PIN Name 1 VCC3V3DUAL 2 GND 3 SPI_CS0# 4 SPI_CLK 5 SPI_MISO 6 SPI_MOSI 7 NC 8 NC 3.2.
Controls, LEDs, and Connectors 3.2.18 MINI PCIE LED (P14) Table 3-20 MINI PCIE Wireless LAN LED Header Pin Definition PIN PIN Name 1 VCC3V3 2 WWAN_LED# 3 WLAN_LED# 4 GND 3.2.
Chapter 4 Functional Description 4.1 Block Diagram Figure 4-1 provides an overview of the main functional blocks of the motherboard and how they are interconnected.
Functional Description 4.2 Pineview-D Processor The MITX-430/MITX-440-DVI-2E is designed to support the Pineview-D processor. The processor features are as follows: 4.3 z Single chip integrated processor, memory controller, graphic controller with small size of 22mm x 22mm. z Manufactured on 45nm process. z 2 x 512KB L2 cache for D510 dual-core processor, 1 x 512KB L2 cache for D410 single-core processor, 32KB instruction cache, and 24KB data cache.
Functional Description z EMC2103-2-AP CPU thermal sensor z 9LPR501SGLFT CLK GEN z Memory slot z XDP header Figure 4-2 shows the SMBus device connection diagram.
Functional Description I2C device address is given in the table below: Table 4-1 I2C Device Address 4.4 Device CK505* SPD0 SPD1 EMC2103* PCA9557 82574L W83627UHG Address D2 A0 A2 5C 30 C2 5A System Memory The Pineview-D integrates a single channel 64bit non ECC DDR2 controller. There are two 200pin SO-DIMM slots on MITX-430/MITX-440-DVI-2E, and supports up to 4GB (assuming 2Gb density device technology) DDR2 memory at data transfer rate of 667MT/s. 4.
Functional Description Table 4-2 PCI-E Port (continued) Port Configuration 4 Unused 5 Unused 6 Used as GLCI The PCIE supports 2.5G transmission rate. Figure 4-3 shows the PCI-E connection diagram. Figure 4-3 4.7 PCI-E Connection USB Interface The ICH8-M supports 10 USB2.0 interface using UHCI or EHCI. Four USB ports are routed to USB+RJ45 connectors. Two USB ports are routed to USB headers, two for USB flash disk, and one for ELO Touch Screen Module. One is routed to Mini PCIE slot.
Functional Description Figure 4-4 shows the routing diagram. Figure 4-4 4.8 USB Ports Connection VGA, LVDS, LPC, and Audio Interface A separate VGA and LVDS display interface is connected to connector from CPU. The VGA supports resolution of 2048x1536 at 60Hz. The LVDS is a single channel with 18bit color definition, and supports resolution up to 1366 x 768. The LPC is routed to super IO and TPM connector. ICH8-M supports a high definition audio interface and ALC888GR is used as the audio codec.
Functional Description 4.9 DVI Interface The DVI is switched and derived from LVDS, so DVI and LVDS cannot be used at the same time. For display combination, use VGA + LVDS or VGA + DVI. Select the combination in the BIOS. 4.10 BIOS Device A 4MB SPI Flash is used as BIOS device. 4.11 IDE The MITX-430/MITX-440-DVI-2E supports a 44pin Mini-IDE header on board. The IDE interface supports up to two IDE devices providing an interface for IDE hard disks and ATAPI devices.
Functional Description 4.12.2 ICH8-M GPIO Table 4-3 describes the ICH8-M GPIO definition. Table 4-3 ICH8-M GPIO Definition Name Type Tolerance Power Well Default Signal Description Implementation GPIO0 I/O 3.3V Core GPI Multiplexed with Unused, PU VCC3V3 BM_BUSY# GPIO1 I/O 3.
Functional Description Table 4-3 ICH8-M GPIO Definition (continued) Name Type Tolerance Power Well Default GPIO12 I/O 3.3V Resume Native Signal Description Implementation Natively used as Used as LAN_DISABLE# signal, output low active GLAN_DOCK# GPIO13 I/O 3.3V Resume Native Natively used as ENERGY_DETECT GPIO14 I/O 3.3V Resume GPI Multiplexed with AC_PRESENT GPIO15 I/O 3.
Functional Description Table 4-3 ICH8-M GPIO Definition (continued) Name Type Tolerance Power Well Default Signal Description Implementation GPIO24 I/O 3.3V Resume GPO Multiplexed with MEM_LED Unused, connect to a TP This GPIO is not Used as STP_CPU# GPIO25 I/O 3.3V Resume Native Desktop only implemented and is used instead as STP_CPU# GPIO26 I/O 3.3V Resume Native Multiplexed with S4_STATE# Unused, PD GND GPIO27 I/O 3.
Functional Description Table 4-3 ICH8-M GPIO Definition (continued) Name Type Tolerance Power Well Default Signal Description Implementation GPIO36 I/O 3.3V Core GPI Multiplexed with SATA2GP Unused, PD GND GPIO37 I/O 3.3V Core GPI Mobile:Unmultiple xed. Unused, PD GND GPIO38 I/O 3.3V Core GPI Multiplexed with SLOAD Unused, PU VCC3V3 GPIO39 I/O 3.3V Core GPI Multiplexed with SDATAOUT0 Unused, PU VCC3V3 GPIO40 I/O 3.
Functional Description Table 4-3 ICH8-M GPIO Definition (continued) 4.13 Name Type Tolerance Power Well Default Signal Description Implementation GPIO52 I/O 5.5V Core Native Multiplexed with REQ2# Unused, PU VCC3V3 GPIO53 I/O 3.3V Core Native Multiplexed with GNT2# Used as a strap pin GPIO54 I/O 5.5V Core Native Multiplexed with REQ3# Unused, PU VCC3V3 GPIO55 I/O 3.
Functional Description 4.14 Clock Generator The MITX-430/MITX-440-DVI-2E contains a CK505 clock generator (ICS9LPR501) to provide the clocks for various components. 4.15 Video The graphic core is integrated in Pineview-D processor. The GPU contains a refresh of 3rd generation graphics core, and improved GFX engine. The GPU is a unified graphics driver which does end to end decode. z Supports Directx* 9 compliant Pixel Shader* 2.0. z Two display ports: LVDS and RGB.
Functional Description 4.17 Super I/O MITX-430/MITX-440-DVI-2E uses Winbond W83627UHG-LF as Super I/O. z 4.18 4.19 Serial Port MITX-430/MITX-440-DVI-2E supports six serial ports: — Two to DSUB-9 in rear I/O region — One RS-232/422/485 port — Two power COM — One to 2x5Pin header z Parallel Port MITX-430/MITX-440-DVI-2E supports the parallel port integrated on board. z PS/2 MITX-430/MITX-440-DVI-2E supports the PS/2 keyboard or mouse integrated on board.
Functional Description The SPI flash part type is AT25DF321A-SH-T from Atmel. The AT25DF321A-SH-T supports SPI, and a high performance dual output SPI using four pins: serial clock, chipset select, serial data I/O, and serial data out. SPI clock frequencies of up to 33MHz are supported. 4.20 Watchdog Timer MITX-430/MITX-440-DVI-2E implements the watchdog timer feature. The SIO chipset is used to implement the watchdog function that supports 1-255s or 1-255m watchdog. 4.
Functional Description The RTC also supports two lockable memory ranges. By setting bits in the configuration space, two 8-byte ranges can be locked to read and write accesses. This prevents unauthorized reading of passwords or other system security information. The RTC also supports a data alarm that allows for scheduling a wakeup event up to 30 days in advance, rather than just 24 hours in advance.
Chapter 5 Operation 5.1 POST After power up or reset, the BIOS performs a self-test, POST, that attempts to determine if further operation is possible and that the detected configuration is expected. This process either completes normally or results in a warning or an error. The boot process does not stop after a warning but displays a message on the primary display device.
Operation 5.4 Setup Utility The BIOS incorporates a setup utility that allows you to alter a variety of system options. This section describes the operation of the utility by describing the various options available through a set of hierarchical menus. Not all options are available with all products and some depend on BIOS customizations. The current settings are stored in the SPI FLASH NVRAM area and any changes can be copied back to this area via the Exit menu.
Operation Table 5-2 Main Menu (continued) Field Description Project Version Project name and its version. Build Date BIOS build date. System Language System setup language. Only English is available. System Date Set the time and date in month/day/year format. To change these values, go to each field and enter the desired value. Press the tab key to move from hour to minute to second, or from month to day to year. There is no default value. System Time 5.4.
Operation Table 5-4 Advanced Menu (continued) Field Description EMC2103 H/W Monitor Monitor hardware status, see Table 5-12 on page 81. Super IO Configuration System super IO chip parameters, see Table 5-13 on page 81. W83627UHG H/W Monitor Monitor hardware status, see Table 5-22 on page 86. Serial Port Console Redirection Serial Port Console Redirection, see Table 5-23 on page 86.
Operation Table 5-6 Trusted Computing (continued) Field Description No TPM Hardware If no TPM is found. TPM Enabled Status Show TPM status, Enabled or Disabled TPM Active Status Show current state of the TPM, Activated or Deactivated. TPM Owner Status Show current TPM Ownership state, Owned or UnOwned. Table 5-7 S5 RTC Wake Setting Field Description Wake system with Fixed time Enable or disable system wake on alarm event. When enabled, system wakes on the specified hr::min::sec.
Operation Table 5-8 CPU Configuration (continued) Field Description Ratio Status Ratio Status Actual Ratio Actual ratio Processor Stepping Processor stepping Microcode Revision Microcode revision L1 Cache RAM L1 Cache RAM L2 Cache RAM L2 Cache RAM Processor Core Processor Core Hyper-Threading Enabled for Windows XP and Linux (OS optimized for Hyper-Threading Technology) and Disabled for other OS (OS not optimized for HyperThreading Technology). Default value is Enabled.
Operation Table 5-9 IDE Configuration (continued) Field Configure SATA as Description Enhanced: you can select the IDE, AHCI mode. Compatible: you can select the legacy IDE Channels as SATA Only, SATA Pri, PATA Sec, PATA only. Table 5-10 IGD-LCD Control Field Description DVMT Mode Select Select DVMT Mode or Fixed Mode. Default value is DVMT Mode.
Operation Table 5-10 IGD-LCD Control (continued) Field Description LCD Mode Set LCD Mode as PWM Mode or DC Mode. Default value is PWM Mode. Table 5-11 USB Configuration Field Description USB Devices List of the USB devices attached. Legacy USB Support Enables Legacy USB support. AUTO option disables legacy support if no USB devices are connected. DISABLE option keeps USB devices available only for EFI applications. Default value is Enabled.
Operation Table 5-12 EMC2103 H/W Monitor Field Description CPU Temperature CPU temperature. CPU Fan Speed CPU fan speed. CPU Fan Duty Cycle CPU fan duty cycle. Automatic Fan Control Enable or disable the CPU fan speed control. Default value is Enabled. Table 5-13 Super IO Configuration Field Description Super IO Chip Winbond W83627UHG. Serial Port 1 Configuration Set Parameters of COM1, see Table 5-14 on page 82.
Operation Table 5-14 Serial Port 1 Configuration Field Description Serial Port Enable or disable serial port. Default value is Enabled. Change Settings Select an optimal settings for super IO device. The options are: z Auto z IO=3F8h; IRQ=4 z IO=3F8h; IRQ=3,4,5,6,7,10,11,12 z IO=2F8h; IRQ=3,4,5,6,7,10,11,12 z IO=3E8h; IRQ=3,4,5,6,7,10,11,12 z IO=2E8h; IRQ=3,4,5,6,7,10,11,12 Default value is Auto.
Operation Table 5-16 Serial Port 3 Configuration Field Description Serial Port Enable or disable serial port. Default value is Enabled. Change Settings Select an optimal settings for super IO device. z Auto z IO=3E8h; IRQ=7 z IO=3F8h; IRQ=7,10,11,12 z IO=2F8h; IRQ=7,10,11,12 z IO=3E8h; IRQ=7,10,11,12 z IO=2E8h; IRQ=7,10,11,12 z IO=2E0h; IRQ=7,10,11,12 z IO=2F0h; IRQ=7,10,11,12 Default value is Auto.
Operation Table 5-18 Serial Port 5 Configuration Field Description Serial Port Enable or disable serial port. Default value is Enabled. Change Settings Select an optimal settings for super IO device. The options are: z Auto z IO=2E0h; IRQ=10 z IO=3F8h; IRQ=7,10,11,12 z IO=2F8h; IRQ=7,10,11,12 z IO=3E8h; IRQ=7,10,11,12 z IO=2E8h; IRQ=7,10,11,12 z IO=2E0h; IRQ=7,10,11,12 z IO=2F0h; IRQ=7,10,11,12 Default value is Auto.
Operation Table 5-20 Parallel Port Configuration Field Description Parallel Port Enable or disable parallel port (LPT/LPTE). Default value is Enabled. Change Settings Select an optimal settings for super IO device. The options are: z Auto z IO=378h; IRQ=5 z IO=378h; IRQ=5,6,7,10,11,12 z IO=278h; IRQ=5,6,7,10,11,12 z IO=3BCh; IRQ=5,6,7,10,11,12 z IO=378h z IO=278h z IO=3BCh Default value is Auto. Device Mode Change the Printer Port mode.
Operation Table 5-22 W83627UHG H/W Monitor Field Description System temperature Shows system temperature. System Fan Speed Shows system fan speed. CPU_VCORE Monitors the CPU VCORE voltage. 1.05V Monitors the VCC 1.05V. 3.3V Monitors the VCC 3V. 5V Monitors the VCC 5V. 12V Monitors the VCC 12V. Automatic Fan Control Enable or disable the system fan speed control. Default value is Enabled.
Operation Table 5-23 Serial Port Console Redirection (continued) Field Description Serial Port for Out-of-Band Management/Windows Emergency Management Services (EMS): Out-of-Band Mgmt Port Microsoft Windows Emergency Management Services (EMS) allows for remote management of Windows Server OS through a serial port. The options are COM1 and COM2.
Operation Table 5-24 COM1 and COM2 Console Redirection Settings (continued) Field Description Bits per second Selects serial port transmission speed. The speed must be matched on the other side. Long or noisy lines may require lower speeds. z 9600 z 19200 z 57600 z 115200 Default value is 115200. Data Bits Data bits of 7 and 8. Default is 8. Parity Parity bit is sent with the data bits to detect some transmission errors. Even: parity bit is 0, if the number of 1s in the data bits is even.
Operation 5.4.3 Chipset Menu Table 5-25 Chipset Menu Field Description Host Bridge Host Bridge Parameters, see Table 5-26 on page 89. South Bridge South Bridge Parameters, see Table 5-27 on page 89. Table 5-26 Host Bridge Field Description Initiate Graphic Adapter Select which graphics controller to use as the primary boot device. The options are IGD and PEG. Default value is IGD. Memory Information Memory Frequency Show memory frequency information.
Operation Table 5-27 South Bridge (continued) Field Description PCI Express Port 1 Enable or disable PCI Express Root Port1. The options are: z Auto z Enabled z Disabled Default value is Auto. 82574L LAN Controller Enable or disable on board WG82574L chip. Default value is Enabled. Note that this is only for MITX-440-DVI-2E. Restore AC Power Loss Select AC power state when power is re-applied after a power failure.
Operation Table 5-28 Boot Menu (continued) Field Description Option ROM Messages Set display mode for Option ROM. The options are Force BIOS and Keep Current. Default value is Force BIOS. 5.4.5 Boot Option Priorities Sets the system boot order. Hard Drive Boot Order Set the order of the legacy devices in this group. Security Menu Table 5-29 Security Menu 5.4.6 Field Description Administrator Password Set Setup Administrator Password. User Password Set Setup User Password.
Operation Table 5-30 Save & Exit Menu (continued) Field Description Save as User Defaults Save the changes done so far as user defaults. Restore User Defaults Restore the user defaults to all the setup options. Boot Override Overrides the boot orders in Boot menu. So you can select the device which you want to boot. 5.5 POST Codes 5.5.1 Status Code Ranges Table 5-31 Status Code Ranges 92 Status Code Range Description 0x01 - 0x0F SEC Status Codes & Errors.
Operation 5.5.2 Standard Status Codes 5.5.2.1 SEC Status Codes Table 5-32 SEC Status Codes Status Code Description 0x0 Unused. Progress Codes 0x1 Power on. Reset type detection (soft/hard). 0x2 AP initialization before microcode loading. 0x3 North Bridge initialization before microcode loading. 0x4 South Bridge initialization before microcode loading. 0x5 OEM initialization before microcode loading. 0x6 Microcode loading. 0x7 AP initialization after microcode loading.
Operation 5.5.2.2 PEI Status Codes Table 5-33 PEI Status Codes Status Code Description Progress Codes 94 0x10 PEI Core is started. 0x11 Pre-memory CPU initialization is started. 0x12 CPU pre-memory initialization (CPU module specific). 0x13 CPU pre-memory initialization (CPU module specific). 0x14 CPU pre-memory initialization (CPU module specific). 0x15 Pre-memory North Bridge initialization is started. 0x16 Pre-memory North Bridge initialization (North Bridge module specific).
Operation Table 5-33 PEI Status Codes (continued) Status Code Description 0x30 Reserved for ASL, see Table 5-38 on page 102. 0x31 Memory Installed. 0x32 CPU post-memory initialization is started. 0x33 CPU post-memory initialization. Cache initialization. 0x34 CPU post-memory initialization. Application Processor(s) (AP) initialization. 0x35 CPU post-memory initialization. Boot Strap Processor (BSP) selection. 0x36 CPU post-memory initialization. System Management Mode (SMM) initialization.
Operation Table 5-33 PEI Status Codes (continued) Status Code Description 0x53 Memory initialization error. No usable memory detected. 0x54 Unspecified memory initialization error. 0x55 Memory not installed. 0x56 Invalid CPU type or Speed. 0x57 CPU mismatch. 0x58 CPU self test failed or possible CPU cache error. 0x59 CPU micro-code is not found or micro-code update has failed. 0x5A Internal CPU error. 0x5B Reset PPI is not available. 0x5C-0x5F Reserved for future AMI error codes.
Operation Table 5-33 PEI Status Codes (continued) Status Code Description 0xF3 Recovery firmware image found. 0xF4 Recovery firmware image loaded. 0xF5 - 0xF7 Reserved for future AMI progress codes. Recovery Error Codes 5.5.2.3 0xF8 Recovery PPI is not available. 0xF9 Recovery capsule is not found. 0xFA Invalid recovery capsule. 0xFB - 0xFF Reserved for future AMI error codes. PEI Beep Codes Table 5-34 PEI Beep Codes # of Beeps Description 1 Memory not Installed.
Operation 5.5.2.4 DXE Status Codes Table 5-35 DXE Status Codes 98 Status Code Description 0x60 DXE Core is started. 0x61 NVRAM initialization. 0x62 Installation of the South Bridge Runtime Services. 0x63 CPU DXE initialization is started. 0x64 CPU DXE initialization (CPU module specific). 0x65 CPU DXE initialization (CPU module specific). 0x66 CPU DXE initialization (CPU module specific). 0x67 CPU DXE initialization (CPU module specific). 0x68 PCI host bridge initialization.
Operation Table 5-35 DXE Status Codes (continued) Status Code Description 0x78 ACPI module initialization. 0x79 CSM initialization. 0x7A Reserved for future AMI DXE codes. 0x80 OEM DXE initialization codes. 0x90 Boot Device Selection (BDS) phase is started. 0x91 Driver connecting is started. 0x92 PCI Bus initialization is started. 0x93 PCI Bus hot plug controller initialization. 0x94 PCI Bus enumeration. 0x95 PCI Bus request resources. 0x96 PCI Bus assign resources.
Operation Table 5-35 DXE Status Codes (continued) Status Code Description 0xA8 SCSI enable. 0xA9 Setup verifying password. 0xAA Reserved for ASL. See Table 5-38 on page 102. 0xAB Start of setup. 0xAC Setup input wait. 0xAD Ready to boot event. 0xAE Legacy boot event. 0xAF Exit boot services event. 0xB0 Runtime set virtual address MAP begin. 0xB1 Runtime set virtual address MAP end. 0xB2 Legacy option ROM initialization. 0xB3 System reset. 0xB4 USB hot plug.
Operation Table 5-35 DXE Status Codes (continued) 5.5.2.5 Status Code Description 0xD8 Invalid password. 0xD9 Error loading boot option (LoadImage returned error). 0xDA Boot option failed (StartImage returned error). 0xDB Flash update failed. 0xDC Reset protocol is not available. DXE Beep Codes Table 5-36 DXE Beep Codes 5.5.2.6 # of Beeps Description 4 Some of the architectural protocols are not available. 5 No console output devices are found. 5 No console input devices are found.
Operation Table 5-37 CPU Exception Status Codes (continued) 5.5.2.7 Status Code Description 0x04 Overflow, INT 0 instruction. 0x05 Bound range exceeded. 0x06 Invalid OpCode (undefined OpCode). 0x07 Device not available (no Math Co-Processor). 0x08 Double fault. Any instruction to the CPU that can generate an NMI or Interrupt. 0x09 Co-processor segment overrun. 0x0A Invalid Task Switch Access. 0x0B Segment not present. Occurs after a load segment. 0x0C Stack Segment Fault.
Operation Table 5-38 ASL Status Codes (continued) 5.5.2.8 Status Code Description 0x05 System is entering S5 sleep state. 0x10 System is waking up from the S1 sleep state. 0x20 System is waking up from the S2 sleep state. 0x30 System is waking up from the S3 sleep state. 0x40 System is waking up from the S4 sleep state. 0xAC System has transitioned into ACPI mode. Interrupt controller is in PIC mode. 0xAA System has transitioned into ACPI mode. Interrupt controller is in APIC.
Operation 104 MITX-430/MITX-440-DVI-2E Installation and Use Guide (6806800K37B)
Chapter 6 Operating System and Driver Support 6.1 Supported Operating System The supported Operating Systems are: 6.
Operating System and Driver Support 106 MITX-430/MITX-440-DVI-2E Installation and Use Guide (6806800K37B)
Appendix A A Related Documentation A.1 Emerson Embedded Communications Computing Documents The Emerson Network Power - Embedded Computing publications listed below are referenced in this manual. You can obtain electronic copies of Emerson Network Power - Embedded Computing publications by contacting your local Emerson sales office. For documentation of final released (GA) products, you can also visit the following website: http://www.emersonnetworkpowerembeddedcomputing.
Related Documentation Table A-2 Related Specifications (continued) Organization Document PCI PCI Local Bus Specification Revision 2.3, March 29, 2002 Copyright. http://www.pcisig.com/ PCI Express Card Electromechanical Specification Revision 1.1, March 28, 2005. PCI Express Base Specification Revision 1.1, March 28, 2005. SATA http://www.sata-io.org/ SMBus www.sbs-forum.org USB http://www.usb.org/ 108 High Speed Serialized AT Attachment Revision 1.0a January 7, 2003.
Safety Notes This section provides warnings that precede potentially dangerous procedures throughout this manual. Instructions contained in the warnings must be followed during all phases of operation, service, and repair of this equipment. You should also employ all other safety precautions necessary for the operation of the equipment in your operating environment.
Safety Notes EMC FCC Class B This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules, EN55022. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment.
Safety Notes As soon as you modify the product or change the default configuration you are responsible for complying with all relevant regulatory standards. VCCI This is a Class B product based on the standard of the Voluntary Control Council for Interference by Information Technology Interference (VCCI). If this equipment is used in a domestic environment, radio disturbance can arise. When such trouble occurs, the user is required to take corrective actions.
Safety Notes z Install the system safely. Make sure that cables and cords are out of the way. z Make sure that the set-up is comfortable for users. Product Damage Using wire sizes that are not sufficient for your environment may result in cable damage. Always check with your local building authorities for wire sizing requirements for your environment and make sure that the installation complies with the 1993 National Electric Code (NEC) and other applicable codes.
Safety Notes Personal or System Damage The system is supplied by a SELV ONLY voltage (equipment is Class III nonenergy hazard circuits). This voltage is considered hazardous. Make sure that the external power supply meets the relevant safety standards. Make sure that SELV is separated from hazardous voltages through double or reinforced insulation. Multiple power sources are present. Removing one supply connection does not remove power from the shelf. Service only by qualified service personnel.
Safety Notes Product Damage Improper removal of the product from the packaging can damage the FRU ejector handles at the bottom. Do not tilt the system forward or backward when removing it from the packaging. Operation System Damage During the course of handling, shipping, and assembly, pins, mounting screws, fans and other items can become loose or damaged. Do not operate a damaged shelf, this can cause damage to devices that interact with it.
Safety Notes System Damage or Personal Injury Covers and Panels Failure to operate the system without covering vacant slots voids the manufacturer’s warranty. Do not operate the system with open module slots. For optimal cooling of the system and associated payload and to prevent electric shock, cover all open module slots and put all panels in place before turning on power. Slot covers and panels must remain in place during system operation.
Safety Notes To guarantee proper airflow through the system the air filters have to be replaced at least every six months. Emerson recommends to replace the air filters every 90 days. Filter replacement frequency depends on the environment the system is subjected to. Because central offices vary in physical location and cleanliness, check your air filters every week after you first install your system. In a dusty environment, filter replacement may be required more often than in a cleaner environment.
Safety Notes Personal Injury or Short Circuits Blade or Power Supply In case the ORing diodes of the product fail, the product may trigger a short circuit between input line A and input line B so that line A remains powered even if it is disconnected from the power supply circuit (and vice versa). To avoid damage or injury, always check that there is no more voltage on the line that has been disconnected before continuing your work.
Safety Notes Product Damage Too much force may damage the reset switch. Use minimal force when pressing the reset switch. Grounding Product Damage If the product is not properly grounded, it may be damaged by electrostatic discharge. Make sure that each of the system's parts contact the EMI gasket. The system contains gaskets at the shelf and module level. The shelf is also fitted with ESD contacts. Provide proper ESD protection for the operator.
Safety Notes This equipment is designed to permit the connection of the earthed conductor of the DC supply circuit to the earthing conductor at the equipment. If this connection is made, all of the following conditions must be met: z This equipment shall be connected directly to the DC supply system earthing electrode conductor or to a bonding jumper from an earthing terminal bar or bus to which the DC supply system earthing electrode conductor is connected.
Safety Notes Personal Injury Cables that are not installed securely can cause injuries due to entanglement or tripping. Make sure cables are securely installed. Never change the system’s cabling as delivered by Emerson. The cabling should follow existing cable paths using existing or similar cable fastenings. Check proper function of the system after cabling extensions.
Safety Notes Product Malfunction Connecting more than one serial port may create a conflict and the serial port may not operate correctly. Although serial ports are available at the face plate and DMC, only one should be connected at any given time. PEM System Damage To maintain proper airflow and cooling of the shelf it is essential that all PEMs are installed in the shelf.
Safety Notes Personal Injury Removing power from the PEMs cannot be accomplished by pushing the PEM's breakers to the OFF position. The PEMs remain powered until the -48 VDC power to each PEM is completely removed. Make sure you disconnect the power at the external source and allow the capacitors in the PEM to discharge (1 minute) before removing the PEM from the chassis. Personal Injury (AdvancedTCA) Hot PEMs may cause injury. Allow the PEM to cool before servicing.
Safety Notes Product Damage Improper cabling damages your product. Tie the 48 V power cable to the most positive side. For example, if the power supply is labeled -48 V and RETURN, connect the 48 V power cable to RETURN. If the power supply is labeled +48 V and GND, connect the 48 power cable to +48 V. Personal Injury Hazardous energy levels may be present inside the enclosure.
Safety Notes Fan Damage When a fan tray is taken out of operation, the system manager compensates for the loss by increasing the speed of the remaining fans. Turning on high speed for a long time may shorten the life of the fans. Perform the fan tray replacement without delays. System Damage Removing the single operating fan tray leads to overheating very quickly. Replace the defective fan tray immediately.
Safety Notes Personal Injury Rotating Fans Inserting tools or fingers into operational fans may cause injuries. Keep clear of the fans as long as they are rotating. System Damage The system will be damaged if you replace the cooling unit during system operation. Power down the system to replace a cooling unit. Product Damage The FTM is heavy. Dropping it may damage it. Hold it securely during replacement.
Safety Notes Product Damage Bent pins or loose components can cause damage to the product, the backplane, or other system components. Carefully inspect the product and the backplane for both pin and component integrity before installation. Product Damage Incorrect product installation and removal can result in product damage. When plugging the product in or removing it, do not press on the face plate but use the handles.
Safety Notes System Damage If the system is overloaded it gets damaged. To avoid system overload check the total power consumption of all components installed. Make sure that any individual output current of any component stays within its acceptable limits. For more information, see the technical specification of the respective component. Loss of Safety and EMC Compliance By using additional plug-in products it may be possible that the system is no longer compliant to safety and EMC regulations.
Safety Notes Data Loss (comment: applies to blades with Emerson-IPMC) Removing the RTM with the system power on and the blue LED on the front blade still flashing causes data loss. Before removing the RTM from a powered system, power down the slot and the front blade’s payload by opening the lower handle of the front blade and wait until the blue LED is permanently ON.
Safety Notes Personal Injury Optical SFP/SFP+ modules may be classified as laser products. When installing and using any of these SFP/SFP+ modules, the regulations which correspond to the respective laser class apply to the whole RTM. Not complying to these regulations may lead to personal injury. When installing and using optical SFP/SFP+ modules which are classified as laser products, make sure to comply to the respective regulations.
Safety Notes Data Loss Exchanging the battery always results in data loss of the devices which use the battery as power backup. Back up affected data before exchanging the battery. Data Loss Installing another battery type than the one that is mounted at product delivery may cause data loss since other battery types may be specified for other environments or may have a shorter lifetime. Only use the same type of lithium battery as is already installed.
Safety Notes Environment Environmental Damage Improperly disposing of used products may harm the environment. Always dispose of used products according to your country’s legislation and manufacturer’s instructions.
Safety Notes 132 MITX-430/MITX-440-DVI-2E Installation and Use Guide (6806800K37B)
Sicherheitshinweise Dieses Kapitel enthält Hinweise, die potentiell gefährlichen Prozeduren innerhalb dieses Handbuchs vorrangestellt sind. Beachten Sie unbedingt in allen Phasen des Betriebs, der Wartung und der Reparatur des Systems die Anweisungen, die diesen Hinweisen enthalten sind. Sie sollten außerdem alle anderen Vorsichtsmaßnahmen treffen, die für den Betrieb des Systems innerhalb Ihrer Betriebsumgebung notwendig sind.
Sicherheitshinweise Emerson und unsere Zulieferer unternehmen größte Anstrengungen um sicherzustellen, dass sich Pins und Stecker von Boards vor dem Verlassen der Produktionsstätte in einwandfreiem Zustand befinden. Verbogene Pins, verursacht durch fehlerhafte Installation oder durch Installation von Boards mit beschädigten Steckern kann die durch Emerson gewährte Garantie für Boards und Backplanes erlöschen lassen.
Sicherheitshinweise Wenn dieses Produkt ohne Frontblende ausgeliefert wird oder wenn die Frontblende entfernt wird, muss Ihr System die notwendigenSchutzmechnismen gegen elektromagnetische interferenzen bereitstellen, um die Einhaltung der eletromagnetischen Verträglichkeit des Systems zu gewährleisten. Boardprodukte werden in einem repräsentativen System getestet, um zu zeigen, dass das Board den oben aufgeführten EMC-Richtlinien entspricht.
Sicherheitshinweise Beachten Sie folgende allgemeinen Sicherheitshinweise bei der Installation des Systems: z Bereich mit eingeschränktem Zugang - Installieren Sie das System nur in Bereichen mit eingeschränktem Zugang. z Installationsrichtlinien: Dieses System muss gemäß folgender Richtlinien installiert werden: National Electrical Code, Artikel 11016, 11017 und 11018 und Canadian Electrical Code, Abschnitt 12.
Sicherheitshinweise Beschädigung des Systems Die Gleichspannungseingänge des Systems dürfen ausschließlich an zugelassene Telekommunikationsnetzspannungen (TNV) oder Sicherheits-Kleinspannungs-Stromkreise (SELV) angeschlossen werden. Wenn Sie das System an andere Stromkreise als TNV/SELV Stromkreise anschließen, verfällt die Sicherheitszulassung. Verletzungsgefahr und Beschädigung des Produktes Das Produkt ist an eine TNV-2 Spannungsquelle angeschlossen. Diese Spannung kann gefährlich sein.
Sicherheitshinweise Beschädigung des Produktes Wenn das System nicht ordnungsgemäß installiert wird, kann es herunterfallen. Zur Befestigung des Systemes müssen Sie Ihre eigene Hardware bereitstellen. Emerson empfiehlt ausdrücklich den Einsatz von Schienen um das Gewicht des Chassis zu sichern. Verletzungsgefahr und Beschädigung des Systems Verhindern Sie ein unbeabsichtigtes Herunterfallen des Systems, das Verletzungen oder Beschädigungen am System zur Folge haben kann.
Sicherheitshinweise Um eine ausreichende Lüftung zu gewährleisten, stellen Sie sicher, dass das System während des Betriebs waagerecht steht. Halten Sie die Lüftungsschlitze an der Oberseite, der Rückseite und den Seiten des Systems frei. Halten Sie die Frischluftzufuhröffnung an der unteren Vorderseite des Systems völlig frei und stellen Sie sicher, dass sich die Frischluft nicht mit der Abluft von anderen Systemen mischt.
Sicherheitshinweise Überlasten Sie keine Zweigleitungen. Überprüfen Sie die Dokumentation und/oder die Typenschilder aller Geräte und stellen Sie sicher, dass die Summe aller Stromwerte höchstens zwei Drittel des zugelassenen Werts der Zweigleitung ausmacht. Benutzen Sie Entstörgeräte gegen Über- oder Störspannungen nur, wenn Sie eine genaue Analyse des Spannungssystems durchgeführt haben.
Sicherheitshinweise Beschädigung des Systems Hohe Luftfeuchtigkeit und Kondensat auf den Oberflächen der Produkte kann zu Kurzschlüssen führen. Betreiben Sie die Produkte nur innerhalb der angegebenen Grenzwerte für die relative Luftfeuchtigkeit und Temperatur und stellen Sie vor dem Einschalten des Stroms sicher, dass sich auf den Produkten kein Kondensat befindet.
Sicherheitshinweise Falls die ORing Dioden des Produktes durchbrennen, kann das Produkt einen Kurzschluss zwischen den Eingangsleitungen A und B verursachen. In diesem Fall ist Leitung A immer noch unter Spannung, auch wenn sie vom Versorgungskreislauf getrennt ist (und umgekehrt). Prüfen Sie deshalb immer, ob die Leitung spannungsfrei ist, bevor Sie Ihre Arbeit fortsetzen, um Schäden oder Verletzungen zu vermeiden.
Sicherheitshinweise Beschädigung des Produktes Zu viel Druck kann den Reset Schalter beschädigen. Drücken Sie den Reset Schalter nur leicht. Erdung Beschädigung des Produktes Falls das Produkt nicht ordnungsgemäß geerdet ist, kann es durch elektrostatische Entladungen beschädigt werden. Stellen Sie sicher, dass die Systemteile die EMC-Dichtungen berühren. Das System enthält EMCDichtungen für das Shelf und einzelne Module. Das Shelf enthält außerdem ESD Anschlüsse.
Sicherheitshinweise Verletzung durch Stromschlag (Wechselstromsysteme) Ist das dreiadrige Wechselstromkabel nicht ordentlich angeschlossen, können Sie einen Stromschlag bekommen. Sie müssen das dreiadrige Wechselstromkabel mit einer zugelassen Anschlussdose mit drei Kontakten verbinden. Der Erdleiter (grün/gelb) muss dabei zuverlässig mit elektrischer Erde verbunden sein.
Sicherheitshinweise Beschädigung des Systems Ein versehentliches Entfernen des Netzkabels während des Betriebs kann den Systembetrieb beeinträchtigen oder Schäden am System verursachen. Schließen Sie ein versehentliches Entfernen des Netzkabels während des Betriebs aus, indem Sie es am Chassis oder am Rack befestigen.
Sicherheitshinweise Fehlfunktion des Produktes Falls Sie mehr als eine serielle Schnittstelle gleichzeitig anschließen, könnte das Konflikte hervorrufen und die serielle Schnittstelle könnte nicht mehr richtig funktionieren. Obwohl sowohl an der Frontblende als auch am DMC serielle Schnittstellen zur Verfügung stehen, sollten Sie immer nur eine einzige benutzen.
Sicherheitshinweise Verletzungsgefahr Sie können die PEMs nicht allein dadurch spannungsfrei schalten, dass Sie den Trennungsschalter an den PEMs in die OFF Stellung stellen. Die PEMs bleiben unter Spannung, bis die -48 V Spannung von jedem PEM vollständig entfernt ist. Stellen Sie deshalb sicher, dass Sie die Spannung an der externen Spannungsversorgung ausschalten. Warten Sie außerdem eine Minute, bis die Kondensatoren im PEMs entladen sind, bevor Sie die PEMs aus dem Chassis entfernen.
Sicherheitshinweise Beschädigung des Produktes Fehlerhafte Verkabelung kann das Produkt beschädigen. Verbinden Sie das 48 V Kabel immer mit der "positivsten" Seite. Wenn die Stromversorgungseinheit zum Beispiel -48 V und RETURN Anschlüsse besitzt, schließen Sie das 48 V Kabel an RETURN an. Wenn die Stromversorgungseinheit +48 V und GND-Anschlüsse besitzt, schließen Sie das 48 V Kabel an +48 V. Verletzungsgefahr Innerhalb des Gehäuses gibt es gefährliche Spannungen.
Sicherheitshinweise Beschädigung der Lüfter Wenn ein Lüftermodul außer Betrieb genommen wird, gleicht der System Manager das aus, indem er die Geschwindigkeit der verbleibenden Lüfter erhöht. Wenn ein Lüfter über einen längeren Zeitraum auf Höchstgeschwindigkeit läuft, kann sich seine Lebensdauer verkürzen. Führen Sie den Lüfteraustausch deshalb ohne Verzögerung aus.
Sicherheitshinweise Verletzungsgefahr Rotierende Lüfterschaufeln Sie können verletzt werden, wenn Sie Werkzeuge oder Finger in rotierende Lüfter einführen. Berühren Sie die Lüfterschaufeln erst, wenn diese still stehen. Beschädigung des Systems Das System kann beschädigt werden, wenn Sie die Kühleinheit während des laufenden Betriebs entfernen. Schalten Sie das System ab, bevor Sie die Kühleinheit entfernen. Beschädigung des Produktes Das Lüftermodul ist schwer.
Sicherheitshinweise Beschädigung des Produktes Verbogene Stecker oder lose Teile können das Produkt, die Backplane oder andere Systemkomponenten beschädigen. Prüfen Sie das Produkt und die Backplane vor dem Einabau sorgfältig auf verbogene Stecker und lose Teile. Beschädigung des Produktes Fehlerhafter Ein- und Ausbau des Produktes kann zu einer Beschädigung des Produktes führen. Benutzen Sie die Handles, um das Produkt ein- und auszubauen.
Sicherheitshinweise Verlust der Sicherheits- und EMC-Zulassung Wenn Sie zusätzliche Produkte installieren, können Sicherheits- und EMC-Richtlinien verletzt werden. Der Systemintegrator ist für die Einhaltung dieser Richtlinien verantwortlich. Beschädigung des Systems Ein beschädigter Filter kann Schwebstoffe nur ungenügend ausfiltern und den Luftstrom beeinträchtigen. Prüfen Sie einen gereinigten Filter auf Risse bevor Sie ihn wieder in Betrieb nehmen.
Sicherheitshinweise PMC Module Fehlfunktion des Produktes und/oder Verletzungsgefahr Wenn Sie nichtqualifizierte Module gemeinsam mit dem Blade benutzen, kann dies zu einer Fehlfunktion des Produktes, Sicherheitsrisiken und/oder Verletzungen führen. Sobald Sie zusätzliche Module oder RTMs installieren, sind Sie für die Einhaltung aller relevanten Richtlinien verantwortlich.
Sicherheitshinweise Verletzungsgefahr der Augen Optische SFP/SFP+-Module können Laserstrahlen aussenden, wenn kein Kabel angeschlossen ist. Blicken Sie daher nicht direkt in die Öffnung eines SFP/SFP+-Moduls, um Verletzungen der Augen zu vermeiden. Beschädigung von SFP/SFP+-Modulen Die Schutzkappe eines SFP/SFP+-Modules dient dazu, die sensible Optik des SFP/SFP+Modules gegen Staub und Schmutz zu schützen. Entfernen Sie die Schutzkappe nur dann, wenn Sie beabsichtigen, ein Kabel anzuschließen.
Sicherheitshinweise Datenverlust Wenn Sie einen anderen Batterietyp installieren als der, der bei Auslieferung des Produktes installiert war, kann Datenverlust die Folge sein, da die neu installierte Batterie für andere Umgebungsbedingungen oder eine andere Lebenszeit ausgelegt sein könnte. Verwenden Sie daher den gleichen Batterietyp, der bei Auslieferung des Produktes installiert war.
Sicherheitshinweise Umweltschutz Umweltverschmutzung Falsche Entsorgung der Produkte schadet der Umwelt. Entsorgen Sie alte Produkte gemäß der in Ihrem Land gültigen Gesetzgebung und den Empfehlungen des Herstellers.
Index A I Advanced Menu 75 IDE 63 Initiating Setup 73 Installation Environment 40 B BIOS Device 63 Block Diagram 57 board accessories 27 Board Layout 45 Board Thermal Management 37 Boot Menu 90 Boot Process 73 C Chipset 68 Chipset Menu 89 Clock Generator 69 comments and suggestions 18 Connectors 47 contact address 18 conventions 17 D Debug 71 dimensions 27 Dual core 21 DVI Interface 63 E Environmental Requirements 31 Ethernet Interfaces 60 F Fan 70 feedback 18 functional blocks 57 G GFX engine 69
Index T V Thermal Requirements 32 Trusted Platform Module 24 VGA, LVDS, LPC, and Audio Interface 62 Video 69 U W USB Interface 61 Watchdog Timer 71 weight 27 158 MITX-430/MITX-440-DVI-2E Installation and Use Guide (6806800K37B)
HOW TO REACH LITERATURE AND TECHNICAL SUPPORT: Tempe, Arizona, USA Munich, Germany +49 89 9608 0 For literature, training, and technical assistance and support programs, visit www.emersonnetworkpowerembeddedcomputing.com Emerson Network Power. The global leader in enabling Business-Critical Continuity™ AC Power Systems Connectivity DC Power Systems Embedded Computing Embedded Power Integrated Cabinet Solutions www.emersonnetworkpowerembeddedcomputing.
